Patents by Inventor Jin Hyuck Yang

Jin Hyuck Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210331466
    Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.
    Type: Application
    Filed: April 22, 2021
    Publication date: October 28, 2021
    Inventors: In Seok Ha, Jin Hyuck Yang, Jae Young Jang
  • Publication number: 20210202148
    Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.
    Type: Application
    Filed: June 25, 2020
    Publication date: July 1, 2021
    Inventors: Kwi Jong LEE, Jung Min KIM, Sung Jin HUH, Jin Hyuck YANG, Jae Wook LEE, Ji Hyun EOM
  • Publication number: 20210193373
    Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.
    Type: Application
    Filed: June 24, 2020
    Publication date: June 24, 2021
    Inventors: Kwi Jong Lee, Jung Min Kim, Young Seuck Yoo, Sung Jin Huh, Jin Hyuck Yang, Tae Hyun Kim
  • Patent number: 10062493
    Abstract: An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: August 28, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon Se Chang, Young Do Kweon, Jin Hyuck Yang
  • Patent number: 9986640
    Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: May 29, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jin Hyuck Yang, Jong Yun Lee, Won Chul Sim
  • Publication number: 20170294262
    Abstract: A method of manufacturing an inductor includes forming a step portion having a high-resolution pattern by using a photosensitive layer with photosensitive characteristics, and forming a low-resistance coil pattern by filling the step portion with a metal paste having a lower resistance than a photosensitive metal paste.
    Type: Application
    Filed: March 30, 2017
    Publication date: October 12, 2017
    Inventors: Jong Yun LEE, Hye Won BANG, Jin Hyuck YANG, Young Seuck YOO
  • Patent number: 9786428
    Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.
    Type: Grant
    Filed: February 27, 2014
    Date of Patent: October 10, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Hyuck Yang, Young Seuck Yoo, Sung Kwon Wi, Hye Won Bang, Geon Se Chang, Young Do Kweon, Ju Hwan Yang
  • Patent number: 9741710
    Abstract: An electrostatic discharge protection device includes a base, a plurality of electrodes arranged on the base separated from each other, a function layer supplied on a separation space between the electrodes and a composite insulating layer disposed on the base and composed of inorganic particles dispersed in a resin, the composite insulating layer covering the electrodes and the function layer.
    Type: Grant
    Filed: April 25, 2014
    Date of Patent: August 22, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Min Cho, Kyong Bok Min, Jin Hyuck Yang, Young Seuck Yoo, Hong Ryul Lee
  • Patent number: 9659709
    Abstract: A common mode filter and a manufacturing method thereof are disclosed. A common mode filter in accordance with an aspect of the present invention includes: a substrate: a filter layer disposed on the substrate and configured to remove a signal noise; an electrode column formed to be bent along a perimetric portion of the filter layer and electrically connected with the filter layer; an electrode pad formed to have a larger longitudinal cross-sectional area than the electrode column and integrally coupled on the electrode column; and a magnetic layer formed on a layer on which the electrode column and the electrode pad are formed.
    Type: Grant
    Filed: February 5, 2015
    Date of Patent: May 23, 2017
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon-Se Chang, Jeong-Min Cho, Jin-Hyuck Yang
  • Patent number: 9520223
    Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.
    Type: Grant
    Filed: March 24, 2014
    Date of Patent: December 13, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck Yoo, Kang Heon Hur, Jin Hyuck Yang, Sung Kwon Wi, Jong Yun Lee, Young Do Kweon
  • Patent number: 9496845
    Abstract: The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer.
    Type: Grant
    Filed: August 4, 2014
    Date of Patent: November 15, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon-Se Chang, Jin-Hyuck Yang, Jeong-Min Cho
  • Patent number: 9444250
    Abstract: Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center.
    Type: Grant
    Filed: October 24, 2013
    Date of Patent: September 13, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Won Chul Sim, Kwang Mo Kim, Jin Hyuck Yang, Hye Won Bang, Sung Kwon Wi
  • Publication number: 20160217905
    Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.
    Type: Application
    Filed: October 29, 2015
    Publication date: July 28, 2016
    Inventors: Ju Hwan YANG, Jin Hyuck YANG, Jong Yun LEE, Won Chul SIM
  • Publication number: 20160164483
    Abstract: A common mode filter includes external electrodes formed by printing and curing a conductive paste. The external electrodes of a multilayer structure having a lower electrode layer are formed by curing the conductive paste and an upper electrode layer formed of a solder.
    Type: Application
    Filed: November 10, 2015
    Publication date: June 9, 2016
    Inventors: Seung Wook PARK, Won Chul SIM, Jin Hyuck YANG
  • Patent number: 9320142
    Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: April 19, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min Baek, Yoon Su Kim, Jin Hyuck Yang, Chang Bae Lee
  • Patent number: 9236178
    Abstract: Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: January 12, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ju Hwan Yang, Sung Kwon Wi, Jin Hyuck Yang, Young Do Kweon, Sang Moon Lee
  • Patent number: 9230727
    Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: January 5, 2016
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Seuck Yoo, Kang Heon Hur, Sung Kwon Wi, Ho Jin Yun, Jong Yun Lee, Ju Hwan Yang, Jin Hyuck Yang, Young Do Kweon, Eun Ha Kim
  • Publication number: 20150334832
    Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.
    Type: Application
    Filed: January 16, 2015
    Publication date: November 19, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min BAEK, Yoon Su KIM, Jin Hyuck YANG, Chang Bae LEE
  • Publication number: 20150325363
    Abstract: A common mode filter and a manufacturing method thereof are disclosed. A common mode filter in accordance with an aspect of the present invention includes: a substrate: a filter layer disposed on the substrate and configured to remove a signal noise; an electrode column formed to be bent along a perimetric portion of the filter layer and electrically connected with the filter layer; an electrode pad formed to have a larger longitudinal cross-sectional area than the electrode column and integrally coupled on the electrode column; and a magnetic layer formed on a layer on which the electrode column and the electrode pad are formed.
    Type: Application
    Filed: February 5, 2015
    Publication date: November 12, 2015
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Geon-Se CHANG, Jeong-Min CHO, Jin-Hyuck YANG
  • Publication number: 20150303893
    Abstract: The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer.
    Type: Application
    Filed: August 4, 2014
    Publication date: October 22, 2015
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Geon-Se CHANG, Jin-Hyuck Yang, Jeong-Min Cho