Patents by Inventor Jin Hyun Park
Jin Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250080721Abstract: Disclosed herein is an image encoding/decoding method. The method of decoding the image includes structuring a motion information candidate list of a current block, selecting a first motion information candidate used for prediction of a first subblock in the current block from the motion information candidate list, selecting a second motion information candidate used for prediction of a second subblock in the current block from the motion information candidate list, generating a prediction sample of the first subblock by performing inter prediction with respect to the first subblock based on the first motion information candidate, and generating a prediction sample of the second subblock by performing inter prediction with the second subblock based on the second motion information candidate. The first and second motion information candidates are any one of candidates in first and second prediction directions in the motion information candidate list, respectively.Type: ApplicationFiled: November 15, 2024Publication date: March 6, 2025Inventors: Jung Won KANG, Ha Hyun LEE, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Gwang Hoon PARK, Tae Hyun KIM, Dae Young LEE
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Patent number: 12242193Abstract: Organic coating compositions, particularly antireflective coating compositions for use with an overcoated photoresist, are provided that in a first aspect comprise a crosslinker component that comprises a structure of the following Formula (I):Type: GrantFiled: September 11, 2023Date of Patent: March 4, 2025Assignee: ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.Inventors: Eui-Hyun Ryu, Jin Hong Park, You Rim Shin, Ji-Hon Kang, Jung-June Lee, Jae-Bong Lim
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Patent number: 12240699Abstract: An article storage device includes a load port configured to load and unload a plurality of articles, a plurality of shelves configured to load the articles, a transportation robot configured to transport the articles between the load port and the shelves or between the shelves, a receiving part configured to receive operation commands of the transportation robot from an upper system, a calculating part configured to calculate a setting value of an order of priority with respect to the operation commands, and a control part configured to control the transportation robot to perform an operation command having a high setting value of an order of priority among the operation commands.Type: GrantFiled: June 16, 2021Date of Patent: March 4, 2025Assignee: SEMES CO., LTD.Inventors: Young Woo Kim, Jin Ho Song, Yong Bae Choi, Ji Hyun Park
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Publication number: 20250065996Abstract: A method of calculating a collision risk of a ship according to an embodiment of the present disclosure may include: calculating an available velocity area based on maneuvering performance of a host ship; calculating a velocity obstacle area where there is a possibility of collision between an object and the host ship; and calculating a collision risk based on at least one of the available velocity area, the velocity obstacle area, and a preset weight.Type: ApplicationFiled: October 30, 2024Publication date: February 27, 2025Inventors: Kwang Sung KO, In Beom KIM, Jin Mo PARK, Hui Yong CHOI, Hu Jae CHOI, Su Rim KIM, Gwang Hyeok CHOI, Do Yeop LEE, Do Yeon JUNG, Jin Young OH, Je Hyun CHA, Ji Yoon PARK, Won Chul YOO
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Publication number: 20250071271Abstract: An image encoding/decoding method and apparatus is provided. The method of decoding an image includes decoding at least one of prediction mode information of a neighbor block of a current block and length information of the current block, deriving an intra prediction mode of the current block into a predetermined mode using the decoded information, and reconstructing the current block based on the intra prediction mode of the current block.Type: ApplicationFiled: October 28, 2024Publication date: February 27, 2025Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITYInventors: Jung Won KANG, Ha Hyun LEE, Sung Chang LIM, Jin Ho LEE, Hui Yong KIM, Gwang Hoon PARK, Tae Hyun KIM, Dae Young LEE, Woo Woen GWUN, Won Jun LEE
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Patent number: 12235539Abstract: A liquid crystal display apparatus includes: a liquid crystal panel; and a viewer-side polarizing plate stacked on a light exit surface of the liquid crystal panel, and the viewer-side polarizing plate includes a patterned layer including a first resin layer and a second resin layer having different indexes of refraction; and a patterned portion including multiple engraved optical patterns and a flat section between adjacent engraved optical patterns of the multiple optical patterns is formed at an interface between the first resin layer and the second resin layer, and the liquid crystal display apparatus satisfies Equation 1 herein and the engraved optical patterns have an aspect ratio of 0.3 or more.Type: GrantFiled: March 9, 2023Date of Patent: February 25, 2025Assignee: Samsung SDI Co., Ltd.Inventors: Yong Un Jung, Young Hyun Ju, So Yeon Gong, Jin Woo Kim, Da Neung Park, Young Oh, Dong Ho Wee
