Patents by Inventor Jin Son

Jin Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130063440
    Abstract: Provided is a graphics processing method and apparatus using a post fragment shader. A rendering pipeline of the graphics processing apparatus may include a fragment shader that operates before a raster operator, and a post fragment shader that operates after the raster operator. Each of the fragment shader and the post fragment shader may apply a different effect to each of a plurality of fragments.
    Type: Application
    Filed: April 10, 2012
    Publication date: March 14, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Jin SON, Seok Yoon Jung, Shi Hwa Lee, Sang Oak Woo
  • Patent number: 8387376
    Abstract: A hydraulic system with an improved complex operation is provided, which can prevent the generation of shock in a boom by delaying pressure supply during start and end of pilot signal pressure supplied to a spool for controlling an option device when a boom ascending operation and an operation of an option device are simultaneously performed or when such a simultaneous operation of the boom and the option device switches over to an independent operation of the boom.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: March 5, 2013
    Assignee: Vovlvo Construction Equipment Holding Sweden AB
    Inventor: Young Jin Son
  • Publication number: 20130049052
    Abstract: A light emitting device package may be provided that includes: a package body which includes a first cavity and a second cavity which are formed to be depressed in at least a portion of the package body; a first light emitting device and a second light emitting device, each of which is disposed in the first cavity and the second cavity respectively; and a first fluorescent substance and a second fluorescent substance, each of which is filled in the first cavity and the second cavity respectively.
    Type: Application
    Filed: August 30, 2012
    Publication date: February 28, 2013
    Inventor: Won Jin SON
  • Publication number: 20120320598
    Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.
    Type: Application
    Filed: August 30, 2012
    Publication date: December 20, 2012
    Applicant: LG INNOTEK CO., LTD.
    Inventor: WON JIN SON
  • Patent number: 8272764
    Abstract: A fluorescent lamp type light emitting apparatus is provided. The light emitting apparatus comprises a cover, a light emitting module, radiation pads, and cap parts. The cover comprises a first cover and a transmissive second cover coupled to the first cover. The light emitting module comprises a plurality of light emitting diodes in the cover. The radiation pads are disposed on the light emitting module. The cap parts comprise electrode terminals at both ends of the cover.
    Type: Grant
    Filed: September 28, 2009
    Date of Patent: September 25, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Won Jin Son
  • Publication number: 20120187365
    Abstract: Provided are a light emitting device, a method of fabricating the light emitting device, a light emitting device package, and a lighting system. The light emitting device comprises a first conductive type semiconductor layer, a light emitting layer over the first conductive type semiconductor layer, an electron blocking layer over the light emitting layer, and a second conductive type semiconductor layer over the electron blocking layer. The electron blocking layer comprises a pattern having a height difference.
    Type: Application
    Filed: January 25, 2012
    Publication date: July 26, 2012
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Jong Pil JEONG, Jung Hyun HWANG, Chong Cook KIM, Sung Jin SON
  • Publication number: 20120167983
    Abstract: A composite light converter for polycrystalline silicon solar cell and silicon solar cell using the converter includes a composite light converter disposed on the surface of a polycrystalline solar cell and connected by the electrode ribbon; upper and lower ethylene-vinyl acetate (EVA) sheets disposed such that the solar cell and the composite light converter are disposed between the EVA sheets; a low iron tempered glass disposed on the upper EVA sheet to transmit light; and a back sheet disposed under the lower EVA sheet and formed of a fluorine film or a PET film. Here, the composite light converter is a polymer binder containing light-emitting components, in which a polymer layer is formed on the surface of a polycrystalline silicon wafer comprising an electrode; the polymer layer is formed of two types of nano inorganic components that are active filling materials inside the converter.
