Patents by Inventor Jin Mo Kim

Jin Mo Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120155063
    Abstract: An LED light source module is provided. The LED light source module includes a circuit board having a first circuit pattern and a second circuit pattern; and a plurality of rectangular LED packages mounted on the circuit board so as to be connected to each of the first and second circuit patterns, and arranged in a row such that each of the LED packages is tilted in a predetermined direction, while long sides of adjacent LED packages facing each other. In addition, a display device having the LED light source module is provided.
    Type: Application
    Filed: December 16, 2011
    Publication date: June 21, 2012
    Inventors: Won Joon LEE, Kun Yoo KO, Jin Mo KIM, Seung Hwan CHOI
  • Publication number: 20110292302
    Abstract: A light source module, a backlight unit, a display apparatus, a television set, and an illumination apparatus are provided. The light source module includes: one or more light source units including a light emitting element emitting light when electricity is applied thereto; and an optical sheet disposed above the light source units and exhibiting bidirectional transmittance distribution function characteristics having first and second peaks at radiation angles less than 0° and greater than 0°.
    Type: Application
    Filed: May 2, 2011
    Publication date: December 1, 2011
    Applicant: SAMSUNG LED CO., LTD.
    Inventors: Jung Kyu PARK, Young Sam PARK, Sung A. CHOI, Jeong Eun LIM, Jin Mo KIM, Man Ki HONG, Tae Heon HAN, Churl Wung SHIN, Young Taek KIM, Dae Woon HONG, Young Geun JUN, Jung Kyu KOOK
  • Publication number: 20110182085
    Abstract: There is provided an LED module, including a bar type circuit substrate formed with at least one groove so as to have a reflecting cup; a plurality of LED chips disposed in the groove of the circuit substrate and linearly arranged in a longitudinal direction of the circuit substrate; and a phosphor film spaced apart from the LED chips and disposed on the circuit substrate to cover the entire groove.
    Type: Application
    Filed: January 21, 2011
    Publication date: July 28, 2011
    Applicant: SAMSUNG LED CO., LTD.
    Inventors: Kun Yoo KO, Seung Hwan CHOI, Won Joon LEE, Jin Mo KIM