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Patent number: 12234350Abstract: A polyolefin thermoplastic elastomer composition for an airbag chute, includes a polypropylene, an olefin block copolymer, and a dendrimer as a material applied to a raw material of a passenger airbag chute. An olefin elastomer composite resin composition for an airbag chute includes 30-80 parts by weight of a polypropylene resin, 30-70 parts by weight of an olefin block copolymer, and 0.1-5 parts by weight of a dendrimer based on 100 parts by weight of the olefin elastomer composite resin composition. The olefin elastomer composite resin composition for an airbag chute, improves the dispersion of the elastomer by applying a high-flow elastomer and a low-flow polypropylene, and improves flowability and meltability characteristics without deteriorating physical properties by applying the dendrimer.Type: GrantFiled: July 2, 2019Date of Patent: February 25, 2025Assignee: CEPLA CO., LTD.Inventors: Chang Won Chae, Sung Yeon Lee, Chang Min Hong, Jong Soo Park, Jae Myung Rhee, Jin Young Huh, Kyu Haeng Cho, Dae Keun Kim, Gwang Ho Go, Poong Hyun Choi
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Publication number: 20250050168Abstract: According to one aspect of the present invention, there is provided a method for providing shot information on golf balls, the method comprising the steps of: generating strike information and direction information of a ball with reference to information on a physical quantity of the ball measured or estimated from at least one swing; and visualizing and displaying the generated strike information and direction information of the ball in a first region or a second region.Type: ApplicationFiled: October 28, 2024Publication date: February 13, 2025Applicant: CREATZ INC.Inventors: Jin Hyun KIM, Joon Seok YANG, Su Jin PARK, Sung Young BAEK
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Patent number: 12221022Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.Type: GrantFiled: December 21, 2022Date of Patent: February 11, 2025Assignees: Hyundai Motor Company, Kia Corporation, Hyundai Transys Inc.Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
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Patent number: 12223844Abstract: A method of managing identification information of a drone may include: generating an access message, wherein the access message includes an identifier for the ground identification device, which is a transmitter, an identifier for a receiver, an execution function command for classifying and defining a function to be performed, a serial number for transmitting information sequentially and retransmitting the information when transmission fails, data size information for informing a size of data to be transmitted, and transmission data; and transmitting the access message to an integrated management system corresponding to the identifier for the receiver.Type: GrantFiled: September 15, 2022Date of Patent: February 11, 2025Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Su Na Choi, Kyu Min Kang, Jae Cheol Park, Jin Hyung Oh, Dong Woo Lim, Sung Hyun Hwang
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Patent number: 12225191Abstract: Disclosed herein are image encoding/decoding method and apparatus. The image decoding method according to the present invention includes: obtaining prediction mode information of a neighboring block for a current block from a bitstream; by using the obtained information, deriving a prediction mode of the neighboring block; and, based on the prediction mode of the neighboring block, reconstructing the current block.Type: GrantFiled: June 19, 2020Date of Patent: February 11, 2025Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITYInventors: Jin Ho Lee, Jung Won Kang, Ha Hyun Lee, Sung Chang Lim, Hui Yong Kim, Jae Gon Kim, Yong Uk Yoon, Do Hyeon Park
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Patent number: 12217644Abstract: An OLED panel may include a substrate including a first region and a second region disposed along a first direction. A plurality of first pixels are disposed in the first region on the substrate, the first pixels each having a first area, the first pixels each comprising a first unit pixel, a second unit pixel disposed along a second direction from the first unit pixel, and a transmission portion disposed along the first direction from the first unit pixel and the second unit pixel. A plurality of second pixels are disposed in the second region on the substrate, the second pixels each having a second area less than the first area, the second pixels each comprising a third unit pixel. The first unit pixel, the second unit pixel, and the third unit pixel may have substantially the same shape as each other.Type: GrantFiled: February 13, 2023Date of Patent: February 4, 2025Assignee: Samsung Display Co., Ltd.Inventors: Jeong-Woo Moon, Jin-Koo Chung, Seong-Min Kim, Jin-Hyun Park, Chaun-Gi Choi
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Patent number: 12218142Abstract: A display device includes: a substrate; a polycrystalline silicon film on the substrate; and a first buffer film between the substrate and the polycrystalline silicon film and having one surface contacting the polycrystalline silicon film and another surface opposite to the one surface, wherein the one surface of the first buffer film has a first root mean square (RMS) roughness range, and the first RMS roughness range is 1.5 nm or less.Type: GrantFiled: November 13, 2023Date of Patent: February 4, 2025Assignee: Samsung Display Co., Ltd.Inventors: Ki Hyun Kim, Young Gil Park, Jin Suk Lee, Jai Sun Kyoung, Sug Woo Jung
