Patents by Inventor Jin-Wook Jang
Jin-Wook Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11932618Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.Type: GrantFiled: March 13, 2023Date of Patent: March 19, 2024Assignee: ILDONG PHARMACEUTICAL CO., LTD.Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
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Patent number: 11740276Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.Type: GrantFiled: September 14, 2020Date of Patent: August 29, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chan-Sik Kwon, Jin Duck Park, Jin Wook Jang, Ji-Yeon Han
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Publication number: 20210018553Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.Type: ApplicationFiled: September 14, 2020Publication date: January 21, 2021Inventors: CHAN-SIK KWON, JIN DUCK PARK, JIN WOOK JANG, JI-YEON HAN
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Patent number: 10788528Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.Type: GrantFiled: October 4, 2018Date of Patent: September 29, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Chan-Sik Kwon, Jin Duck Park, Jin Wook Jang, Ji-Yeon Han
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Publication number: 20190265291Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.Type: ApplicationFiled: October 4, 2018Publication date: August 29, 2019Inventors: Chan-Sik Kwon, Jin Duck Park, Jin Wook Jang, Ji-Yeon Han
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Patent number: 9892964Abstract: A gap-fill polymer for filling fine pattern gaps, which has a low dielectric constant (low-k) and excellent gap filling properties, may consist of a compound formed by condensation polymerization of a first oligomer represented by the formula 1 and a second oligomer represented by the formula 2.Type: GrantFiled: March 27, 2017Date of Patent: February 13, 2018Assignee: SK Hynix Inc.Inventors: Ji Won Moon, Jin Wook Jang, Sang Youl Yi, Sung Jae Lee, Geun Su Lee, Young Sun Lee, Min Su Kim
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Publication number: 20180033688Abstract: A gap-fill polymer for filling fine pattern gaps, which has a low dielectric constant (flow-k) and excellent gap filling properties may consist of a compound formed by condensation polymerization of a first oligomer represented by the formula 1 and a second oligomer represented by the formula 2.Type: ApplicationFiled: March 27, 2017Publication date: February 1, 2018Inventors: Ji Won MOON, Jin Wook JANG, Sang Youl YI, Sung Jae LEE, Geun Su LEE, Young Sun LEE, Min Su KIM
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Patent number: 9572877Abstract: The present invention relates to a pharmaceutical vaccine composition comprising: (a) a pathogen-derived antigen selected from the group consisting of Mycobacterium tuberculosis antigen, Bacillus anthracis antigen, HAV (hepatitis A virus) antigen, HBV (hepatitis B virus) antigen, HCV (hepatitis C virus) antigen, HIV (human immunodeficiency virus) antigen, influenza virus antigen, HSV (herpes simplex virus) antigen, Hib (Haemophilus influenzae type b) antigen, Neisseria meningitidis antigen, Corynebacterium diphtheriae antigen, Bordetella pertussis antigen, Clostridium tetani antigen and Varicella virus antigen; (b) a deacylated non-toxic LOS (lipooligosaccharide); and (c) a pharmaceutically acceptable carrier.Type: GrantFiled: December 17, 2011Date of Patent: February 21, 2017Assignee: EYEGENE, INC.Inventors: Yang Je Cho, Na Gyong Lee, Jin Wook Jang, Kwang Sung Kim, Won II Yoo
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Patent number: 9566323Abstract: The present invention relates to a pharmaceutical vaccine composition for a human cervical cancer, comprising: (a) (i) a L1 virus-like particle (VLP) of human papillomavirus (HPV) type 16, a L1 VLP of HPV type 18, or a combination thereof; and (ii) a deacylated non-toxic lipooligosaccharide (LOS); and (b) a pharmaceutically acceptable carrier; and a method for preparing a human papillomavirus (HPV) L1 virus-like particle (VLP). The pharmaceutical vaccine composition of the present invention is in both Th1-type immune response (cellular immunity) and Th2-type immune response (humoral immunity) against HPV more excellent than Cervrix™ and Gardasil™, exhibiting a superior efficacy as a vaccine for a human cervical cancer.Type: GrantFiled: October 20, 2009Date of Patent: February 14, 2017Assignee: Eyegene Inc.Inventors: Hong-Jin Kim, Na Gyong Lee, Yang-Je Cho, Jin-Wook Jang, Hyoung Jin Kim, Kwang Sung Kim
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Patent number: 9412712Abstract: A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.Type: GrantFiled: May 27, 2015Date of Patent: August 9, 2016Assignee: SAMSUNG ELECTRONICS, CO., LTDInventors: Jin-wook Jang, Se-jin Yoo, Sung-il Cho, Jae-ho Choi
