Patents by Inventor Jin Sub Lee

Jin Sub Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240153095
    Abstract: A side outer extraction method may include receiving, by at least one processor, an image, of a vehicle, preprocessed from three-dimensional (3D) data from a computer-aided design (CAD) module, detecting, using an artificial intelligence model, a classification value and a bounding box for each region, of a plurality of regions, corresponding to one of a plurality of target references of the preprocessed image, transmitting, to the CAD module, a signal indicating the classification value and the bounding box for each region of the plurality of regions, and causing extraction, by the CAD module, of the plurality of target references from the classification value and the bounding box for each region of the plurality of regions, based on the received signal.
    Type: Application
    Filed: August 7, 2023
    Publication date: May 9, 2024
    Inventors: SungHyun Park, Sang Hwan Jun, Jee-Hyong Lee, Eun-Ho Lee, Tae-Hyun Kim, Jin Sub Lee
  • Publication number: 20240145719
    Abstract: A binder solution for an all-solid-state battery, an electrode slurry for an all-solid-state battery including the same and a method of manufacturing an all-solid-state battery using the same, and more particularly to a binder solution for an all-solid-state battery, in which a polymer binder configured such that a non-polar functional group is bonded to the end of a polar functional group is used, whereby the polar functional group is provided by a deprotection mechanism of the polymer binder through a thermal treatment, thus increasing adhesion between electrode materials to thereby improve battery capacity and enabling a wet process to thereby reduce manufacturing costs, an electrode slurry for an all-solid-state battery including the same and a method of manufacturing an all-solid-state battery using the same.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 2, 2024
    Applicants: HYUNDAI MOTOR COMPANY, Kia Corporation, Seoul National University R&DB Foundation
    Inventors: Sang Mo Kim, Sang Heon Lee, Yong Sub Yoon, Jae Min Lim, Ju Yeong Seong, Jin Soo Kim, Jang Wook Choi, Kyu Lin Lee, Ji Eun Lee
  • Publication number: 20240067065
    Abstract: Provided is a duct docking device for a ventilation seat of a vehicle. The duct docking device enables air to be easily blown to a seatback and a seat cushion with a passenger in a seat using only one blower by enabling a seatback duct mounted at the seatback and a seat cushion duct mounted at the seat cushion to be hermetically docked through a connector duct, etc. at an unfolded position of the seatback in which a passenger can sit, and by enabling the seatback duct mounted at the seatback and the seat cushion duct mounted at the seat cushion to be separated from each other at a folded position of the seatback in consideration of that there is no passenger in the seat.
    Type: Application
    Filed: December 21, 2022
    Publication date: February 29, 2024
    Inventors: Deok Soo Lim, Sang Hark Lee, Sang Soo Lee, Jung Sang You, Sang Do Park, Chan Ho Jung, Gun Chu Park, Gi Tae Jo, Jin Sik Kim, Hee Dong Yoon, Ho Sub Lim, Jae Hyun Park
  • Patent number: 11912674
    Abstract: The present invention provides methods for treating or ameliorating metabolic diseases, cholestatic liver diseases, or organ fibrosis, which comprises administering to a subject a therapeutically effective amount of a pharmaceutical composition comprising an isoxazole derivative, a racemate, an enantiomer, or a diastereoisomer thereof, or a pharmaceutically acceptable salt of the derivative, the racemate, the enantiomer, or the diastereoisomer.
    Type: Grant
    Filed: March 4, 2021
    Date of Patent: February 27, 2024
    Assignee: IL DONG PHARMACEUTICAL CO., LTD.
