Abstract: A fan-out semiconductor package includes: a frame including insulating layers, wiring layers, and connection via layers, and having a recess portion and a stopper layer disposed on a bottom surface of the recess portion; a semiconductor chip having connection pads and disposed in the recess portion so that an inactive surface is disposed on the stopper layer; first metal bumps disposed on the connection pads; an encapsulant covering at least portions of each of the frame, the semiconductor chip, and the first metal bumps and filling at least portions of the recess portion; a connection member disposed on the frame and an active surface of the semiconductor chip and including a redistribution layer electrically connecting the wiring layers and the connection pads to each other; and a first blocking structure disposed on walls of the recess portion to surround side surfaces of the semiconductor chip.

Abstract: The present invention relates to a composition for promoting osteoblast or cartilage cell differentiation. More particularly, the present invention relates to a composition, which includes stauntonia hexaphylla leaf extract that may be safely used without toxicity and side effects by using a natural ingredient, for promoting bone (tissue) formation to be used for suppressing and treating bone and cartilage tissue damage. A pharmaceutical composition including the stauntonia hexaphylla leaf extract according to the present invention as an active ingredient may be used as a medicine for periodontitis or osteoporosis to treat or prevent periodontitis or osteoporosis.

Abstract: A fixing device comprising a fixing belt, a rotating member arranged to be in engagement with an outer circumferential surface of the fixing belt, a nip forming member to press the fixing belt, to form a fixing nip between the fixing belt and the rotating member, and sliding members on both ends of the fixing belt and to rotate together with the fixing belt.

Abstract: A remote control apparatus is provided.

Abstract: A fan-out semiconductor package includes a core member having a through-hole in which a semiconductor chip is disposed. The semiconductor chip has an active surface having connection pads disposed thereon and an inactive surface opposing the active surface. An encapsulant encapsulates at least a portion of the semiconductor chip. A connection member is disposed on the active surface of the semiconductor chip and includes a redistribution layer electrically connected to the connection pads of the semiconductor chip. A passivation layer is disposed on the connection member. The fan-out semiconductor package further has a slot spaced part from the through-hole and penetrating through at least a portion of the core member or the passivation layer.

Abstract: The present invention relates to a lipid nanomaterial containing lysophosphatidylcholine or an ether derivative thereof, a method for preparing the same, a method for reducing erythrocyteolysis and hemagglutination using the compound, and a pharmaceutical agent containing the lipid nanomaterial. The present invention contains lysophosphatidylcholine or an ether derivative thereof as an active ingredient, and can be useful as a treatment agent for septicemia, bacterial infection diseases, and the like.

Abstract: A fan-out semiconductor package includes a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposite the active surface; an encapsulant encapsulating at least some portions of the first interconnection member and the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the semiconductor chip. The first interconnection member and the second interconnection member respectively include a plurality of redistribution layers electrically connected to the connection pads of the semiconductor chip, and the semiconductor chip has a groove defined in the active surface and between a peripheral edge of the semiconductor chip and the connection pads of the semiconductor chip.

Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the

Abstract: A fixing device comprising a fixing belt, a rotating member arranged to be in engagement with an outer circumferential surface of the fixing belt, a nip forming member to press the fixing belt, to form a fixing nip between the fixing belt and the rotating member, and sliding members on both ends of the fixing belt and to rotate together with the fixing belt.

Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the

Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the

Abstract: A fixing device including fixing belt, a heat source to heat the fixing belt, a rotating member in engagement with an outer circumferential surface of the fixing belt, a nip forming member to pressurize the fixing belt, thereby forming a fixing nip between the fixing belt and the rotating member, and sliding members on both ends of the fixing belt and rotated together with the fixing belt. A rotation center of each of the sliding members is on an upstream side compared to a rotation center of the rotating member along a feeding direction of a printing medium, and a shortest distance between a tangential line of an outer circumferential surface of each of the sliding members and the rotation center of the rotating member is equal to or greater than a shortest distance between the fixing nip and the rotation center of the rotating member.

Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the

Abstract: A fan-out semiconductor package includes a redistribution layer, the redistribution layer including a first insulating layer, a first wiring disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the first wiring, a line via passing through the second insulating layer continuously and connected to the first wiring, and a second wiring disposed on the second insulating layer and connected to the line via; a semiconductor chip disposed on one side of the redistribution layer, and having an electrode pad electrically connected to the first wiring, the second wiring, and the line via; and an encapsulant disposed on the one side of the redistribution layer, and encapsulating the semiconductor chip.

Abstract: A fan-out semiconductor package includes a first interconnection member having a through-hole; a semiconductor chip disposed in the through-hole of the first interconnection member and having an active surface having connection pads disposed thereon and an inactive surface opposite the active surface; an encapsulant encapsulating at least some portions of the first interconnection member and the semiconductor chip; and a second interconnection member disposed on the first interconnection member and the semiconductor chip. The first interconnection member and the second interconnection member respectively include a plurality of redistribution layers electrically connected to the connection pads of the semiconductor chip, and the semiconductor chip has a groove defined in the active surface and between a peripheral edge of the semiconductor chip and the connection pads of the semiconductor chip.

Abstract: A fan-out semiconductor package module includes: a fan-out semiconductor package including a first interconnection member having a through-hole, a semiconductor chip disposed in the through-hole, an encapsulant encapsulating at least portions of the first interconnection member and the semiconductor chip, a second interconnection member disposed on the first interconnection member and the semiconductor chip, a third interconnection member disposed on the encapsulant, first connection terminals disposed on the second interconnection member, and second connection terminals disposed on the third interconnection member, the first to third interconnection members including, respectively, redistribution layers electrically connected to connection pads of the semiconductor chip; and a component package stacked on the fan-out semiconductor package and including a wiring substrate connected to the second interconnection member through the first connection terminals and a plurality of mounted components mounted on the

Abstract: A fan-out semiconductor package include a frame having a through hole; a semiconductor chip disposed in the through hole, and having an active surface, an inactive surface, and a side surface; an encapsulant disposed on one sides of the frame and the semiconductor chip, and in a space between the frame and the semiconductor chip in the through hole, a first conductive layer disposed on a sidewall of the through hole, a second conductive layer disposed on one side of the frame, and connected to the first conductive layer, a line via passing through the encapsulant, and connected to the second conductive layer, and a third conductive layer covering at least the inactive surface of the semiconductor chip on the encapsulant, and connected to the line via.

Abstract: A fan-out semiconductor package includes a redistribution layer, the redistribution layer including a first insulating layer, a first wiring disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the first wiring, a line via passing through the second insulating layer continuously and connected to the first wiring, and a second wiring disposed on the second insulating layer and connected to the line via; a semiconductor chip disposed on one side of the redistribution layer, and having an electrode pad electrically connected to the first wiring, the second wiring, and the line via; and an encapsulant disposed on the one side of the redistribution layer, and encapsulating the semiconductor chip.

Abstract: A belt type fixing apparatus comprises: a fixing roller; a fixing belt which is installed to be opposite to the fixing roller; a nip forming member which is installed inside the fixing belt and supports the fixing belt so that the fixing belt can contact the fixing roller to form a fixing nip; a pair of sliding members which are installed to support both ends of the fixing belt and are rotated by the fixing belt; a pair of flange members which rotatably support the pair of sliding members; and a heat source which is installed inside the fixing belt and generates heat, wherein the rotation center of the pair of sliding members is located upstream in the transportation direction of printed matter compared to the rotation center of the fixing roller.

Abstract: A belt type fixing apparatus comprises: a fixing roller; a fixing belt which is installed to be opposite to the fixing roller; a nip forming member which is installed inside the fixing belt and supports the fixing belt so that the fixing belt can contact the fixing roller to form a fixing nip; a pair of sliding members which are installed to support both ends of the fixing belt and are rotated by the fixing belt; a pair of flange members which rotatably support the pair of sliding members; and a heat source which is installed inside the fixing belt and generates heat, wherein the rotation center of the pair of sliding members is located upstream in the transportation direction of printed matter compared to the rotation center of the fixing roller.