Abstract: Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.

Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.

Abstract: The present invention relates to an electrode structure which includes: a base substrate; a seed layer provided on one or both surfaces of the base substrate; an electroplating layer provided on the seed layer; and barriers discontinuously provided between the seed layer and the electroplating layer.

Abstract: A common mode filter and a manufacturing method thereof are disclosed. A common mode filter in accordance with an aspect of the present invention includes: a substrate: a filter layer disposed on the substrate and configured to remove a signal noise; an electrode column formed to be bent along a perimetric portion of the filter layer and electrically connected with the filter layer; an electrode pad formed to have a larger longitudinal cross-sectional area than the electrode column and integrally coupled on the electrode column; and a magnetic layer formed on a layer on which the electrode column and the electrode pad are formed.

Abstract: The present invention discloses a common mode filter and a method for manufacturing the common mode filter. The common mode filter in accordance with an embodiment of the present invention includes: a magnetic substrate; a first coil electrode formed on the magnetic substrate; a first lead electrode formed on the magnetic substrate; a first dielectric layer formed on the magnetic substrate; a height compensation electrode formed on the upper surface of the first lead electrode; a second coil electrode formed on the first dielectric layer; a second lead electrode formed on the first dielectric layer; a second dielectric layer formed on the first dielectric layer; and an external electrode formed on the second dielectric layer.

Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.

Abstract: An electronic component and a circuit board having the same mounted thereon. The electronic component includes: a base part; a coil part provided on the base part and including a coil formed by disposing conductive patterns in a spiral shape and an external terminal connected to an end portion of the coil; and a cover part including an external electrode having a first surface contacting an upper surface of the external terminal and a second surface opposing the first surface and a magnetic material part provided on the coil part, made of a magnetic material, and exposing the second surface, wherein a surface area of the first surface is larger than a surface area of the second surface.

Abstract: A common mode filter is disclosed. The common mode filter in accordance with an aspect of the present invention includes: a first dielectric layer having a first groove formed along an outer boundary portion thereof; a second dielectric layer coated on the first dielectric layer so as to cover a first coil laminated on the first dielectric layer, having a first protrusion corresponding to the first groove formed on one surface thereof being in contact with the first dielectric layer, and having a second groove formed on the other surface thereof; and a third dielectric layer coated on the second dielectric layer so as to cover a second coil laminated on the second dielectric layer, having a second protrusion corresponding to the second groove formed on one surface thereof being in contact with the second dielectric layer, and having a third groove formed on the other surface thereof.

Abstract: Disclosed herein is a common mode filter, including: first and second coil layers electromagnetically coupled to each other; a pair of external terminals connected to ends of the first coil layer and a pair of external terminals connected to ends of the second coil layer; a first ESD prevention member connecting between the pair of external terminals carrying electric current with the first coil layer and a second ESD prevention member connecting between the pair of external terminals carrying electric current with the second coil layer; and a ground electrode connecting the first ESD prevention member to the second ESD prevention member, wherein the ground electrode has a stepped portion formed at the center.

Abstract: The present invention relates to a common mode filter. A common mode filter in accordance with the present invention includes a magnetic substrate formed of a magnetic ceramic material; a first coil pattern and a second coil pattern sequentially formed on the magnetic substrate; an external electrode laminated on the second coil pattern; a via for connecting the first coil pattern and the second coil pattern; and a second insulating layer formed between the first coil pattern and the second coil pattern, wherein the height of the second insulating layer is 5 ?m to 20 ?m while being proportional to the height of the via and thus it is possible to improve SRF and insertion loss characteristics by adjusting the height of the second insulating layer.

Abstract: Disclosed herein is a thin film chip device, including: a substrate; a circuit layer disposed on the substrate and having coil patterns; and a functional layer formed on the circuit layer and having an embossed shape.

Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with the present invention includes a base, a plurality of electrodes arranged on the base separated from each other, a function layer supplied on a separation space between the electrodes and a composite insulating layer on which inorganic particles are dispersed on a resin with covering the electrodes and the function layer on the base.

Abstract: The present invention relates to an inductor. An inductor in accordance with an embodiment of the present invention includes: an insulating layer having a hole; a conductive pattern disposed on both surfaces of the insulating layer and having a structure in which portions disposed on the both surfaces are electrically connected to each other through the hole; and a magnetic layer disposed on the insulating layer to cover the conductive pattern, wherein the conductive pattern has a plating pattern formed by performing a plating process.

Abstract: Disclosed herein is an inductor including: a core layer having a conductive pattern formed on a surface thereof and having a through-hole formed at a region in which the conductive pattern is not formed; and a magnetic layer covering the core layer, wherein the magnetic layer includes: a filled part filled in the through-hole and having high magnetic material filling density; and a cover part covering the surface of the core layer and having magnetic material filling density lower than that of the filled part.

Abstract: Disclosed herein is a common mode filter, including: a magnetic substrate; and a body part formed on the magnetic substrate, wherein the body part is configured of an insulating layer surrounding a coil electrode, an outer electrode terminal connected with an end of the coil electrode, and a magnetic resin composite, the insulating layer is formed on the magnetic substrate, having a margin part M disposed at an edge of the magnetic substrate, and the magnetic resin composite is filled in an empty space of the body part including the margin part M, thereby promoting a consecutive flow of magnetic flux that is generated from the coil electrode.

Abstract: Disclosed herein is a common mode filter including an internal electrode manufactured in a coil electrode form and provided with a simultaneous coil pattern in which two coil electrodes are overlapped with each other in a single layer in a direction in which a coil is wound, wherein a height of a second insulating layer formed on the internal electrode is higher than an interval between the coils. Therefore, a portion at which a parasitic capacitance is generated may be basically blocked, and a self resonant frequency (SRF) may be increased while filtering performance as the common mode filter is maintained.

Abstract: Disclosed herein are a coil component and a manufacturing method thereof. The coil component includes: an electrode body including coil electrodes disposed therein, the coil electrodes having an insulating film deposited on a surface thereof; and external terminals formed at both side portions of the electrode body and connected to the coil electrodes, wherein the electrode body is made of an insulating material with which magnetic powders are mixed, in order to improve impedance characteristics.

Abstract: The present invention relates to an electrostatic discharge protection device. The electrostatic discharge protection device in accordance with an embodiment of the present invention includes a substrate, an electrostatic discharge absorbing layer having a plating film formed on the substrate, electrodes disposed on the substrate to be spaced apart from each other by a predetermined interval with the electrostatic discharge absorbing layer interposed therebetween, and an insulating layer for covering the substrate and the electrodes.

Abstract: Disclosed herein are a multilayer ceramic capacitor and a method for manufacturing the same. The multilayer ceramic capacitor includes: a capacitor main body having dielectric layers and inner electrodes laminated therein; external electrodes and plating layers formed on a surface of the capacitor main body; and electroless plating layers formed between the external electrodes and the plating layers. According to the examples of the present invention, the electroless plating layer is formed before the plating layer is formed on the external electrode, thereby solving non-plating problems when the plating layer made of nickel or the like is formed on the external electrode. Therefore, soldering defects due to nickel non-plating or the like can be solved at the time of mounting, and thus, a multilayer ceramic capacitor having high reliability can be provided.

Abstract: There are provided a plating solution for forming a tin alloy, and a method of forming a tin alloy film by using the same. The plating solution for forming a tin alloy, the plating solution includes a tin salt and one or more metal salts each comprising indium or zinc, and at least one reducing agent selected from the group consisting of boron hydride compounds, the reducing agent providing electrons to metal ions of the metal salts and tin ions of the tin salt to form a tin alloy film on an object to be plate.