    Type: Application
    Filed: July 22, 2010
    Publication date: July 5, 2012
    Inventors: Sung Mea Cho, Jae Suk Sung, Man Woong Park, Ko Yeon Choo, Suck Jin Son, Tae Bum Lee, Soshchin Naum
  • Patent number: 8203163
    Abstract: Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: June 19, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventors: Bum Chul Cho, Geun Ho Kim, Sung Jin Son, Jin Soo Park
  • Publication number: 20120138994
    Abstract: A light emitting device according to an embodiment of the present invention includes a first conductive semiconductor layer providing a roughness on a upper surface thereof and including a PEC etching control layer; an active layer under the first conductive semiconductor layer; a second conductive semiconductor layer under the active layer; a reflective electrode electrically connected to the second conductive semiconductor layer; and a first electrode electrically connected to the first conductive semiconductor layer.
    Type: Application
    Filed: February 9, 2012
    Publication date: June 7, 2012
    Inventors: Dae Sung KANG, Rak Jun Choi, Sung Hoon Jung, Young Hun Han, Sung Jin Son
  • Publication number: 20120125948
    Abstract: Disclosed is a cardboard tube container of which the contents can be refilled, which comprises a cardboard tube body which has a space for accommodating a content; a fixture part which is engaged to an inner, upper side of the cardboard tube body and has a protrusion formed along an upper, outer circumferential surface; a pouch which is secured to a lower side of the fixture part and accommodates a content and is detachable from the fixture part for an exchange of itself when a content is all consumed; a pumping member which is secured to an upper side of the fixture part and serves to discharge the content stored in the pouch to the outside by way of a pumping operation and is detachable from the cardboard tube body; and a cardboard tube cap which is secured to an upper side of the cardboard tube body.
    Type: Application
    Filed: January 31, 2012
    Publication date: May 24, 2012
    Applicant: YONWOO CO., LTD.
    Inventors: Su-Jin SON, Joong-Gu KIM
  • Publication number: 20120081370
    Abstract: A method and apparatus for processing a vertex may fetch pieces of position information of vertexes, may extract pieces of target position information from the fetched pieces of position information, may perform tile binning on the pieces of target position information, may fetch pieces of attribute information having same indexes as the pieces of target position information, and may shade the fetched pieces of attribute information.
    Type: Application
    Filed: July 14, 2011
    Publication date: April 5, 2012
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyoung June MIN, Seok Yoon Jung, Chan Min Park, Sung Jin Son
  • Publication number: 20120069021
    Abstract: A method to discard pixels early includes a first early depth test maintaining a depth value on a pixel to be discarded by a discard instruction, and a second early depth test updating the depth value on a pixel not to be discarded by the discard instruction. Because of the first and second early depth tests, a number of pixels to be processed by a pixel shading process may be reduced.
    Type: Application
    Filed: May 31, 2011
    Publication date: March 22, 2012
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Jin Son, Seok Yoon Jung, Chan Min Park, Kyoung June Min, Sang Oak Woo
  • Publication number: 20120069545
    Abstract: A lighting device may be provided that includes a heat sink which includes one surface and a receiving recess; a light emitting module which is disposed on the one surface of the heat sink and includes a substrate and a plurality of light sources disposed on the substrate, wherein the substrate includes a hole and a plurality of via-holes; a power controller which includes an electrode pin electrically connected to the light emitting module through the via hole; and aninsulating inner case which receives the power controller therein and is disposed in the receiving recess of the heat sink, wherein the light sources include an lighting emitting diode.
    Type: Application
    Filed: November 2, 2011
    Publication date: March 22, 2012
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Tae Young CHOI, Won Jin SON, Dong Nyung LIM, Jung Ha HWANG, Seung Yeon LEE, Cheon Joo KIM, Sung Ho KIM
  • Patent number: 8115214
    Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.
    Type: Grant
    Filed: February 23, 2007
    Date of Patent: February 14, 2012
    Assignee: LG Innotek Co., Ltd.
    Inventor: Won-Jin Son
  • Publication number: 20110309391
    Abstract: Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.
