Abstract: A core body temperature measurement device includes a body and an operation unit. The body is fixed to an ear canal of user. The operation unit is combined with a front side of the body, and is configured to be exposed to the ear canal or to be concealed inside, and has a sensor part. the sensor part measures a core body temperature of user when the operation unit is exposed to the ear canal.

Abstract: In a thin film electrode separation method using thermal expansion coefficient, a first solution is coated on a substrate. The first solution coated on the substrate is hardened. The substrate is left in a predetermined time, to form a first thin film having a first thermal expansion coefficient on the substrate. A photoresist is coated on the substrate having the thin film formed thereon. The photoresist coated on the substrate is hardened, to form a photoresist film having a second thermal expansion coefficient. A metal and a passivation layer are formed on the photoresist film. The photoresist film is detached from the first thin film, using difference of a thermal expansion coefficient between the photoresist film and the first thin film.

Abstract: In a thin film electrode separation method using thermal expansion coefficient, a first solution is coated on a substrate. The first solution coated on the substrate is hardened. The substrate is left in a predetermined time, to form a first thin film having a first thermal expansion coefficient on the substrate. A photoresist is coated on the substrate having the thin film formed thereon. The photoresist coated on the substrate is hardened, to form a photoresist film having a second thermal expansion coefficient. A metal and a passivation layer are formed on the photoresist film. The photoresist film is detached from the first thin film, using difference of a thermal expansion coefficient between the photoresist film and the first thin film.

Abstract: The present invention provides a polishing pad for a wafer polishing apparatus, comprising: an upper pad having a front surface part, which has a cut surface and is in contact with a wafer, a rear surface part positioned on the lower part of the front surface part, and a plurality of grid grooves passing through the front surface part and the rear surface part; a lower pad, which is arranged on the lower part of the upper pad and can be attached to a surface plate; and an adhesion part positioned between the upper pad and the lower pad to couple the upper pad with the lower pad.

Abstract: Disclosed is a system for controlling access of one or more applications to a storage device, including: a storage device including one or more memories; and a kernel implemented between the applications and the storage device, in which when the kernel receives a first access request to the storage device from a first application, the kernel transmits to the storage device first memory address information to be accessed by the first application and a first access code included in the first access request, and the storage device stores a database for an authorized access code for each memory address information and controls the first application to access a memory corresponding to the first memory address information according to whether the first memory address information and the first access code are present in the database.

Abstract: Disclosed is a system for controlling access of one or more applications to a storage device, including: a storage device including one or more memories; and a kernel implemented between the applications and the storage device, in which when the kernel receives a first access request to the storage device from a first application, the kernel transmits to the storage device first memory address information to be accessed by the first application and a first access code included in the first access request, and the storage device stores a database for an authorized access code for each memory address information and controls the first application to access a memory corresponding to the first memory address information according to whether the first memory address information and the first access code are present in the database.

Abstract: A method of manufacturing a feedthrough having an enhanced hermetic sealing and used for a human implantable medical device such as a deep brain stimulator, a implantable AED, a implantable spinal cord stimulator and so on. Thus, more enhanced reproducibility and productivity in the diffusion welding and the laser hole machining may be guaranteed in the present method of manufacturing the feedthrough, compared to the conventional method using the ceramic metallizing and the brazing.

Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.

Abstract: A method of manufacturing a feedthrough having an enhanced hermetic sealing and used for a human implantable medical device such as a deep brain stimulator, a implantable AED, a implantable spinal cord stimulator and so on. Thus, more enhanced reproducibility and productivity in the diffusion welding and the laser hole machining may be guaranteed in the present method of manufacturing the feedthrough, compared to the conventional method using the ceramic metallizing and the brazing.

Abstract: A plasma light source apparatus includes a first laser generator configured to generate a first laser. A second laser generator is configured to generate a second laser. A chamber is configured to accommodate and seal a medium material for plasma ignition and to allow plasma to be ignited by the first laser and to be maintained by the second laser. An inner surface of the chamber includes two curved mirrors that face each other.

Abstract: A panel inspecting apparatus and method may accurately inspect image quality of a curved portion of a panel with relatively small inspecting cost and time, and the panel inspecting apparatus may have a relatively simple structure. The panel inspecting apparatus includes a support on which a panel is disposed, a mirror corresponding to a curved area of the panel, a lens configured to receive an image from the panel and an image reflected by the mirror and focus the images, and an image sensor configured to capture the images transferred via the lens.