    Inventors: Jae-Hoon Kang, Hong-Sub Lee, Yoon-Suk Lee, Jin-Ah Jeong, Sung-Wook Kwon, Jeong-Guen Kim, Kyung-Sun Kim, Dong-Keun Song, Sun-Young Park, Kyeo-Jin Kim, Ji-Hye Choi, Hey-Min Hwang
  • Patent number: 11411145
    Abstract: A light-emitting element package is provided. The light-emitting element package includes light-emitting structures spaced from each other, the light-emitting structures including first, second and third light-emitting structures, each of the light-emitting structures being configured to emit light of a first color; a first wavelength conversion layer provided on the first light-emitting structure at a first position corresponding to the first light-emitting structure, the first wavelength conversion layer being configured to convert light of the first color into light of a second color; a first oxide film provided on the first wavelength conversion layer; and a second wavelength conversion layer disposed in the first oxide film at a second position corresponding to the second light-emitting structure, the second wavelength conversion layer being configured to convert light of the first color into light of a third color.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: August 9, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Sub Lee, Ju Yeon Jeong
  • Publication number: 20220198270
    Abstract: A neural network model training method and apparatus are provided. The method includes a first training operation of training the neural network model with original data, the first training operation including generating a first feature map for the original data, and generating a first class activation map for the original data from the generated first feature map, and a second training operation of training the neural network model with adversarial data transformed from the original data, the second training operation including generating a second feature map for the adversarial data, generating a second class activation map for the adversarial data from the generated second feature map, and training the neural network model so that the second class activation map follows the first class activation map based on logit pairing for the first and second class activation maps.
    Type: Application
    Filed: December 16, 2021
    Publication date: June 23, 2022
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jee Hyong LEE, Jin Sub LEE, Dong Eon JEONG
  • Patent number: 11296260
    Abstract: A light emitting device package including a partition structure having first and second surfaces, and first to third light emission windows penetrating through the first and second surfaces, a cell array including first to third light emitting devices on the first surface of the partition structure and overlapping the first to third light emission windows, each of the first to third light emitting devices including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, first and second wavelength conversion portions filling interiors of the first and second light emission windows, and having a meniscus-shaped interfaces, a first encapsulating portion including a light-transmissive organic film layer that fills the third light emission window and covers the first and second wavelength conversion portions, and a second encapsulating portion covering the first and second encapsulating portions and including a light-transmissive inorganic film layer.
    Type: Grant
    Filed: June 12, 2019
    Date of Patent: April 5, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Sub Lee, Deuk Seok Chung, Hye Seok Noh, Young Jin Choi
  • Publication number: 20210242374
    Abstract: A light-emitting element package is provided. The light-emitting element package includes light-emitting structures spaced from each other, the light-emitting structures including first, second and third light-emitting structures, each of the light-emitting structures being configured to emit light of a first color; a first wavelength conversion layer provided on the first light-emitting structure at a first position corresponding to the first light-emitting structure, the first wavelength conversion layer being configured to convert light of the first color into light of a second color; a first oxide film provided on the first wavelength conversion layer; and a second wavelength conversion layer disposed in the first oxide film at a second position corresponding to the second light-emitting structure, the second wavelength conversion layer being configured to convert light of the first color into light of a third color.
    Type: Application
    Filed: September 17, 2020
    Publication date: August 5, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Sub LEE, Ju Yeon JEONG
  • Patent number: 10770436
    Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: September 8, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-hye Yeon, Wan-tae Lim, Young-soo Park, Jung-sub Kim, Jin-sub Lee, Ha-nul Yoo, Hye-seok Noh
  • Patent number: 10763399
    Abstract: A light emitting device package includes a light emitting structure including a first light emitting cell, a second light emitting cell, and a third light emitting cell, each of the first to third light emitting cells including an active layer to emit light of a first wavelength in a first direction and being separated from each other in a second direction, orthogonal to the first direction, a first light adjusting portion including a first wavelength conversion layer in a first recess portion of the first light emitting cell, the first wavelength conversion layer to convert light of the first wavelength to light of a second wavelength, and a second light adjusting portion including a second wavelength conversion layer in a second recess portion of the second light emitting cell, the second wavelength conversion layer to convert light of the first wavelength to light of a third wavelength.
