Patents by Inventor Jin-Shan Pan

Jin-Shan Pan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9854141
    Abstract: A thin optical imaging module of a biometric apparatus includes a first glass substrate, a first optical prism film, a second optical prism film, and an image sensor. The first glass substrate further includes a fingerprint imaging area, a vein imaging area, a contact surface, a reflective interface, and an attaching surface. The first optical prism film adhered to the attaching surface is located under the fingerprint imaging area. The second optical prism film is adhered to a position under the first optical prism film. The image sensor disposed in correspondence to the first glass substrate is located under the attaching surface.
    Type: Grant
    Filed: January 29, 2015
    Date of Patent: December 26, 2017
    Assignee: TrueLight Corporation
    Inventors: Chia Ching Chang Chien, Chih Cheng Chen, Zhi Kuei Huang, Jin Shan Pan
  • Patent number: 9830498
    Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing biometric authentication by providing clear images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather a vein image and a fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data.
    Type: Grant
    Filed: December 21, 2015
    Date of Patent: November 28, 2017
    Assignee: TrueLight Corporation
    Inventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
  • Publication number: 20160227081
    Abstract: A thin optical imaging module of a biometric apparatus includes a first glass substrate, a first optical prism film, a second optical prism film, and an image sensor. The first glass substrate further includes a fingerprint imaging area, a vein imaging area, a contact surface, a reflective interface, and an attaching surface. The first optical prism film adhered to the attaching surface is located under the fingerprint imaging area. The second optical prism film is adhered to a position under the first optical prism film. The image sensor disposed in correspondence to the first glass substrate is located under the attaching surface.
    Type: Application
    Filed: January 29, 2015
    Publication date: August 4, 2016
    Applicant: TrueLight Corporation
    Inventors: Chia Ching CHANG CHIEN, Chih Cheng CHEN, Zhi Kuei HUANG, Jin Shan PAN
  • Publication number: 20160104028
    Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing a better biometric authentication by providing clearer images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather the vein image and the fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data. Therefore, the biometric authentication device can achieve an approach in lowering hardware costs, simplifying circuit designs and providing an outstanding performance.
    Type: Application
    Filed: December 21, 2015
    Publication date: April 14, 2016
    Applicant: TrueLight Corporation
    Inventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
  • Patent number: 9293893
    Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: March 22, 2016
    Assignee: TrueLight Corporation
    Inventors: Jin-Shan Pan, Chih-Cheng Chen, Hsiu-Ming Hsieh
  • Patent number: 9245164
    Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing a better biometric authentication by providing clearer images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather the vein image and the fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data. Therefore, the biometric authentication device can achieve an approach in lowering hardware costs, simplifying circuit designs and providing an outstanding performance.
    Type: Grant
    Filed: March 7, 2013
    Date of Patent: January 26, 2016
    Assignee: TrueLight Corporation
    Inventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
  • Publication number: 20150078412
    Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
    Type: Application
    Filed: September 19, 2014
    Publication date: March 19, 2015
    Applicant: TrueLight Corporation
    Inventors: Jin-Shan Pan, Chih-Cheng Chen, Hsiu-Ming Hsieh
  • Patent number: 8786073
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8786074
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: October 23, 2012
    Date of Patent: July 22, 2014
    Assignee: TrueLight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Publication number: 20140086459
    Abstract: A biometric authentication device uses IR-VCSELs as light sources for performing a better biometric authentication by providing clearer images. A light guide module is introduced to minimize the size of the device. Moreover, the biometric authentication device uses a single image sensing module to gather the vein image and the fingerprint image into the same detection signal which is then analyzed and compared with the pre-stored vein feature data and fingerprint feature data. Therefore, the biometric authentication device can achieve an approach in lowering hardware costs, simplifying circuit designs and providing an outstanding performance.
    Type: Application
    Filed: March 7, 2013
    Publication date: March 27, 2014
    Applicant: TrueLight Corporation
    Inventors: Jin Shan Pan, Chih Cheng Chen, Chia Ching Chang Chien
  • Patent number: 8679873
    Abstract: The present invention discloses a method for fabricating a heat-resistant, humidity-resistant oxide-confined vertical-cavity surface-emitting laser (VCSEL) by slowing down the oxidizing rate during a VCSEL oxidation process to thereby reduce stress concentration of an oxidation layer and by preventing moisture invasion using a passivation layer disposed on a laser window. The VCSEL device thus fabricated is heat-resistant, humidity-resistant, and highly reliable. In a preferred embodiment, the oxidation process takes place at an oxidizing rate of less than 0.4 ?m/min, and the passivation layer is a SiON passivation layer.
    Type: Grant
    Filed: December 11, 2009
    Date of Patent: March 25, 2014
    Assignee: TrueLight Corp.
    Inventors: Jin Shan Pan, Cheng Ju Wu, I Han Wu, Kuo Fong Tseng
  • Patent number: 8658961
    Abstract: A submount is used for disposing an illuminant element or a light-receiving element having an optical axis. The submount is disposed at a plane and has a main body. The main body includes a first surface and a second surface. The first surface is approximately parallel to the plane and far away from the plane. The second surface is approximately parallel to the plane and adjacent to the plane. A disposing part of the first surface is tilted with respect to the second surface at a predetermined angle. The illuminant element or the light-receiving element is disposed on the disposing part. The optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.
