Abstract: A hybrid optical source comprises an optical gain chip containing an optical gain material that provides an optical signal, and an optical reflector chip including an optical reflector. It also includes a semiconductor-on-insulator (SOI) chip, which comprises a semiconductor layer having a planarized surface facing the semiconductor reflector. The semiconductor layer includes: an optical coupler to redirect the optical signal to and from the planarized surface; and an optical waveguide to convey the optical signal from the optical coupler. While assembling these chips, a height of the optical gain material is referenced against the planarized surface of the semiconductor layer, a height of the optical reflector is referenced against the planarized surface of the semiconductor layer, and the optical reflector is aligned with the optical coupler, so that the optical signal emanating from the optical gain material is reflected by the optical reflector and into the optical coupler.

Abstract: The present invention relates to a method for preparing an acrylonitrile-butadiene-styrene graft copolymer having improved impact strength, which comprises: a step of preparing diene-based rubber latex by adding an acrylate-based cross-linking agent (Step 1); and a step of inserting the same cross-linking agent with the acrylate-based cross-linking agent, an aromatic vinyl-based compound and a vinyl cyan-based compound to the diene-based rubber latex and then subjecting thereof to graft copolymerization (Step 2), an acrylonitrile-butadiene-styrene graft copolymer prepared by the method, and an acrylonitrile-butadiene-styrene thermoplastic resin comprising the same.

Abstract: The present invention relates to a method for preparing large-sized diene-based rubber latex, and an acrylonitrile-butadiene-styrene graft copolymer comprising the same. More particularly, it relates to a method for preparing large-sized diene-based rubber latex having improved impact strength by controlling content and time of addition of a cross-linking agent and an emulsifier having critical micelle concentration (CMC) of 150 mg/L or less during preparation of the large-sized rubber latex, large-sized diene-based rubber latex prepared therefrom, and an acrylonitrile-butadiene-styrene graft copolymer and thermoplastic resin comprising the same.

Abstract: A system for transferring a profile that is stored at an authentication module includes: a first terminal that includes a first authentication module and that operates based on a user profile that is stored at the first authentication module; a second terminal that includes a second authentication module and that requests the user profile by transmitting a first message including user identification information; and a management server that receives the first terminal and that acquires a profile that is stored at the first terminal based on user identification information and that transmits the acquired profile to the second terminal, wherein the first terminal exports the stored profile, and the second terminal installs a profile, having received from the management server at the second authentication module.

Abstract: A method and apparatus for backing up a profile of in a repository are disclosed. The method of backing up a profile is a method of backing up a profile in a subscriber management server, and includes receiving a backup request for a profile stored in an authentication module from the authentication module, providing information for at least one repository to the authentication module, the information being generated by confirming a state of the at least one repository to back up the profile according to the backup request, and storing the profile in a repository selected by the authentication module based on the information for at least one repository. Therefore, the user can directly select a reliable repository and back up the profile of the authentication module.

Abstract: A multi-chip module (MCM) is described. This MCM includes a driver integrated circuit that includes electrical circuits, a photonic chip, an interposer, and an optical gain chip. The photonic chip may be implemented using a silicon-on-insulator technology, and may include an optical waveguide that conveys an optical signal and traces that are electrically coupled to the driver integrated circuit. Moreover, the interposer may be electrically coupled to the traces. Furthermore, the optical gain chip may include a III/V compound semiconductor (and, more generally, a semiconductor other than silicon), and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Additionally, the optical gain chip may be electrically coupled to the interposer.

Abstract: A method for configuring a profile of a subscriber authenticating module embedded and installed in a terminal device, and an apparatus using same, are disclosed. The subscriber authenticating module embedded and installed in the terminal device according to an exemplary embodiment includes one or more network access application related data sets and one or more profiles having unique identifiers. The present invention enables an eco-system provider such as a network service provider, a eUICC manufacturer, or a terminal manufacturer to develop an efficient and rapid eUICC and provide a eUICC service.

Abstract: A multi-chip module (MCM) includes: an interposer, a photonic chip, an optical gain chip, and a waveguide-fiber connector. The photonic chip, which may be electrically coupled to the interposer, may be implemented using a silicon-on-insulator (SOI) technology, and may include an optical waveguide that conveys an optical signal. Moreover, the optical gain chip, which may be electrically coupled to the interposer, may include a III-V compound semiconductor, and may include a second optical waveguide that conveys the optical signal and that is vertically aligned with the optical waveguide relative to a top surface of the interposer. Furthermore, the waveguide-fiber connector may be mechanically coupled to the interposer, and remateably mechanically coupled to an optical fiber coupler that includes the optical fiber. The waveguide-fiber connector may convey the optical signal between the optical waveguide in the photonic chip and the optical fiber.

Abstract: A method and apparatus for backing up a profile of in a repository are disclosed. The method of backing up a profile is a method of backing up a profile in a subscriber management server, and includes receiving a backup request for a profile stored in an authentication module from the authentication module, providing information for at least one repository to the authentication module, the information being generated by confirming a state of the at least one repository to back up the profile according to the backup request, and storing the profile in a repository selected by the authentication module based on the information for at least one repository. Therefore, the user can directly select a reliable repository and back up the profile of the authentication module.

Abstract: Provided is an organic thin film forming apparatus, an organic thin film forming method, and a method of manufacturing an organic thin film device using the same, in which an organic light-emitting layer (photoactive layer) and/or an electron transport layer can be formed on a substrate when an organic light emitting diode (OLED) or an organic solar cell is manufactured. The organic thin film forming apparatus includes: a solution spray unit for spraying a solution on a substrate; and a hot gas spray unit for spraying a hot gas onto fine liquid droplets that have been sprayed from the solution spray unit and that are in flight, to thereby evaporate a solvent contained in the fine liquid droplets.