    Type: Grant
    Filed: August 23, 2017
    Date of Patent: September 1, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Gun Lee, Yong Il Kim, Young Soo Park, Jin Sub Lee, Wan Tae Lim
  • Patent number: 10714667
    Abstract: A method of manufacturing a light emitting device includes forming light emitting devices on a support portion, each of the light emitting devices including first to third light emitting cells respectively emitting light of different colors; supplying test power to at least a portion of the light emitting devices using a multi-probe; acquiring an image from the light emitted from the portion of the light emitting devices to which the test power is supplied using an image sensor; identifying normal light emitting devices of the portion of the light emitting devices by determining whether a defect is present in each of the light emitting devices of the portion of the light emitting devices by comparing the image acquired by the image sensor with a reference image; and based on the identifying step, measuring optical characteristics of each of the light emitting devices identified as normal of the portion of the light emitting devices.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: July 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hye Seok Noh, Young Jin Choi, Yong Il Kim, Han Kyu Seong, Dong Gun Lee, Jin Sub Lee
  • Patent number: 10707393
    Abstract: A light emitting device package including a cell array including first, second and third light emitting devices each including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, the cell array having a first surface and a second surface opposing the first surface, a light-transmissive substrate including a first wavelength conversion portion and a second wavelength conversion portion corresponding to the first light emitting device and the second light emitting device, respectively, and bonded to the first surface, and a eutectic bonding layer including a first light emitting window, a second light emitting window and a third light emitting window corresponding to the first light emitting device, the second light emitting device and the third light emitting device, respectively, and bonding the light-transmissive substrate and the first to third light emitting devices to each other may be provided.
    Type: Grant
    Filed: June 1, 2018
    Date of Patent: July 7, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Dong Gun Lee, Yong Il Kim, Han Kyu Seong, Ji Hye Yeon, Jin Sub Lee, Young Jin Choi
  • Publication number: 20200144458
    Abstract: A light emitting device package including a partition structure having first and second surfaces, and first to third light emission windows penetrating through the first and second surfaces, a cell array including first to third light emitting devices on the first surface of the partition structure and overlapping the first to third light emission windows, each of the first to third light emitting devices including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer, first and second wavelength conversion portions filling interiors of the first and second light emission windows, and having a meniscus-shaped interfaces, a first encapsulating portion including a light-transmissive organic film layer that fills the third light emission window and covers the first and second wavelength conversion portions, and a second encapsulating portion covering the first and second encapsulating portions and including a light-transmissive inorganic film layer.
    Type: Application
    Filed: June 12, 2019
    Publication date: May 7, 2020
    Inventors: Jin Sub LEE, Deuk Seok CHUNG, Hye Seok NOH, Young Jin CHOI
  • Publication number: 20200144327
    Abstract: A light emitting diode module includes a cell array including first to fourth light emitting diode cells, each cell having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, the cell array having a first surface and a second surface opposite to the first surface; first to fourth light adjusting portions on the second surface of the cell array to respectively correspond to the first to fourth light emitting diode cells, to provide red light, first green light, second green light, and blue light, respectively; light blocking walls between the first to fourth light adjusting portions to isolate the first to fourth light adjusting portions from one another; and an electrode portion on the first surface of the cell array, and electrically connected to the first to fourth light emitting diode cells to selectively drive the first to fourth light emitting diode cells.
    Type: Application
    Filed: June 27, 2019
    Publication date: May 7, 2020
    Inventors: Jin Sub LEE, Hye Seok NOH, Han Kyu SEONG, Young Jin CHOI
  • Patent number: 10622513
    Abstract: A semiconductor light emitting device includes a first light emitting portion including a first semiconductor stack, as well as a first lower dispersion Bragg reflector (DBR) layer and a first upper dispersion Bragg reflector (DBR) layer, disposed above and below the first semiconductor stack, a second light emitting portion including a second semiconductor stack, as well as a second lower dispersion Bragg reflector (DBR) layer and a second upper dispersion Bragg reflector (DBR) layer, disposed above and below the second semiconductor stack, a third light emitting portion including a third semiconductor stack, as well as a third lower dispersion Bragg reflector (DBR) layer and a third upper dispersion Bragg reflector (DBR) layer, disposed above and below the third semiconductor stack, a first bonding layer disposed between the first light emitting portion and the second light emitting portion, and a second bonding layer disposed between the second light emitting portion and the third light emitting portion.