    Type: Grant
    Filed: August 5, 2011
    Date of Patent: February 25, 2014
    Assignee: True Light Corporation
    Inventors: Chih-Cheng Chen, Jin-Shan Pan
  • Patent number: 8653438
    Abstract: A light source unit is disclosed for arranging on a plane and emitting a light beam oblique to the plane. The light source unit includes an illuminant element and a transparent encapsulator. The illuminant element has an upper surface and a lower surface both parallel to the plane. The transparent encapsulator physically contacts with the illuminant element and at least covers the upper surface of the illuminant element. The transparent encapsulator has an oblique surface above the upper surface and oblique to the upper surface. In addition, an optical inputting module having the light source unit mentioned above is disclosed.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: February 18, 2014
    Assignee: True Light Corporation
    Inventors: Chih-Cheng Chen, Jin-Shan Pan
  • Publication number: 20130308672
    Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 21, 2013
    Applicant: TruLight Corporation
    Inventors: Jin-Shan PAN, Chih-Cheng CHEN, Hsiu-Ming HSIEH
  • Patent number: 8530358
    Abstract: The present invention discloses a manufacturing method of vertical cavity surface emitting laser. The method includes following steps: providing a substrate; forming an epitaxial layer stack including an aluminum-rich layer; forming an ion-doping mask including a ring-shaped opening; doping ions in the epitaxial layer stack through the ring-shaped opening and forming a ring-shaped ion-doped region over the aluminum-rich layer; forming an etching mask on the ion-doping mask for covering the ring-shaped opening of the ion-doping mask; etching the epitaxial layer stack through the etching mask and ion-doping mask for forming an island platform; oxidizing the aluminum-rich layer for forming a ring-shaped oxidized region. In addition, the present invention also discloses a vertical cavity surface emitting laser manufactured by the above mentioned method.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: September 10, 2013
    Assignee: True Light Corporation
    Inventors: Po-Han Chen, Cheng-Ju Wu, Jin-Shan Pan
  • Publication number: 20130064263
    Abstract: The present invention discloses a manufacturing method of vertical cavity surface emitting laser. The method includes following steps: providing a substrate; forming an epitaxial layer stack including an aluminum-rich layer; forming an ion-doping mask including a ring-shaped opening; doping ions in the epitaxial layer stack through the ring-shaped opening and forming a ring-shaped ion-doped region over the aluminum-rich layer; forming an etching mask on the ion-doping mask for covering the ring-shaped opening of the ion-doping mask; etching the epitaxial layer stack through the etching mask and ion-doping mask for forming an island platform; oxidizing the aluminum-rich layer for forming a ring-shaped oxidized region. In addition, the present invention also discloses a vertical cavity surface emitting laser manufactured by the above mentioned method.
    Type: Application
    Filed: September 13, 2011
    Publication date: March 14, 2013
    Inventors: Po-Han CHEN, Cheng-Ju WU, Jin-Shan PAN
  • Publication number: 20130032701
    Abstract: A submount is used for disposing an illuminant element or a light-receiving element having an optical axis. The submount is disposed at a plane and has a main body. The main body includes a first surface and a second surface. The first surface is approximately parallel to the plane and far away from the plane. The second surface is approximately parallel to the plane and adjacent to the plane. A disposing part of the first surface is tilted with respect to the second surface at a predetermined angle. The illuminant element or the light-receiving element is disposed on the disposing part. The optical axis of the illuminant element or the light-receiving element is tiled with respect to a normal of the second surface at the predetermined angle.
    Type: Application
    Filed: August 5, 2011
    Publication date: February 7, 2013
    Inventors: Chih-Cheng CHEN, Jin-Shan Pan
  • Publication number: 20130015334
    Abstract: A light source unit is disclosed for arranging on a plane and emitting a light beam oblique to the plane. The light source unit includes an illuminant element and a transparent encapsulator. The illuminant element has an upper surface and a lower surface both parallel to the plane. The transparent encapsulator physically contacts with the illuminant element and at least covers the upper surface of the illuminant element. The transparent encapsulator has an oblique surface above the upper surface and oblique to the upper surface. In addition, an optical inputting module having the light source unit mentioned above is disclosed.
    Type: Application
    Filed: September 21, 2011
    Publication date: January 17, 2013
    Inventors: Chih-Cheng CHEN, Jin-Shan Pan
  • Patent number: 8324722
    Abstract: A packaging device for matrix-arrayed semiconductor light-emitting elements of high power and high directivity comprises a metal base, an array chip and a plurality of metal wires. The metal base is of highly heat conductive copper or aluminum, and a first electrode area and at least one second electrode area which are electrically isolated are disposed on the metal base. The array chip is disposed on the first electrode area, on which multiple matrix-arranged semiconductor light-emitting elements and at least one wire bond pad adjacent to the light-emitting elements are disposed. The light-emitting element is a VCSEL element, an HCSEL element or an RCLED element. The metal wires are connected between the wire bond pad and the second electrode area to transmit power signals. Between the bottom surface and the first electrode area is disposed a conductive adhesive to bond and facilitate electrical connection between the two.
    Type: Grant
    Filed: January 14, 2010
    Date of Patent: December 4, 2012
    Assignee: Truelight Corporation
    Inventors: Cheng Ju Wu, Hung-Che Chen, I Han Wu, Shang-Cheng Liu, Jin Shan Pan
  • Patent number: 8121167
    Abstract: A dual wavelength laser device including a cap, a header, a first laser chip and a second laser chip. The cap includes a cap body and a lens embedded on the cap body. The header forms an accommodating space with the cap. The first laser chip is arranged in the accommodating space and emitting a first laser beam toward the lens. The second laser chip is arranged in the accommodating space and emitting a second laser beam toward the lens.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: February 21, 2012
    Assignee: Truelight Corporation
    Inventors: Jin-Shan Pan, Shang-Cheng Liu, Cheng-Ju Wu, Chang-Cherng Wu