Patents by Inventor Jin-hyoung Lee

Jin-hyoung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11295994
    Abstract: A system may include a wafer that includes ICs and defines cavities. Each cavity may be formed in a BEOL layer of the wafer and proximate a different IC. The system may also include an interposer that includes a transparent layer configured to permit optical signals to pass through. The interposer may also include at least one waveguide located proximate the transparent layer. The at least one waveguide may be configured to adiabatically couple at least one optical signal out of the multiple ICs. Further, the interposer may include a redirecting element optically coupled to the at least one the waveguide. The redirecting element may be located proximate the transparent layer and may be configured to receive the at least one optical signal from the at least one waveguide. The redirecting element may also be configured to vertically redirect the at least one optical signal towards the transparent layer.
    Type: Grant
    Filed: July 19, 2019
    Date of Patent: April 5, 2022
    Assignee: II-VI DELAWARE, INC.
    Inventors: Shiyun Lin, Daniel Mahgerefteh, Bryan Park, Jin-Hyoung Lee
  • Publication number: 20220095486
    Abstract: A method of manufacturing a heat dissipation sheet including preparing a preliminary sheet including a matrix-forming component, a crosslinking agent, and a heat dissipation filler, and crosslinking the matrix-forming component included in the preliminary sheet and thus obtaining a heat dissipation sheet. The heat dissipation sheet manufactured has remarkably excellent heat dissipation properties because it contains a high content of heat dissipation filler. Due to the material properties of the matrix-forming component and the crosslinking of the matrix-forming component and the resulting matrix formation, the occurrence of cracking, shrinkage, pore formation, thickness change, and the like is minimized or prevented, and excellent flexibility can be attained. Moreover, since processability is improved through processes such as cooling when manufacturing the heat dissipation sheet, productivity is excellent, and the sheet can be suitable for mass production.
    Type: Application
    Filed: January 3, 2020
    Publication date: March 24, 2022
    Applicant: AMOGREENTECH CO., LTD.
    Inventors: Seung Jae HWANG, Jin Hyoung LEE
  • Patent number: 11261277
    Abstract: Provided are a method of preparing a graft copolymer, a graft copolymer, and a thermoplastic resin molded article. The method of preparing a graft copolymer includes 1) adding a conjugated diene-based monomer and performing polymerization to prepare a conjugated diene-based polymer; and 2) adding the conjugated diene-based polymer, an aromatic vinyl monomer, and a vinyl cyan monomer and performing polymerization to prepare a graft copolymer, wherein an emulsifier having an APHA color value of 50 or less and a critical micelle concentration of 1 to 50 g/l is added, so that excellent polymerization stability, colorability, light resistance, and surface clarity are exhibited.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: March 1, 2022
    Assignee: LG CHEM, LTD.
    Inventors: Yoo Vin Kim, Young Min Kim, Jin Hyoung Lee, Su Jeong Han, Young Hwan Jeong, Jae Min Suk, Jae Won Heo
  • Patent number: 11243351
    Abstract: A photonic system may include a PIC and an interposer. The PIC may include a first SiN waveguide. The interposer may include second and third SiN waveguides substantially vertically aligned with the first SiN waveguide in an overlap region of a first waveguide stack that may include the first, second, and third waveguides in the first waveguide stack. Within the overlap region, the second SiN waveguide may include vertical tapering that increases a thickness of the second SiN waveguide from an initial thickness to an increased thickness toward the first SiN waveguide. The first waveguide stack may further include a non-overlap region in which the interposer does not overlap the PIC. The non-overlap region may include the second and third SiN waveguides. Within the non-overlap region, the second SiN waveguide may maintain the increased thickness and the second and third SiN waveguides may include a first lateral bend.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: February 8, 2022
    Assignee: II-VI DELAWARE, INC.
    Inventor: Jin-Hyoung Lee
  • Patent number: 11156789
    Abstract: An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.
    Type: Grant
    Filed: May 26, 2020
    Date of Patent: October 26, 2021
    Assignee: II-VI DELAWARE, INC.
    Inventors: Daniel Mahgerefteh, Jin-Hyoung Lee, Shiyun Lin
  • Patent number: 11118060
    Abstract: Disclosed is a composite white pigment having mixed together white pigments having different colorimeter values from each other by comprising substrates having various sizes and/or TiO2 having various thicknesses. The composite white pigment, according to the present invention, comprises: a first white pigment comprising a substrate and a white metal oxide layer formed on the substrate; and a second white pigment comprising a substrate and a white metal oxide layer formed on the substrate, and having a different colorimeter value from that of the first white pigment.
    Type: Grant
    Filed: March 27, 2018
    Date of Patent: September 14, 2021
    Assignee: CQV CO., LTD.
