Abstract: A display device including: a substrate; a conductive layer on the substrate and including a first voltage line and a second voltage line extending in a first direction; a first electrode and a second electrode on the conductive layer, extending in the first direction, and spaced apart from each other; a plurality of light-emitting elements on the first electrode and the second electrode; and an electrode pattern on the conductive layer and separated from the first electrode. The electrode pattern overlaps the first voltage line in a thickness direction and directly contacts the first voltage line.

Abstract: A pixel includes a first insulating film disposed on a substrate, a light emitting element disposed on the first insulating film, a second insulating film disposed on the light emitting element to cover at least a portion of the light emitting element, a first contact electrode and a second contact electrode, each of the first and second contact electrodes including at least a portion disposed on the first insulating film and connected to the light emitting element, and an encapsulation layer including a photosensitive material.

Abstract: Provided is a plated steel plate used for interior materials and exterior materials such as home appliances, construction materials, vehicles, etc., and a method for manufacturing same. The plated sheet plate includes: base steel; a Zn—Mg plating layer formed on the base steel; and a UV-curable film layer formed on the Zn—Mg plating layer, wherein a hairline pattern is formed on a surface of the Zn—Mg plating layer, and the Zn—Mg plating layer includes 8 to 27 weight % of Mg and a balance of Zn and inevitable impurities.

Abstract: Provided is an X-ray tube including a cathode structure, an anode spaced apart from the cathode structure, a spacer structure disposed between the cathode structure and the anode, and an external power supply connected to each of the cathode structure, the anode, and the spacer structure. Here, the spacer structure includes a first spacer disposed adjacent to the cathode structure and a second spacer disposed on the first spacer and disposed adjacent to the anode. The first spacer includes a first portion adjacent to the cathode structure and a second portion adjacent to a contact point of the first spacer and the second spacer. The second spacer includes a third portion adjacent to the contact point and a fourth portion adjacent to the anode. Each of the first portion and the third portion has a volume resistivity less than that of the second portion.

Abstract: A display device includes a display substrate, a main circuit board, and first and second connection circuit boards. The display substrate includes a base layer, an insulating layer on the base layer, a first signal line on the base layer, a second signal line on the base layer, a first pad exposed from the insulating layer and connected to the first signal line, and a second pad connected to a side surface of the second signal line and disposed on a side surface and a bottom surface of the base layer. The first connection circuit board electrically connects the first pad and the main circuit board, and the second connection circuit board electrically connects the second pad and the main circuit board.

Abstract: A method of manufacturing a semiconductor device having a semiconductor die within an extended substrate and a bottom substrate may include bonding a bottom surface of a semiconductor die to a top surface of a bottom substrate, forming an adhering member to a top surface of the semiconductor die, bonding an extended substrate to the semiconductor die and to the top surface of the bottom substrate utilizing the adhering member and a conductive bump on a bottom surface of the extended substrate and a conductive bump on the bottom substrate. The semiconductor die and the conductive bumps may be encapsulated utilizing a mold member. The conductive bump on the bottom surface of the extended substrate may be electrically connected to a terminal on the top surface of the extended substrate. The adhering member may include a laminate film, a non-conductive film adhesive, or a thermal hardening liquid adhesive.

Abstract: An image sensor including a semiconductor substrate having a first surface and a second surface; and a pixel isolation film extending from the first surface of the semiconductor substrate into the semiconductor substrate and defining active pixels in the semiconductor substrate, wherein the pixel isolation film includes a buried conductive layer including polysilicon containing a fining element at a first concentration; and an insulating liner between the buried conductive layer and the semiconductor substrate, and wherein the fining element includes oxygen, carbon, or fluorine.

Abstract: A nanocatalyst for methane dry reforming has a fluorite structure and has a plurality of transition metal or noble metal particles dispersed on a surface thereof. The nanocatalyst is represented by the Chemical Formula, A1-aCeaO2-?. In the Chemical Formula, A is selected from rare earth elements excluding Ce, and a and ? are real numbers of 0<a<1 and 0???1, respectively.

Abstract: A method performed by a biosystem comprising a biosensor kit and a biosensor kit analyzer is disclosed. According to an embodiment of the present disclosure, a method performed by a biosystem may include injecting a solution sample into the biosensor kit, the biosensor kit including a biosensor equipped with at least one metasurface element, based on the biosensor kit being inserted into the biosensor kit analyzer, injecting incident light into a lower region of the at least one metasurface element by the biosensor kit analyzer; obtaining a pattern image of output light changed by the at least one meta-surface element; obtaining, by the biosensor kit analyzer, a presence or absence and amount of biomaterial on the solution sample by inputting the pattern image into a pre-trained artificial intelligence model; and displaying the presence or absence and amount of the biomaterial on the solution sample.

Abstract: An image sensor including a semiconductor substrate having a first surface and a second surface; and a pixel isolation film extending from the first surface of the semiconductor substrate into the semiconductor substrate and defining active pixels in the semiconductor substrate, wherein the pixel isolation film includes a buried conductive layer including polysilicon containing a fining element at a first concentration; and an insulating liner between the buried conductive layer and the semiconductor substrate, and wherein the fining element includes oxygen, carbon, or fluorine.