    Type: Grant
    Filed: June 19, 2018
    Date of Patent: April 14, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong Gun Lee, Yong Il Kim, Jin Sub Lee
  • Patent number: 10607877
    Abstract: A chip mounting method includes providing a first substrate including a light transmissive substrate having first and second surfaces, a sacrificial layer provided on the first surface, and a plurality of chips bonded to the sacrificial layer, obtaining first mapping data by testing the chips, the first mapping data defining coordinates of normal chips and defective chips among the chips, disposing a second substrate below the first surface, disposing the normal chips on the second substrate by radiating a first laser beam to positions of the sacrificial layer corresponding to the coordinates of the normal chips, based on the first mapping data, to remove portions of the sacrificial layer thereby separating the normal chips from the light transmissive substrate, and mounting the normal chips on the second substrate by radiating a second laser beam to a solder layer of the second substrate.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: March 31, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin Sub Lee, Han Kyu Seong, Yong Il Kim, Sung Hyun Sim, Dong gun Lee
  • Publication number: 20200066689
    Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 27, 2020
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Ji-hye YEON, Wan-tae LIM, Young-soo PARK, Jung-sub KIM, Jin-sub LEE, Ha-nul YOO, Hye-seok NOH
  • Patent number: 10497683
    Abstract: A light-emitting diode (LED) device configured to provide a multi-color display includes a plurality of light-emitting cells at least partially defined by a partition layer. The LED device may be configured to reduce optical interferences between the light-emitting cells. The LED device includes a plurality of light-emitting structures spaced apart from one another; a plurality of electrode layers on respective first surfaces of the light-emitting structures, a separation layer configured to electrically insulate the light-emitting structures from each other; phosphor layers on respective second surfaces of the light-emitting structures and associated with different colors, and a partition layer between the phosphor layers to separate the phosphor layers from one another. Each light-emitting cell may include a separate light-emitting structure, a separate set of one or more electrodes, and a separate phosphor layer.
    Type: Grant
    Filed: November 1, 2018
    Date of Patent: December 3, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Ji-hye Yeon, Wan-tae Lim, Young-soo Park, Jung-sub Kim, Jin-sub Lee, Ha-nul Yoo, Hye-seok Noh
  • Patent number: 10475972
    Abstract: A light-emitting diode (LED) package includes: a reflective structure including a cavity, a bottom portion having a through hole, and a sidewall portion surrounding the cavity and the bottom portion and having an inclined inner side surface; an electrode pad inserted into the through hole; an LED on the bottom portion in the cavity, the LED including a light-emitting structure electrically connected to the electrode pad and a phosphor formed on the light-emitting structure; and a lens structure filling the cavity and formed on the reflective structure.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: November 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jin-sub Lee, Yong-il Kim, Han-kyu Seong, Young-jin Choi
  • Publication number: 20190333964
    Abstract: A pixel of a light emitting diode module, display panel or other device, may comprise different colored sub-pixels, where one of the sub-pixels comprises a wavelength converting material, such as phosphor, to convert light emitted from an associated light emitting diode of that sub-pixel into a color other than the main color of light emitted from that sub-pixel. The wavelength converting material may have an amount selected to tune the color coordinates of the pixel. The amount of wavelength converting material may be determined in response to measuring the intensity of the spectrum of light emitted by the light emitting diode of the sub-pixel, or similarly manufactured sub-pixels, on which the wavelength converting material is to be formed. Methods of manufacturing the same are also disclosed.
    Type: Application
    Filed: July 5, 2019
    Publication date: October 31, 2019
    Inventors: Jin Sub LEE, Han Kyu SEONG, Yong Il KIM, Jung Sub KIM, Seul Gee LEE