Abstract: An inkjet head unit capable of performing high-resolution pixel printing on a large-size substrate and a substrate treatment apparatus including the inkjet head unit are provided. The substrate treatment apparatus includes: a processing unit supporting and moving a substrate; an inkjet head unit performing pixel printing on the substrate; and a gantry unit moving the inkjet head unit over the substrate, wherein the inkjet head unit includes head packs, which include a plurality of nozzles ejecting a substrate treatment liquid onto the substrate, and a head base, in which the head packs are installed and the head packs are disposed in a single row in the head base.

Abstract: Proposed are an inkjet head unit capable of forming high-resolution pixels on a substrate and inkjet printing equipment including the same. An inkjet head unit of inkjet printing equipment according to one embodiment includes a head pack including a plurality of ejection heads configured to eject ink of the same color to a substrate; and a head base on which a plurality of head packs are installed to be repeatedly coaxially arranged in color order.

Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.

Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.

Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.

Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.

Abstract: A coil component includes a support substrate; a coil portion disposed on the support substrate; a body embedding the support substrate and the coil portion therein, and having a first surface and a second surface opposing each other, a third surface and a fourth surface opposing each other and respectively connecting the first and second surfaces; lead-out portions extending from the coil portion and respectively exposed from the third and fourth surfaces of the body; a surface-insulating layer disposed on the third and fourth surfaces of the body and having openings respectively exposing the lead-out portions; and external electrodes arranged on the surface-insulating layer and respectively connected to the lead-out portions respectively exposed through the openings, wherein a width of each of the external electrodes is narrower than a width of the body.

Abstract: A coil component includes a support substrate and a coil portion disposed on the support substrate, a body in which the support substrate and the coil portion are embedded, first and second lead portions extending from the coil portion and respectively exposed to a surface of the body, a surface insulating layer disposed on the surface of the body and having openings respectively exposing the first and second lead portions, and first and second external electrodes disposed on the surface insulating layer and connected to the first and second lead portions exposed through the openings. Each of the first and second external electrodes includes a first metal layer formed of a metal and in direct contact with the first and second lead portions.

Abstract: An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.

Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.

Abstract: A method of manufacturing an inductor includes forming a step portion having a high-resolution pattern by using a photosensitive layer with photosensitive characteristics, and forming a low-resistance coil pattern by filling the step portion with a metal paste having a lower resistance than a photosensitive metal paste.

Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.

Abstract: An electrostatic discharge protection device includes a base, a plurality of electrodes arranged on the base separated from each other, a function layer supplied on a separation space between the electrodes and a composite insulating layer disposed on the base and composed of inorganic particles dispersed in a resin, the composite insulating layer covering the electrodes and the function layer.

Abstract: A common mode filter and a manufacturing method thereof are disclosed. A common mode filter in accordance with an aspect of the present invention includes: a substrate: a filter layer disposed on the substrate and configured to remove a signal noise; an electrode column formed to be bent along a perimetric portion of the filter layer and electrically connected with the filter layer; an electrode pad formed to have a larger longitudinal cross-sectional area than the electrode column and integrally coupled on the electrode column; and a magnetic layer formed on a layer on which the electrode column and the electrode pad are formed.

Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.

Abstract: The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer.

Abstract: Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center.

Abstract: A coil component includes coil conductors having a multilayer structure including via pads, and vias connected between the via pads on the respective layers. Portions or overall regions of the via pads on two layers which are adjacent to each other overlap each other, and the vias in two layers which are connected to each other by the via pad formed therebetween are disposed in alternating positions.

Abstract: A common mode filter includes external electrodes formed by printing and curing a conductive paste. The external electrodes of a multilayer structure having a lower electrode layer are formed by curing the conductive paste and an upper electrode layer formed of a solder.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.