Abstract: Disclosed is an alpha alumina (?-Al2O3) thin film comprising the lower layer formed on the base material made from cemented carbide; and the ?-Al2O3 thin film layer formed on the lower layer, wherein when the ?-Al2O3 thin film layer is divided, from the total thickness (T) thereof, into a D1 layer which is from an interface layer to 0.15T, a D2 layer which is from 0.15T to 0.4T, and a D3 layer which is from 0.4T to 1T, an S1 (D3 layer grain size/D1 layer grain size) is 2-5.5 and an S2 (D2 layer grain size/D1 layer grain size) is 1.5-4.

Abstract: A plasma light source apparatus includes a first laser generator configured to generate a first laser. A second laser generator is configured to generate a second laser. A chamber is configured to accommodate and seal a medium material for plasma ignition and to allow plasma to be ignited by the first laser and to be maintained by the second laser. An inner surface of the chamber includes two curved mirrors that face each other.

Abstract: Disclosed is a single-crystal ingot manufacturing apparatus, which includes a crucible in which a melt is accommodated, a heater configured to heat the crucible, a heat shield member configured to shield radiant heat from the heater and the melt, and a neck cover configured to encompass a seed crystal unit above the crucible with being introduced into an opening of the heat shield member, the radiant heat being not shielded in the opening, the neck cover being vertically moved in linkage to vertical movement of the seed crystal unit within a predetermined range.

Abstract: Provided is an ingot growing apparatus, which includes a crucible containing a silicon melt, a pulling device pulling a silicon single crystal ingot grown from the silicon melt, and a dopant supply unit disposed adjacent to the pulling device and for supplying a dopant during growing of the ingot. The neck portion may be doped at a concentration higher than that of the ingot through the dopant supply unit. Therefore, dislocation propagation velocity may be decreased and a propagation length may be shortened.

Abstract: Disclosed is an alpha alumina (?-Al2O3) thin film comprising the lower layer formed on the base material made from cemented carbide; and the ?-Al2O3 thin film layer formed on the lower layer, wherein when the ?-Al2O3 thin film layer is divided, from the total thickness (T) thereof, into a D1 layer which is from an interface layer to 0.15T, a D2 layer which is from 0.15T to 0.4T, and a D3 layer which is from 0.4T to 1T, an S1 (D3 layer grain size/D1 layer grain size) is 2-5.5 and an S2 (D2 layer grain size/D1 layer grain size) is 1.5-4.

Abstract: An optical module for surface inspection includes a first light source unit that illuminates a substrate with first light produced by a first light source and a first beam splitter that changes the path of the first light, a second light source unit that illuminates the substrate with second light polarized in a first direction, a direction of polarization changing unit that illuminates the substrate with the third light polarized in a second direction perpendicular to the first direction, and a detection unit that detects fourth light which is a product of the first light reflecting from the substrate, fifth light which is a product of the second light scattered from the substrate, and sixth light which is a product of the third light scattered from the substrate. The third light is produced by changing the direction of polarization of the second light reflected from the inspected substrate.

Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.

Abstract: A panel inspecting apparatus and method may accurately inspect image quality of a curved portion of a panel with relatively small inspecting cost and time, and the panel inspecting apparatus may have a relatively simple structure. The panel inspecting apparatus includes a support on which a panel is disposed, a mirror corresponding to a curved area of the panel, a lens configured to receive an image from the panel and an image reflected by the mirror and focus the images, and an image sensor configured to capture the images transferred via the lens.

Abstract: An optical module for surface inspection includes a first light source unit that illuminates a substrate with first light produced by a first light source and a first beam splitter that changes the path of the first light, a second light source unit that illuminates the substrate with second light polarized in a first direction, a direction of polarization changing unit that illuminates the substrate with the third light polarized in a second direction perpendicular to the first direction, and a detection unit that detects fourth light which is a product of the first light reflecting from the substrate, fifth light which is a product of the second light scattered from the substrate, and sixth light which is a product of the third light scattered from the substrate. The third light is produced by changing the direction of polarization of the second light reflected from the inspected substrate.