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Patent number: 12217914Abstract: A ceramic electronic component includes a body including a dielectric layer and a plurality of internal electrodes stacked in a first direction with the dielectric layer interposed therebetween and including first and second surfaces opposing each other in the first direction and side surfaces connected to the first and second surfaces, an external electrode disposed on one of the side surfaces of the body extending onto a portion of the first surface of the body, and an insulating layer covering a surface of the external electrode and including a plurality of openings exposing the external electrode, wherein a ratio of an area of the plurality of openings to an area of the surface of the external electrode covered by the insulating layer is 20% to 70%.Type: GrantFiled: April 20, 2022Date of Patent: February 4, 2025Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seung Hyun Park, Jin Mo Ahn, Ji Hong Jo
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Patent number: 12216914Abstract: A memory system includes a memory device including a first memory block used for power-loss data protection and a controller coupled to the memory device. The controller includes a hardware layer and a firmware layer. The hardware layer checks whether at least one write data entry belongs to a programmable range in the memory device after power loss occurs, determines whether a logical address associated with the at least one write data entry is repeated, and programs the at least one write data entry in the first memory block.Type: GrantFiled: October 3, 2022Date of Patent: February 4, 2025Assignee: SK hynix Inc.Inventors: Jin Pyo Kim, Ju Hyun Kim, Jong Soon Park, Woong Sik Shin, Woo Young Yang
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Publication number: 20250037650Abstract: A display device includes a power supply to supply a first initialization power source to the pixels through a first initialization and to supply a second initialization power source to the pixels through a second power line.Type: ApplicationFiled: October 14, 2024Publication date: January 30, 2025Inventors: Kyong Hwan OH, Jin Tae JEONG, Ji Hyun KA, Won Kyu KWAK, Hyung Jun PARK, Chang Soo PYON, Ji Eun LEE, Hai Jung IN, Won Mi HWANG
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Publication number: 20250040241Abstract: A semiconductor device includes a first active pattern extending in a first direction, a second active pattern on the first active pattern and extending in the first direction, a gate structure on the first active pattern and the second active pattern and extending in a second direction intersecting the first direction, a first source/drain region on side faces of the gate structure and connected to the first active pattern, a second source/drain region on the side faces of the gate structure and connected to the second active pattern, and an intermediate connecting layer which includes a first intermediate conductive pattern between the first active pattern and the second active pattern, and a second intermediate conductive pattern connected to the first intermediate conductive pattern between the first source/drain region and the second source/drain region.Type: ApplicationFiled: February 1, 2024Publication date: January 30, 2025Applicant: Samsung Electronics Co., Ltd.Inventors: Sung Il PARK, Jae Hyun PARK, Jin Wook YANG
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Patent number: 12211705Abstract: A wafer level fan out package includes a semiconductor die having a first surface, a second surface, and a third surface. A stiffener is disposed on the third surface of the semiconductor die. A conductive via passes through the stiffener. First and second electrically conductive patterns electrically connected to the conductive via are disposed on the first and second surfaces of the semiconductor die and stiffener. Solder balls are electrically connected to the first or second electrically conductive patterns.Type: GrantFiled: September 15, 2023Date of Patent: January 28, 2025Assignee: Amkor Technology Singapore Holding Pte. Ltd.Inventors: Jin Young Kim, Doo Hyun Park, Seung Jae Lee
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Patent number: 12206286Abstract: A rotor for an induction motor includes a rotor core having a hollow portion on a central portion wherein a shaft is coupled to the rotor core by being inserted through the hollow portion, a plurality of slots radially formed in the rotor core around a central axis of the shaft, a plurality of conductor bars coupled to the plurality of slots, and an end ring electrically connecting the plurality of conductor bars to each other, wherein the rotor core is thermally treated above Curie temperature to form a predetermined pattern on an outer circumference of the rotor core.Type: GrantFiled: July 6, 2022Date of Patent: January 21, 2025Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, IUCF-HYU (INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY)Inventors: Jin Ho Choi, Sang Jin Park, Jong Seok Lee, Ki O Kim, Sung Woo Hwang, Myung Seop Lim, Jae Hyun Kim
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Publication number: 20250022784Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.Type: ApplicationFiled: September 27, 2024Publication date: January 16, 2025Inventors: Jae Yun Kim, Gi Tae Lim, Woon Kab Jung, Ju Hoon Yoon, Dong Joo Park, Byong Woo Cho, Gyu Wan Han, Ji Young Chung, Jin Seong Kim, Do Hyun Na