    Type: Application
    Filed: September 5, 2008
    Publication date: December 22, 2011
    Applicant: LG INNOTEK CO., LTD
    Inventors: Bum Chul Cho, Geun Ho Kim, Sung Jin Son, Jin Soo Park
  • Publication number: 20110186580
    Abstract: The present invention is related to a reinforcing member for a membrane for improving the pressure-withstanding property of the membrane having corrugations, and a membrane assembly having the reinforcing member and a method of constructing the membrane assembly. By providing a reinforcing member for a membrane having corrugations and installed in an insulating structural member of an LNG cargo, the present invention can prevent the collapse of the corrugation and attenuate shocks against a same load without increasing the facial rigidity of the corrugation, and improve the insulating property by forming an additional insulating layer.
    Type: Application
    Filed: March 3, 2009
    Publication date: August 4, 2011
    Applicant: SAMSUNG HEAVY IND. CO., LTD.
    Inventors: Ki-Hun Joh, Sang-Eon Chun, Chang-Seon Bang, Dai-Gil Lee, Byung-Chul Kim, Bu-Gi Kim, Jin-Gyu Kim, Soon-Ho Yoon, Sang-Wook Park, Kwan-Ho Lee, Seong-Su Kim, Byoung-Jung Kim, Po-Chul Kim, Na-Na Yu, Yong-Suk Suh, Sang-Min Han, Jong-Won Yoon, Jae-Yeon Choi, Hee-Jin Son
  • Publication number: 20110187714
    Abstract: Provided is an image processing apparatus. Ray tracing may be performed using a general scheme with respect to a plurality of reference pixels among pixels of an image to be rendered. With respect to a pixel excluding the reference pixels, geometry information may be interpolated based on a ray tracing result of adjacent reference pixels.
    Type: Application
    Filed: December 15, 2010
    Publication date: August 4, 2011
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan Min PARK, Sung Jin Son, In Sung Ihm, Duk Hyun Cha
  • Patent number: 7960818
    Abstract: In accordance with the present invention, there is provided a punch quad flat no leads (QFN) semiconductor package including a leadframe wherein the leads of the leadframe are selectively half-etched so that only one or more prescribed leads may be electrically connected to a conformal shield applied to the package body of the semiconductor package. The conformal shield may be electrically connected to the exposed lead(s) alone, or in combination with one or more tie bars of the leadframe. In one embodiment, outer end portions of the top surfaces of the leads of the semiconductor package are alternately exposed and non-exposed, with the non-exposed leads including a top side half-etch which causes the same to be effectively covered by the package body of the semiconductor package.
    Type: Grant
    Filed: March 4, 2009
    Date of Patent: June 14, 2011
    Assignee: Amkor Technology, Inc.
    Inventors: Terry W. Davis, Sun Jin Son
  • Patent number: 7956378
    Abstract: Provided is a light emitting diode package and a method of manufacturing the same. The light emitting diode package includes a package main body with a cavity, a plurality of light emitting diode chips, a wire, and a plurality of lead frames. The plurality of light emitting diode chips are mounted in the cavity. The wire is connected to an electrode of at least one light emitting diode chip. The plurality of lead frames are formed in the cavity, and at least one lead frame is electrically connected to the light emitting diode chip or a plurality of wires.
    Type: Grant
    Filed: May 3, 2010
    Date of Patent: June 7, 2011
    Assignee: LG Innotek Co., Ltd.
    Inventor: Won-Jin Son
  • Patent number: 7866247
    Abstract: An automatic shooting mechanism capable of remote switching and unmanned switching between a safety mode and a shooting mode, and remote shooting and unmanned shooting. Also provided is a sentry robot employing the automatic shooting mechanism and capable of performing wide and narrow monitoring and sentry duties in short and long ranges, and automatically shooting at a target. The automatic shooting mechanism comprises a safety unit including a safety solenoid and an elastic member to move a safety pin of a gun between a safety mode position and a shooting mode position, a return unit for applying force to the safety pin of the gun to move the safety pin to the safety mode position.
    Type: Grant
    Filed: December 10, 2009
    Date of Patent: January 11, 2011
    Assignee: Samsung Techwin Co., Ltd.
    Inventors: Tae-jin Son, Jun-yeoul Ko