    Inventors: Jin-Hyoung Lee, Kwang-Choong Kang, Byung-Ki Choi, Kwang-Soo Lim, Kil-Wan Chang
  • Publication number: 20210230334
    Abstract: A method of preparing a graft copolymer includes a step of performing coagulation by adding an acid coagulant to 100 parts by weight (based on solids) of graft copolymer latex prepared by graft-polymerizing an aromatic vinyl compound and a vinyl cyanide compound onto conjugated diene rubber latex; and a step of performing coagulation once more by adding a salt coagulant thereto. In a resulting graft copolymer, coagulation efficiency may be improved and the gloss of the prepared graft copolymer may be increased. In addition, since a b-value measured using a Hunter lab colorimeter and a b-value measured after being left at 250° C. for 15 minutes are low, the graft copolymer may have excellent color characteristics. In addition, since heating loss is low and scorch time is long, the graft copolymer may have excellent processing characteristics.
    Type: Application
    Filed: October 21, 2019
    Publication date: July 29, 2021
    Inventors: Jae Min SUK, Yoo Vin KIM, Young Min KIM, Jin Hyoung LEE, Sujeong HAN, Young Hwan JEONG, Changhong PARK, Jaewon HEO
  • Publication number: 20210221935
    Abstract: The present invention relates to a method for preparing a conjugated diene-based polymer, which includes a step of preparing a conjugated diene-based polymer by initiating and carrying out polymerization while continuously adding conjugated diene-based monomers to a reactor, and in which an emulsifier is dividedly added before the initiation of the polymerization and when a polymerization conversion rate of 31% to 80% is reached. More particularly, the present invention relates to: a method for preparing a conjugated diene-based polymer and a method for preparing a graft copolymer including the method for preparing a conjugated diene-based polymer, by which a total usage amount of an emulsifier can be reduced.
    Type: Application
    Filed: September 17, 2019
    Publication date: July 22, 2021
    Inventors: Jin Hyoung LEE, Young Min KIM, Su Jeong HAN, Yoo Vin KIM, Young Hwan JEONG, Jae Min SUK, Chang Hong BAK, Jae Won HEO
  • Publication number: 20210221869
    Abstract: Disclosed are a fusion protein comprising a thyrotropin receptor (TSHR) fragment and the use thereof. More specifically, disclosed are a fusion protein comprising a TSHR fragment comprising an extracellular domain of a wild-type TSHR and having a substitution of an amino acid at specific position and an immunoglobulin Fc region or a carboxy-terminal cap (C-CAP), and the use thereof. The fusion protein has improved pharmaceutical efficacy, in-vivo persistence and protein stability and a pharmaceutical composition containing the fusion protein as an active ingredient is useful as a therapeutic agent or diagnostic reagent for the alleviation of Graves' disease and Graves' ophthalmopathy.
    Type: Application
    Filed: July 24, 2019
    Publication date: July 22, 2021
    Inventors: Moo Young SONG, Taejin YOON, Jung-Sun LEE, Byung Hyun CHOI, In Hwan LIM, Man Sil PARK, Jin-Hyoung LEE, Hyoung Sig SEO, Hyeon Woo KANG, Sung Ho KIM, Eun Jig LEE, Jin Sook YOON, Cheol Ryong KU
  • Publication number: 20210188936
    Abstract: A method for producing a dual function protein includes a biologically active protein and an FGF21 mutant protein. The method allows stable production of a target protein by effectively preventing decomposition of the target protein, and thus has a high potential for commercial usage.
    Type: Application
    Filed: April 20, 2018
    Publication date: June 24, 2021
    Applicant: YUHAN CORPORATION
    Inventors: Byung Hyun CHOI, In Hwan LIM, Jun Young PARK, Jin Hyoung LEE, Ki Hong KIM, Hae Yong JO, Jun Hwan KIM, Moo Young SONG, Jong Gyun KIM
  • Patent number: 11025611
    Abstract: A method of a responding entity for creating a secure link with a requesting entity in an embedded universal integrated circuit card (eUICC) environment is provided. The method includes: receiving, from the requesting entity, a secure link creation message including signature information of the requesting entity; verifying the signature information of the requesting entity by using trust information of the requesting entity, the trust information of the requesting entity being generated by a certificate authority (CA) and transferred to the responding entity; generating a shared key used for communication between the responding entity and the requesting entity; and creating the secure link with the requesting entity by using the shared key.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: June 1, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chul Hyun Park, Kwan Lae Kim, Jin Hyoung Lee, Joo Young Kim
  • Patent number: 10988604
    Abstract: A method of preparing a diene-based rubber latex, a method of preparing an ABS-based graft copolymer including the same, and a method of manufacturing an ABS-based injection-molded article include preparing an in-situ bimodal rubber latex, in which a small-diameter polymer and a large-diameter polymer are formed in a desired ratio, by controlling contents, addition time points, and types of reactants when a conjugated diene based monomer, a crosslinking agent with a long linear chain end, an emulsifier including a multimeric acid of an unsaturated fatty acid or a metal salt thereof, and a molecular weight regulator are polymerized.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: April 27, 2021
    Assignee: LG CHEM, LTD.
