Abstract: In a thin film deposition apparatus and a thin film deposition method using the same, a first spraying unit and a second spraying unit which are separately driven are prepared, the first spraying unit is driven to sequentially spray a first deposition source and an inert gas onto a substrate, a chamber is exhausted to remove, from the chamber, excess first deposition sources that are not adsorbed onto the substrate from the chamber, a second spraying unit is driven to sequentially spray a second deposition source and an inert gas onto the substrate, and the chamber is exhausted to remove, from the chamber, excess second deposition sources that are not adsorbed onto the substrate. When the thin film deposition method is used, the unintended generation of microparticles during deposition is sufficiently suppressed.

Abstract: A vapor deposition apparatus includes a stage on which a substrate is mounted; a heater unit that is disposed at a side of the stage and includes a first heater and a second heater, wherein the first heater and the second heater are movable so that the first heater and the second heater are spaced apart from each other or are disposed adjacent to each other; and a nozzle unit that is disposed at a side opposite to the side at which the heater unit is disposed about the stage and includes one or more nozzles.

Abstract: A rotating type thin film deposition apparatus having an improved structure that allows continuous deposition, and a thin film deposition method used by the rotating type thin film deposition apparatus are provided. The rotating type thin film deposition apparatus includes a deposition device; a circulation running unit that runs a deposition target on a circulation track via a deposition region of the deposition device; and a support unit that supports the deposition target and moves along the circulation track. Thin layers can be precisely and uniformly formed on the entire surface of a deposition target, and since deposition is performed while a plurality of deposition targets move along a caterpillar track, a working speed is faster compared to a method involving a general reciprocating motion, and the size of the thin film deposition apparatus can be reduced.

Abstract: An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode formed on the substrate; a first inorganic layer formed on the substrate and covering the organic light emitting diode; an intermediate layer formed on the first inorganic layer and covering an area relatively smaller than the first inorganic layer; and a second inorganic layer formed on the first inorganic layer and the intermediate layer, and contacting the first inorganic layer at an edge thereof while covering a relatively larger area than the intermediate layer. A third inorganic layer may be formed on the second inorganic layer so as to contact the second inorganic layer at an edge thereof. At least one of the first, second and third inorganic layers is formed by an atomic layer deposition (ALD) method.

Abstract: A vapor deposition apparatus, which is capable of performing a thin film deposition process and improving characteristics of a formed thin film, includes a chamber having an exhaust opening; a stage located in the chamber, and including a plurality of mounting surfaces on which the plurality of substrates may be mounted; and an injection unit having at least one injection opening for injecting a gas into the chamber in a direction parallel with surfaces of the plurality of substrates.

Abstract: A vapor deposition apparatus, which is capable of performing a thin film deposition process and improving characteristics of a formed thin film, includes: a chamber having an exhaust opening; a stage disposed in the chamber, and comprising a mounting surface on which the substrate may be mounted; an injection unit having at least one injection opening for injecting a gas into the chamber in a direction parallel with a surface of the substrate, on which the thin film is to be formed; a guide member facing the substrate to provide a set or predetermined space between the substrate and the guide member; and a driving unit conveying the stage and the guide member.

Abstract: A vapor deposition apparatus and method for efficiently performing a deposition process to form a thin film with improved characteristics on a substrate, and a method of manufacturing an organic light-emitting display apparatus. The vapor deposition apparatus includes a chamber including an exhaust port; a stage disposed in the chamber, and including a mounting surface on which the substrate is to be disposed; an injection portion including at least one injection opening through which a gas is injected in a direction parallel with a surface of the substrate on which the thin film is to be formed; and a plasma generator disposed apart from the substrate to face the substrate.

Abstract: An atomic layer deposition apparatus and a sealing method of an organic light emitting device using the same are disclosed. In one embodiment, the atomic layer deposition apparatus improves a structure of the purge gas injection nozzle so as to increase the exhaust efficiency of the purge gas in an atomic layer deposition process, which increases a speed of a purge process. As a result, it is possible to improve a deposition speed and a quality of a sealing film when a sealing process for sealing the organic light emitting device is implemented by using the atomic layer deposition.

Abstract: An inline deposition apparatus includes a chamber; a loading unit inside the chamber and loaded with an object to be processed to be moved in a first direction; a plurality of first deposition modules in the chamber for depositing a first layer to the object to be processed; and a plurality of second deposition modules in the chamber for depositing a second layer to the object to be processed, wherein at least one of the plurality of second deposition modules is positioned between neighboring first deposition modules, and wherein the first layer is different from the second layer.