Abstract: An optical source includes a semiconductor optical amplifier that provides an optical signal, and a photonic chip with first and second ring resonators that operate as Vernier rings. When the optical source is operated below a lasing threshold, one or more thermal-tuning mechanisms, which may be thermally coupled to the first ring resonator and/or the second ring resonator, may be adjusted to align resonances of the first ring resonator and the second ring resonator based on measured optical power on a shared optical waveguide that is optically coupled to the first and second ring resonators. Then, when the optical source is operated above the lasing threshold, a common thermal-tuning mechanism may be adjusted to lock the aligned resonances with an optical cavity mode of the optical source based on a measured optical power on an optical waveguide that is optically coupled to the first ring resonator.

Abstract: There is provided a method of providing a subscriber profile of an embedded universal circuit card (eUICC) that is performed in a terminal equipped with the eUICC. The method includes determining whether the terminal having a first subscriber profile stored therein has left a first mobile network operator (MNO) area corresponding the first subscriber profile, and when it is determined that the terminal has left the first mobile network operator area and moved into a second mobile network operator area, receiving a second subscriber profile corresponding to a second mobile network operator from a predetermined subscriber management server. In this way, it is possible to support mobile communication service by changing the mobile network operator even in the eUICC environment.

Abstract: A standard-CMOS-process-compatible optical mode converter transitions an optical mode size using a series of adjacent regions having different optical mode sizes. In particular, in a partial-slab-mode region, which is adjacent to an initial rib-optical-waveguide-mode region, a width of a slab portion of the rib-type optical waveguide decreases and a width of a rib portion of the rib-type optical waveguide decreases to a first minimum tip size. Then, in a slab-mode region, which is adjacent to the partial-slab-mode region, the width of the slab portion decreases to a second minimum tip size. In addition, a dielectric layer is disposed over the slab portion, the rib portion and the BOX layer in the partial-slab-mode region, the slab portion and the BOX layer in the slab-mode region, and the BOX layer in a released-mode region that is adjacent to the slab-mode region and that does not include the semiconductor layer.

Abstract: A standard-CMOS-process-compatible optical mode converter transitions an optical mode size using a series of adjacent regions having different optical mode sizes. In particular, in a partial-slab-mode region, which is adjacent to an initial rib-optical-waveguide-mode region, a width of a slab portion of the rib-type optical waveguide decreases and a width of a rib portion of the rib-type optical waveguide decreases to a first minimum tip size. Then, in a slab-mode region, which is adjacent to the partial-slab-mode region, the width of the slab portion decreases to a second minimum tip size. In addition, a dielectric layer is disposed over the slab portion, the rib portion and the BOX layer in the partial-slab-mode region, the slab portion and the BOX layer in the slab-mode region, and the BOX layer in a released-mode region that is adjacent to the slab-mode region and that does not include the semiconductor layer.

Abstract: A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip.

Abstract: A fabrication technique for cleaving a substrate in an integrated circuit is described. During this fabrication technique, a trench is defined on a back side of a substrate. For example, the trench may be defined using photoresist and/or a mask pattern on the back side of the substrate. The trench may extend from the back side to a depth less than a thickness of the substrate. Moreover, a buried-oxide layer and a semiconductor layer may be disposed on a front side of the substrate. In particular, the substrate may be included in a silicon-on-insulator technology. By applying a force proximate to the trench, the substrate may be cleaved to define a surface, such as an optical facet. This surface may have high optical quality and may extend across the substrate, the buried-oxide layer and the semiconductor layer.

Abstract: The present invention relates to a method for forming a trust relationship among an MNO, an SM, and an eUICC in a communication system in which the SM is defined as an entity for managing the eUICC, as well as to an embedded UICC therefor.

Abstract: A fabrication technique for cleaving a substrate in an integrated circuit is described. During this fabrication technique, a trench is defined on a back side of a substrate. For example, the trench may be defined using photoresist and/or a mask pattern on the back side of the substrate. The trench may extend from the back side to a depth less than a thickness of the substrate. Moreover, a buried-oxide layer and a semiconductor layer may be disposed on a front side of the substrate. In particular, the substrate may be included in a silicon-on-insulator technology. By applying a force proximate to the trench, the substrate may be cleaved to define a surface, such as an optical facet. This surface may have high optical quality and may extend across the substrate, the buried-oxide layer and the semiconductor layer.

Abstract: A multi-chip module (MCM) is described. This MCM includes two substrates that are passively self-assembled on another substrate using hydrophilic and hydrophobic materials on facing surfaces of the substrates and liquid surface tension as the restoring force. In particular, regions with a hydrophilic material on the two substrates overlap regions with the hydrophilic material on the other substrate. These regions on the other substrate may be surrounded by a region with a hydrophobic material. In addition, spacers on a surface of at least one of the two substrates may align optical waveguides disposed on the two substrates, so that the optical waveguides are coplanar. This fabrication technique may allow low-loss hybrid optical sources to be fabricated by edge coupling the two substrates. For example, a first of the two substrates may be a III/V compound semiconductor and a second of the two substrates may be a silicon-on-insulator photonic chip.

Abstract: Disclosed are a method for selecting a specific provisioning profile from among a plurality of provisioning profiles and an apparatus using same. In a terminal to which an embedded UICC (eUICC) is mounted, the eUICC includes at least one provisioning profile wherein each of the one or more provisioning profile enables a user terminal to communicate with a subscriber management entity supporting at least one network provider. Accordingly, a specific provisioning profile can be selected from among the one or more provisioning profiles, and a network can be connected with a specific mobile communication provider using the selected provisioning profile.