Abstract: An example electronic device includes a housing; a touchscreen display; a microphone; at least one speaker; a button disposed on a portion of the housing or set to be displayed on the touchscreen display; a wireless communication circuit; a processor; and a memory. When a user interface is not displayed on the touchscreen display, the electronic device enables a user to receive a user input through the button, receives user speech through the microphone, and then provides data on the user speech to an external server. An instruction for performing a task is received from the server. When the user interface is displayed on the touchscreen display, the electronic device enables the user to receive the user input through the button, receives user speech through the microphone, and then provides data on the user speech to the external server.

Abstract: In one example, a semiconductor device can comprise a substrate, a device stack, first and second internal interconnects, and an encapsulant. The substrate can comprise a first and second substrate sides opposite each other, a substrate outer sidewall between the first substrate side and the second substrate side, and a substrate inner sidewall defining a cavity between the first substrate side and the second substrate side. The device stack can be in the cavity and can comprise a first electronic device, and a second electronic device stacked on the first electronic device. The first internal interconnect can be coupled to the substrate and the device stack. The encapsulant can cover the substrate inner sidewall and the device stack and can fill the cavity. Other examples and related methods are disclosed herein.

Abstract: The present invention relates to printing equipment for printing images such as letters, pictures and the like on the surface of metal such as a steel plate, that may stably print images on the surface of metal at high speed, a printing method using the same, and a printed metal material obtained therefrom.

Abstract: Provided is an unconstrained vibration damping metal sheet with foam pores. The unconstrained vibration damping metal sheet of the present invention comprises: a metal sheet; an organic-inorganic pretreatment layer containing an acrylic resin formed on the metal sheet; and a foam resin layer formed on the pretreatment layer, the foam resin layer containing, based on weight % thereof, a thermoplastic polyvinyl chloride resin: 40-80%, a plasticizer: 5-40%, a foaming agent: 0.1-10%, an oxide-based crosslinker: 1-4%, and spherical silica: 1-10%.

Abstract: Provided is a biomaterial removing device including an air injection part, a first processing part spaced apart from the air injection part, and a second processing part spaced apart from the air injection part with the first processing part therebetween, wherein the first processing part includes a first biomaterial removing part configured to remove biomaterials included in air collected from the air injection part and a first monitoring part, and the second processing part includes a second biomaterial removing part configured to remove the residual biomaterials and a second monitoring part, wherein the first biomaterial removing part includes a dry air purifier, the second biomaterial removing part includes a wet air purifier, and the first biomaterial removing part and the second biomaterial removing part each include an image sensor.

Abstract: The dishwasher of one embodiment comprises a tub, a sump, a wash pump, a rack, a nozzle disposed at a lower end of the rack, rotated by a repulsive force of wash water supplied from the wash pump, spraying wash water to a wash target, and having a magnetic object coupled to one end of the nozzle so that a first pole and a second pole of the magnetic object face a rotation direction of the nozzle, a sensing module that senses a magnetic force generated by the magnetic object generated by a rotation of the nozzle, and a controller receiving sensing results from the sensing module, and determining one or more of a rotation direction of the nozzle, a rotation speed of the nozzle and whether the nozzle rotates, to output an abnormality notification to a user or control wash water supplied to the nozzle through the wash pump.

Abstract: There is disclosed a sensor fixing member and a dishwasher including the sensor fixing member. A dishwasher may include a case defining an exterior and having an open front; a door sealing the open front of the case and comprising a door panel and a door cover covering the door panel; a nozzle spraying washing water into the case; a nozzle restriction detecting sensor provided inside the door and disposed at a height equal to the height of the nozzle from a bottom surface; and a sensor fixing member having one side coupled to the nozzle restriction detecting sensor and the other side coupled to the door.

Abstract: The present disclosure relates to a dishwasher.

Abstract: Provided is a manufacturing method of a stainless steel sheet having etching patterns. The method includes: coating a coating composition on a stainless steel sheet to form a coating layer; and forming a matte coated film layer, having an etching effect, on the coating layer. The coating composition comprises: 10 to 30 wt% of a silane-based compound, 0.5 to 6 wt% of an organic acid, 0.1 to 3 wt% of a vanadium compound, 0.1 to 3 wt% of a magnesium compound, and a remainder of a solvent.

Abstract: Provided are a constrained-type vibration-damping metal sheet having foam pores and a method for manufacturing same. The constrained-type vibration-damping metal sheet of the present invention comprises: a lower metal sheet; a foam resin film bonded to the lower metal sheet; and an upper metal sheet bonded to the foam resin film, wherein the foam resin film has foam pores comprising, by wt % of itself, 85-95% of a thermoplastic polyethylene resin having a number average molecular weight of 8000-12000, 0.1-1% of stearic acid, 1-5% of a styrene-ethylene-butadiene-styrene (SEBS) resin, 0.5-5% of a foaming agent, 1-4% of a dicumyl peroxide crosslinking agent, and 0.5-2% of ZnO foaming aid.