Abstract: A method of manufacturing an OLED display includes: forming an organic light emitting element on a first substrate; forming, on the organic light emitting element, a thin film encapsulation layer that seals the organic light emitting element with the first substrate; providing a second substrate; forming a flexible protection layer on the second substrate; attaching the first substrate and the second substrate to each other; and separating the second substrate from the flexible protection layer.

Abstract: A connector terminal includes a connection body terminal unit and a coupling terminal unit receiving the connection body terminal unit. The coupling terminal unit having an upper coupling terminal part symmetrically arranged with a lower coupling terminal part. Each of the upper and lower coupling terminal parts includes a fixed end, a free end, and a bent portion. The free end is movable and is positioned opposite the fixed end. The fixed end includes a plurality of contact points. The bent portion is positioned between the fixed end and the movable free end, and is disposed along a front side of each of the upper and lower coupling terminal parts.

Abstract: A method of fabricating an organic light-emitting display includes forming an organic light-emitting device (OLED) on a substrate, forming a first encapsulation layer, which has a first thin-film density and contains a first inorganic material, on the substrate, and forming a second encapsulation layer, which has a second thin-film density higher than the first thin-film density and contains a second inorganic material, on the first encapsulation layer.

Abstract: An organic light emitting diode (OLED) display includes: a substrate; an organic light emitting diode on the substrate; and a thin film encapsulation layer including a first inorganic layer having a first density on the substrate and a second inorganic layer having a second density on the first inorganic layer, the second density being different from the first density, and the organic light emitting diode being encapsulated between the thin film encapsulation layer and the substrate.

Abstract: A plate-type heat exchanger for use in a fuel cell system that has a fuel cell stack and a reformer is provided. The heat exchanger includes a substrate and a pair of cover plates. The substrate has a first face and a second face opposite to the first face. The substrate is disposed between the cover plates, and combined with the cover plates to form a first passageway and a second passageway. The first passageway is formed in the first face and circulates steam discharged from the fuel cell stack. The steam or water condensed from the steam is supplied to a water supply source. The second passageway is formed in the second face, and circulates water supplied from the water supply source. The water is supplied to the reformer after the circulation. The heat exchanger of the present invention improves performance and efficiency of a fuel cell system.

Abstract: A fuel reforming apparatus including reaction substrates is provided. The reaction substrates of the present invention is made of stainless steel, nickel steel, or chromium steel. Each of the reaction substrates has a channel formed on the surface of the reaction substrate. Reactant for oxidation reaction or for fuel reforming reaction flow through the channel. A catalyst containing layer is formed on the surface of the channel by directly oxidizing the surface of the channel. Therefore, the catalyst containing layer is formed with oxidized steel. A catalyst layer is formed on the catalyst containing layer. A pair of substrates can be laminated to make one substrate a thermal source unit and another a reforming reaction unit.

Abstract: A reformer for a fuel cell system includes a heating source for generating heat by a reaction of a fuel and an oxidant using an oxidizing catalyst, and a reforming reaction part for generating hydrogen by a reforming catalyst reaction. The oxidizing catalyst includes a solid acid, including a strong acid ion and an inorganic oxide, and a platinum-based metal. The reformer for a fuel cell system can start a fuel oxidation catalyst reaction at a low temperature with the heating source having a simplified structure.

Abstract: An organic light emitting diode lighting apparatus is disclosed. The apparatus includes a plurality of electrode lines that feed current to or from a plurality of light emitting diodes, and a flexible printed circuit board (FPCB) that has a plurality of connection lines electrically connected to the plurality of electrode lines through the plurality of contact holes. In some embodiments, the FPCB has a fuse for each of the electrode lines.

Abstract: A fuel cell system includes a fuel cell body to generate electrical energy using a reaction of hydrogen and oxygen; a reformer to generate a reformed gas containing hydrogen by reforming fuel and to supply the reformed gas to the fuel cell body; a fuel tank to store the fuel in a partially liquefied state and to supply the fuel to the reformer; a case to encase the fuel cell body and the reformer; and a refrigeration unit attached to the case to store ambient air of the fuel tank, the ambient air of the fuel tank being cooled by latent heat of vaporization of the fuel.

Abstract: Disclosed are a carbon monoxide remover and a fuel cell reformer including the same. In the reformer, a reformed gas produced from a reforming reaction unit when the reformer is initially driven is used as a fuel for a heat source unit supplying heat to a water gas shift reaction unit. The carbon monoxide remover is connected to the reforming reaction unit that changes fuel into reformed gas with hydrogen. The carbon monoxide remover lowers carbon monoxide contained in the reformed gas. The carbon monoxide remover includes a heat source unit employing the reformed gas as a fuel; and a water gas shift reaction unit provided with a shift catalyst using heat from the heat source unit. The shift catalyst lowers the concentration of carbon monoxide in the reformed gas through reaction between water and carbon monoxide.