Abstract: A method of manufacturing a feedthrough having an enhanced hermetic sealing and used for a human implantable medical device such as a deep brain stimulator, a implantable AED, a implantable spinal cord stimulator and so on. Thus, more enhanced reproducibility and productivity in the diffusion welding and the laser hole machining may be guaranteed in the present method of manufacturing the feedthrough, compared to the conventional method using the ceramic metallizing and the brazing.

Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.

Abstract: A method of manufacturing a feedthrough having an enhanced hermetic sealing and used for a human implantable medical device such as a deep brain stimulator, a implantable AED, a implantable spinal cord stimulator and so on. Thus, more enhanced reproducibility and productivity in the diffusion welding and the laser hole machining may be guaranteed in the present method of manufacturing the feedthrough, compared to the conventional method using the ceramic metallizing and the brazing.

Abstract: A plasma light source apparatus includes a first laser generator configured to generate a first laser. A second laser generator is configured to generate a second laser. A chamber is configured to accommodate and seal a medium material for plasma ignition and to allow plasma to be ignited by the first laser and to be maintained by the second laser. An inner surface of the chamber includes two curved mirrors that face each other.

Abstract: A panel inspecting apparatus and method may accurately inspect image quality of a curved portion of a panel with relatively small inspecting cost and time, and the panel inspecting apparatus may have a relatively simple structure. The panel inspecting apparatus includes a support on which a panel is disposed, a mirror corresponding to a curved area of the panel, a lens configured to receive an image from the panel and an image reflected by the mirror and focus the images, and an image sensor configured to capture the images transferred via the lens.

Abstract: Disclosed is an alpha alumina (?-Al2O3) thin film comprising the lower layer formed on the base material made from cemented carbide; and the ?-Al2O3 thin film layer formed on the lower layer, wherein when the ?-Al2O3 thin film layer is divided, from the total thickness (T) thereof, into a D1 layer which is from an interface layer to 0.15T, a D2 layer which is from 0.15T to 0.4T, and a D3 layer which is from 0.4T to 1T, an S1 (D3 layer grain size/D1 layer grain size) is 2-5.5 and an S2 (D2 layer grain size/D1 layer grain size) is 1.5-4.

Abstract: A plasma light source apparatus includes a first laser generator configured to generate a first laser. A second laser generator is configured to generate a second laser. A chamber is configured to accommodate and seal a medium material for plasma ignition and to allow plasma to be ignited by the first laser and to be maintained by the second laser. An inner surface of the chamber includes two curved mirrors that face each other.

Abstract: Disclosed is a single-crystal ingot manufacturing apparatus, which includes a crucible in which a melt is accommodated, a heater configured to heat the crucible, a heat shield member configured to shield radiant heat from the heater and the melt, and a neck cover configured to encompass a seed crystal unit above the crucible with being introduced into an opening of the heat shield member, the radiant heat being not shielded in the opening, the neck cover being vertically moved in linkage to vertical movement of the seed crystal unit within a predetermined range.

Abstract: Provided is an ingot growing apparatus, which includes a crucible containing a silicon melt, a pulling device pulling a silicon single crystal ingot grown from the silicon melt, and a dopant supply unit disposed adjacent to the pulling device and for supplying a dopant during growing of the ingot. The neck portion may be doped at a concentration higher than that of the ingot through the dopant supply unit. Therefore, dislocation propagation velocity may be decreased and a propagation length may be shortened.

Abstract: Disclosed is an alpha alumina (?-Al2O3) thin film comprising the lower layer formed on the base material made from cemented carbide; and the ?-Al2O3 thin film layer formed on the lower layer, wherein when the ?-Al2O3 thin film layer is divided, from the total thickness (T) thereof, into a D1 layer which is from an interface layer to 0.15T, a D2 layer which is from 0.15T to 0.4T, and a D3 layer which is from 0.4T to 1T, an S1 (D3 layer grain size/D1 layer grain size) is 2-5.5 and an S2 (D2 layer grain size/D1 layer grain size) is 1.5-4.

Abstract: An optical module for surface inspection includes a first light source unit that illuminates a substrate with first light produced by a first light source and a first beam splitter that changes the path of the first light, a second light source unit that illuminates the substrate with second light polarized in a first direction, a direction of polarization changing unit that illuminates the substrate with the third light polarized in a second direction perpendicular to the first direction, and a detection unit that detects fourth light which is a product of the first light reflecting from the substrate, fifth light which is a product of the second light scattered from the substrate, and sixth light which is a product of the third light scattered from the substrate. The third light is produced by changing the direction of polarization of the second light reflected from the inspected substrate.

Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.

Abstract: A panel inspecting apparatus and method may accurately inspect image quality of a curved portion of a panel with relatively small inspecting cost and time, and the panel inspecting apparatus may have a relatively simple structure. The panel inspecting apparatus includes a support on which a panel is disposed, a mirror corresponding to a curved area of the panel, a lens configured to receive an image from the panel and an image reflected by the mirror and focus the images, and an image sensor configured to capture the images transferred via the lens.

Abstract: An optical module for surface inspection includes a first light source unit that illuminates a substrate with first light produced by a first light source and a first beam splitter that changes the path of the first light, a second light source unit that illuminates the substrate with second light polarized in a first direction, a direction of polarization changing unit that illuminates the substrate with the third light polarized in a second direction perpendicular to the first direction, and a detection unit that detects fourth light which is a product of the first light reflecting from the substrate, fifth light which is a product of the second light scattered from the substrate, and sixth light which is a product of the third light scattered from the substrate. The third light is produced by changing the direction of polarization of the second light reflected from the inspected substrate.

Abstract: Disclosed is a hybrid pole bearingless switched reluctance motor (BLSRM). The BLSRM includes a stator provided with windings, a rotor rotating about an axis when current is conducted to the windings. The rotor includes a plurality of rotor poles extending radially outward, and the stator includes a plurality of stator poles extending radially inward. The windings include suspending windings to generate radial force for the rotor and torque windings to generate torque. The suspending windings are mutually separated from the torque windings. Through the use of the hybrid pole BLSRM, a stator pole generating the radial force can be controlled independently from the stator pole generating the torque by separately arranging the stator pole generating the radial force and the stator pole generating torque based on the analysis of radial force and torque characteristics according to the position of the stator poles.

Abstract: A wafer unloading system and wafer processing equipment (system) including the same are disclosed. The wafer unloading system includes a fluid supply tube for supplying a fluid, a nozzle for injecting the supplied fluid, and an injection hole defined in a plate to allow the injected fluid to reach a space between a polishing pad and a wafer.

Abstract: Disclosed is a single-crystal ingot manufacturing apparatus, which includes a crucible in which a melt is accommodated, a heater configured to heat the crucible, a heat shield member configured to shield radiant heat from the heater and the melt, and a neck cover configured to encompass a seed crystal unit above the crucible with being introduced into an opening of the heat shield member, the radiant heat being not shielded in the opening, the neck cover being vertically moved in linkage to vertical movement of the seed crystal unit within a predetermined range.

Abstract: Provided is an ingot growing apparatus, which includes a crucible containing a silicon melt, a pulling device pulling a silicon single crystal ingot grown from the silicon melt, and a dopant supply unit disposed adjacent to the pulling device and for supplying a dopant during growing of the ingot. The neck portion may be doped at a concentration higher than that of the ingot through the dopant supply unit. Therefore, dislocation propagation velocity may be decreased and a propagation length may be shortened.

Abstract: Disclosed here is a speed control apparatus for a switched reluctance motor (SRM) including: a current control unit generating command currents for each period; a driving unit generating a pulse width modulation (PWM) signal to allow a voltage to be applied to the SRM; a magnetic flux error calculating unit calculating a magnetic flux error; a rotor position estimating unit calculating an estimation position using the magnetic flux error to output the estimation position to the magnetic flux error calculating unit; and a mode change-over unit allowing a command position corresponding to a command speed to be input to the magnetic flux error calculating unit.

Abstract: Disclosed is a method for suppressing a speed ripple occurring during an operation of an AC motor by using a torque compensator based on an activation function. The method includes the steps of calculating a speed error ?err based on a reference speed ?ref and an actual speed ?act; calculating a controller output Trm by using the speed error ?err as an input of a PI control and an operation of a compensated torque Tcom; and determining a torque variation based on the controller output Trm and a reference torque Tref and operating the torque variation in relation to an anti-windup gain Ka to use torque variation as an input of an integral (I) control. The method suppresses the speed ripple by compensating for the torque ripple through a controller which calculates the compensated torque by taking the signs of the speed error and the differential speed error into consideration.