Patents by Inventor Jin-Wook Jang

Jin-Wook Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11932618
    Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.
    Type: Grant
    Filed: March 13, 2023
    Date of Patent: March 19, 2024
    Assignee: ILDONG PHARMACEUTICAL CO., LTD.
    Inventors: Hong Chul Yoon, Kyung Mi An, Myong Jae Lee, Jin Hee Lee, Jeong-geun Kim, A-rang Im, Woo Jin Jeon, Jin Ah Jeong, Jaeho Heo, Changhee Hong, Kyeojin Kim, Jung-Eun Park, Te-ik Sohn, Changmok Oh, Da Hae Hong, Sung Wook Kwon, Jung Ho Kim, Jae Eui Shin, Yeongran Yoo, Min Whan Chang, Eun Hye Jang, In-gyu Je, Ji Hye Choi, Gunhee Kim, Yearin Jun
  • Patent number: 11740276
    Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: August 29, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan-Sik Kwon, Jin Duck Park, Jin Wook Jang, Ji-Yeon Han
  • Publication number: 20210018553
    Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.
    Type: Application
    Filed: September 14, 2020
    Publication date: January 21, 2021
    Inventors: CHAN-SIK KWON, JIN DUCK PARK, JIN WOOK JANG, JI-YEON HAN
  • Patent number: 10788528
    Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.
    Type: Grant
    Filed: October 4, 2018
    Date of Patent: September 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chan-Sik Kwon, Jin Duck Park, Jin Wook Jang, Ji-Yeon Han
  • Publication number: 20190265291
    Abstract: A crack detection chip includes a chip which includes an internal region and an external region surrounding the internal region, a guard ring formed inside the chip along an edge of the chip to define the internal region and the external region, an edge wiring disposed along an edge of the internal region in the form of a closed curve and a pad which is exposed on a surface of the chip and is connected to the edge wiring. The edge wiring is connected to a Time Domain Reflectometry (TDR) module which applies an incident wave to the edge wiring through the pad, and detects a reflected wave formed in the edge wiring to detect a position of a crack.
    Type: Application
    Filed: October 4, 2018
    Publication date: August 29, 2019
    Inventors: Chan-Sik Kwon, Jin Duck Park, Jin Wook Jang, Ji-Yeon Han
  • Patent number: 9892964
    Abstract: A gap-fill polymer for filling fine pattern gaps, which has a low dielectric constant (low-k) and excellent gap filling properties, may consist of a compound formed by condensation polymerization of a first oligomer represented by the formula 1 and a second oligomer represented by the formula 2.
    Type: Grant
    Filed: March 27, 2017
    Date of Patent: February 13, 2018
    Assignee: SK Hynix Inc.
    Inventors: Ji Won Moon, Jin Wook Jang, Sang Youl Yi, Sung Jae Lee, Geun Su Lee, Young Sun Lee, Min Su Kim
  • Publication number: 20180033688
    Abstract: A gap-fill polymer for filling fine pattern gaps, which has a low dielectric constant (flow-k) and excellent gap filling properties may consist of a compound formed by condensation polymerization of a first oligomer represented by the formula 1 and a second oligomer represented by the formula 2.
    Type: Application
    Filed: March 27, 2017
    Publication date: February 1, 2018
    Inventors: Ji Won MOON, Jin Wook JANG, Sang Youl YI, Sung Jae LEE, Geun Su LEE, Young Sun LEE, Min Su KIM
  • Patent number: 9572877
    Abstract: The present invention relates to a pharmaceutical vaccine composition comprising: (a) a pathogen-derived antigen selected from the group consisting of Mycobacterium tuberculosis antigen, Bacillus anthracis antigen, HAV (hepatitis A virus) antigen, HBV (hepatitis B virus) antigen, HCV (hepatitis C virus) antigen, HIV (human immunodeficiency virus) antigen, influenza virus antigen, HSV (herpes simplex virus) antigen, Hib (Haemophilus influenzae type b) antigen, Neisseria meningitidis antigen, Corynebacterium diphtheriae antigen, Bordetella pertussis antigen, Clostridium tetani antigen and Varicella virus antigen; (b) a deacylated non-toxic LOS (lipooligosaccharide); and (c) a pharmaceutically acceptable carrier.
    Type: Grant
    Filed: December 17, 2011
    Date of Patent: February 21, 2017
    Assignee: EYEGENE, INC.
    Inventors: Yang Je Cho, Na Gyong Lee, Jin Wook Jang, Kwang Sung Kim, Won II Yoo
  • Patent number: 9566323
    Abstract: The present invention relates to a pharmaceutical vaccine composition for a human cervical cancer, comprising: (a) (i) a L1 virus-like particle (VLP) of human papillomavirus (HPV) type 16, a L1 VLP of HPV type 18, or a combination thereof; and (ii) a deacylated non-toxic lipooligosaccharide (LOS); and (b) a pharmaceutically acceptable carrier; and a method for preparing a human papillomavirus (HPV) L1 virus-like particle (VLP). The pharmaceutical vaccine composition of the present invention is in both Th1-type immune response (cellular immunity) and Th2-type immune response (humoral immunity) against HPV more excellent than Cervrix™ and Gardasil™, exhibiting a superior efficacy as a vaccine for a human cervical cancer.