    Inventors: Jin Hyoung Lee, Young Min Kim, Su Jeong Han, Yoo Vin Kim, Young Hwan Jeong, Sun Haeng Chung, Jae Min Suk, Jae Won Heo
  • Publication number: 20210109301
    Abstract: An example system includes a grating coupled laser, a laser optical interposer (LOI), an optical isolator, and a light redirector. The grating coupled laser includes a laser cavity and a transmit grating optically coupled to the laser cavity. The transmit grating is configured to diffract light emitted by the laser cavity out of the grating coupled laser. The LOI includes an LOI waveguide with an input end and an output end. The optical isolator is positioned between the surface coupled edge emitting laser and the LOI. The light redirector is positioned to redirect the light, after the light passes through the optical isolator, into the LOI waveguide of the LOI.
    Type: Application
    Filed: May 26, 2020
    Publication date: April 15, 2021
    Inventors: Daniel Mahgerefteh, Jin-Hyoung Lee, Shiyun Lin
  • Publication number: 20210018683
    Abstract: A photonic system may include a PIC and an interposer. The PIC may include a first SiN waveguide. The interposer may include second and third SiN waveguides substantially vertically aligned with the first SiN waveguide in an overlap region of a first waveguide stack that may include the first, second, and third waveguides in the first waveguide stack. Within the overlap region, the second SiN waveguide may include vertical tapering that increases a thickness of the second SiN waveguide from an initial thickness to an increased thickness toward the first SiN waveguide. The first waveguide stack may further include a non-overlap region in which the interposer does not overlap the PIC. The non-overlap region may include the second and third SiN waveguides. Within the non-overlap region, the second SiN waveguide may maintain the increased thickness and the second and third SiN waveguides may include a first lateral bend.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 21, 2021
    Inventor: Jin-Hyoung LEE
  • Patent number: 10862881
    Abstract: A method of managing a file of a subscriber authenticating module embedded in a terminal device and a module for authenticating a subscriber by using the method. The method of managing the file includes configuring a file structure for one or more profiles and managing one or more files included in the file structure in response to a request. Thus, the method is efficient for a multiple-profile environment.
    Type: Grant
    Filed: September 6, 2017
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Myoung Hee Seo, Jin Hyoung Lee, Kwan Lae Kim, Chui Hyun Park, Hyung Jin Lee
  • Patent number: 10845669
    Abstract: In one example embodiment, an optical circuit for optical modulation of light may include an input waveguide including a first thickness, an optical modulator including a second thickness, and a tapered transition that optically couples the optical modulator and the input waveguide. The second thickness may be smaller than the first thickness. The tapered transition may adiabatically transform the optical mode of the input waveguide to the optical modulator.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: November 24, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Daniel Mahgerefteh, Ying Luo, Shiyun Lin, Jin-Hyoung Lee
  • Patent number: 10809456
    Abstract: A photonic system may include a PIC and an interposer. The PIC may include a first SiN waveguide. The interposer may include second and third SiN waveguides substantially vertically aligned with the first SiN waveguide in an overlap region of a first waveguide stack that may include the first, second, and third waveguides in the first waveguide stack. Within the overlap region, the second SiN waveguide may include vertical tapering that increases a thickness of the second SiN waveguide from an initial thickness to an increased thickness toward the first SiN waveguide. The first waveguide stack may further include a non-overlap region in which the interposer does not overlap the PIC. The non-overlap region may include the second and third SiN waveguides. Within the non-overlap region, the second SiN waveguide may maintain the increased thickness and the second and third SiN waveguides may include a first lateral bend.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: October 20, 2020
    Assignee: II-VI Delaware Inc.
    Inventor: Jin-Hyoung Lee
  • Patent number: 10802214
    Abstract: In an example, a photonic system and method include a photonic integrated circuit (PIC) including a silicon (Si) waveguide and a first silicon nitride (SiN) waveguide. The system also includes an interposer including a second SiN waveguide including vertical tapers on the second SiN waveguide by increasing a thickness of the second SiN waveguide in a direction toward the first SiN waveguide to allow an adiabatic optical mode transfer and decreasing the thickness of the second SiN waveguide in a direction away from the first SiN waveguide to inhibit the optical mode transfer.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: October 13, 2020
    Assignee: II-VI Delaware Inc.
    Inventors: Daniel Mahgerefteh, Jin-Hyoung Lee, Bernd Huebner
  • Patent number: 10784030
    Abstract: Provided herein is a magnetic sheet. The magnetic sheet according to one embodiment of the present invention includes a magnetic layer formed of crushed pieces of a magnetic body to improve flexibility of the magnetic sheet, and a thin film coating layer formed on at least one surface of the magnetic layer to maintain the magnetic layer in a sheet shape and buffer an external force applied to the crushed pieces of the magnetic body.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: September 22, 2020
    Assignee: AMOGREENTECH CO., LTD.
    Inventors: Jin Hyoung Lee, Hyun Tae Joo, Chol Han Kim
  • Publication number: 20200257180
    Abstract: In one example embodiment, an optical circuit for optical modulation of light may include an input waveguide including a first thickness, an optical modulator including a second thickness, and a tapered transition that optically couples the optical modulator and the input waveguide. The second thickness may be smaller than the first thickness. The tapered transition may adiabatically transform the optical mode of the input waveguide to the optical modulator.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 13, 2020
    Inventors: Daniel Mahgerefteh, Ying Luo, Shiyun Lin, Jin-Hyoung Lee