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Patent number: 9316526Abstract: Embodiments of the invention are directed towards a sliding liquid level sensor which is mounted in a fuel tank of a vehicle for detecting a remaining amount of a liquid fuel in the tank. The liquid level sensor has a float, a plurality of electrodes, and a sliding contact point configured to slide on the electrodes in accordance with a displacement of the float. The electrodes preferably contain 100 parts by weight of a silver-palladium alloy and preferably 3-20 parts by weight of glass. The silver-palladium alloy preferably contains 20-60% by weight of silver and preferably 80-40% by weight of palladium. The sliding contact point is made from a palladium-nickel alloy that preferably contains 70-90% by weight of palladium and preferably 30-10% by weight of nickel.Type: GrantFiled: March 12, 2013Date of Patent: April 19, 2016Assignees: AISAN KOGYO KABUSHIKI KAISHA, HYUNDAM IND. CO., LTDInventors: Kunio Takagi, Jin Wook Jang, Hoon Pyo Kwak
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Publication number: 20160086898Abstract: A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.Type: ApplicationFiled: May 27, 2015Publication date: March 24, 2016Inventors: Jin-wook Jang, Se-jin Yoo, Sung-il Cho, Jae-ho Choi
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Patent number: 9290542Abstract: The present invention provides a pharmaceutical composition for preventing or treating arteriosclerosis, comprising: a pharmaceutically effective amount of a protein comprising the amino acid sequence of SEQ ID NO: 1; and a pharmaceutically acceptable carrier. The composition of the present invention exhibits no toxicity in the liver or kidney and effectively reduces the formation of atherosclerotic plaques, thereby exhibiting efficacy in treating arteriosclerosis.Type: GrantFiled: March 11, 2013Date of Patent: March 22, 2016Assignee: EYEGENE, INC.Inventors: Yang Je Cho, Jin Wook Jang, Hyeong Joon Lim
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Patent number: 9111901Abstract: Embodiments of methods for forming a semiconductor device that includes a die and a substrate include pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate, and performing a bonding operation to form a die attach layer between the die and the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.Type: GrantFiled: May 26, 2014Date of Patent: August 18, 2015Assignee: Freescale Semiconductor, Inc.Inventors: Jin-Wook Jang, Lalgudi M. Mahalingam, Audel A. Sanchez, Lakshminarayan Viswanathan
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Patent number: 9105599Abstract: Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.Type: GrantFiled: May 26, 2014Date of Patent: August 11, 2015Assignee: Freescale Semiconductor, Inc.Inventors: Jin-Wook Jang, Lalgudi M. Mahalingam, Audel A. Sanchez, Lakshminarayan Viswanathan
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Patent number: 9101581Abstract: A method for treating a vascular-related disease in a subject in need thereof, includes administering to the subject a peptide having a sequence Xaa-Gly-Asp. The peptide may have a sequence of SEQ ID NOS: 1, 2, 4, 6 to 10. The vascular-related disease may be edema and/or ischemia caused by blood leakage of blood vessel walls, damages of blood vessels or abnormal angiogenesis.Type: GrantFiled: October 2, 2013Date of Patent: August 11, 2015Assignee: EYEGENE INC.Inventors: Doo-Sik Kim, Yang-Je Cho, Won-Il Yoo, Oh-Woong Kwon, Jin-Wook Jang, Hyeong-Joon Lim, Soo-Mee Kwon
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Publication number: 20150038405Abstract: The present invention provides a pharmaceutical composition for preventing or treating arteriosclerosis, comprising: a pharmaceutically effective amount of a protein comprising the amino acid sequence of SEQ ID NO: 1; and a pharmaceutically acceptable carrier. The composition of the present invention exhibits no toxicity in the liver or kidney and effectively reduces the formation of atherosclerotic plaques, thereby exhibiting efficacy in treating arteriosclerosis.Type: ApplicationFiled: March 11, 2013Publication date: February 5, 2015Inventors: Yang Je Cho, Jin Wook Jang, Hyeong Joon Lim
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Publication number: 20140256091Abstract: Embodiments of methods for forming a semiconductor device that includes a die and a substrate include pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate, and performing a bonding operation to form a die attach layer between the die and the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.Type: ApplicationFiled: May 26, 2014Publication date: September 11, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: JIN-WOOK JANG, LALGUDI M. MAHALINGAM, AUDEL A. SANCHEZ, LAKSHMINARAYAN VISWANATHAN
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Publication number: 20140252586Abstract: Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.Type: ApplicationFiled: May 26, 2014Publication date: September 11, 2014Applicant: FREESCALE SEMICONDUCTOR, INC.Inventors: JIN-WOOK JANG, LALGUDI M. MAHALINGAM, AUDEL A. SANCHEZ, LAKSHMINARAYAN VISWANATHAN
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Patent number: RE48023Abstract: A method for treating a vascular-related disease in a subject in need thereof, includes administering to the subject a peptide having a sequence Xaa-Gly-Asp. The peptide may have a sequence of SEQ ID NOS: 1, 2, 4, 6 to 10. The vascular-related disease may be edema and/or ischemia caused by blood leakage of blood vessel walls, damages of blood vessels or abnormal angiogenesis.Type: GrantFiled: May 18, 2016Date of Patent: June 2, 2020Assignee: EYEGENE INC.Inventors: Doo-Sik Kim, Yang-Je Cho, Won-Il Yoo, Oh-Woong Kwon, Jin-Wook Jang, Hyeong-Joon Lim, Soo-Mee Kwon