    Type: Grant
    Filed: October 20, 2009
    Date of Patent: February 14, 2017
    Assignee: Eyegene Inc.
    Inventors: Hong-Jin Kim, Na Gyong Lee, Yang-Je Cho, Jin-Wook Jang, Hyoung Jin Kim, Kwang Sung Kim
  • Patent number: 9412712
    Abstract: A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: August 9, 2016
    Assignee: SAMSUNG ELECTRONICS, CO., LTD
    Inventors: Jin-wook Jang, Se-jin Yoo, Sung-il Cho, Jae-ho Choi
  • Patent number: 9316526
    Abstract: Embodiments of the invention are directed towards a sliding liquid level sensor which is mounted in a fuel tank of a vehicle for detecting a remaining amount of a liquid fuel in the tank. The liquid level sensor has a float, a plurality of electrodes, and a sliding contact point configured to slide on the electrodes in accordance with a displacement of the float. The electrodes preferably contain 100 parts by weight of a silver-palladium alloy and preferably 3-20 parts by weight of glass. The silver-palladium alloy preferably contains 20-60% by weight of silver and preferably 80-40% by weight of palladium. The sliding contact point is made from a palladium-nickel alloy that preferably contains 70-90% by weight of palladium and preferably 30-10% by weight of nickel.
    Type: Grant
    Filed: March 12, 2013
    Date of Patent: April 19, 2016
    Assignees: AISAN KOGYO KABUSHIKI KAISHA, HYUNDAM IND. CO., LTD
    Inventors: Kunio Takagi, Jin Wook Jang, Hoon Pyo Kwak
  • Publication number: 20160086898
    Abstract: A semiconductor package includes a wiring substrate including a plurality of solder pads; a chip including a plurality of chip pads connected to the solder pads through a plurality of solders; a sealing layer configured to seal the chip and the solders, at least one void being between the solders; and a solder extrusion prevention layer on one sidewall of the solder exposed by the at least one void.
    Type: Application
    Filed: May 27, 2015
    Publication date: March 24, 2016
    Inventors: Jin-wook Jang, Se-jin Yoo, Sung-il Cho, Jae-ho Choi
  • Patent number: 9290542
    Abstract: The present invention provides a pharmaceutical composition for preventing or treating arteriosclerosis, comprising: a pharmaceutically effective amount of a protein comprising the amino acid sequence of SEQ ID NO: 1; and a pharmaceutically acceptable carrier. The composition of the present invention exhibits no toxicity in the liver or kidney and effectively reduces the formation of atherosclerotic plaques, thereby exhibiting efficacy in treating arteriosclerosis.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: March 22, 2016
    Assignee: EYEGENE, INC.
    Inventors: Yang Je Cho, Jin Wook Jang, Hyeong Joon Lim
  • Patent number: 9111901
    Abstract: Embodiments of methods for forming a semiconductor device that includes a die and a substrate include pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate, and performing a bonding operation to form a die attach layer between the die and the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: August 18, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jin-Wook Jang, Lalgudi M. Mahalingam, Audel A. Sanchez, Lakshminarayan Viswanathan
  • Patent number: 9105599
    Abstract: Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
    Type: Grant
    Filed: May 26, 2014
    Date of Patent: August 11, 2015
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Jin-Wook Jang, Lalgudi M. Mahalingam, Audel A. Sanchez, Lakshminarayan Viswanathan
  • Patent number: 9101581
    Abstract: A method for treating a vascular-related disease in a subject in need thereof, includes administering to the subject a peptide having a sequence Xaa-Gly-Asp. The peptide may have a sequence of SEQ ID NOS: 1, 2, 4, 6 to 10. The vascular-related disease may be edema and/or ischemia caused by blood leakage of blood vessel walls, damages of blood vessels or abnormal angiogenesis.
    Type: Grant
    Filed: October 2, 2013
    Date of Patent: August 11, 2015
    Assignee: EYEGENE INC.
    Inventors: Doo-Sik Kim, Yang-Je Cho, Won-Il Yoo, Oh-Woong Kwon, Jin-Wook Jang, Hyeong-Joon Lim, Soo-Mee Kwon
  • Publication number: 20150038405
    Abstract: The present invention provides a pharmaceutical composition for preventing or treating arteriosclerosis, comprising: a pharmaceutically effective amount of a protein comprising the amino acid sequence of SEQ ID NO: 1; and a pharmaceutically acceptable carrier. The composition of the present invention exhibits no toxicity in the liver or kidney and effectively reduces the formation of atherosclerotic plaques, thereby exhibiting efficacy in treating arteriosclerosis.
    Type: Application
    Filed: March 11, 2013
    Publication date: February 5, 2015
    Inventors: Yang Je Cho, Jin Wook Jang, Hyeong Joon Lim
  • Publication number: 20140256091
    Abstract: Embodiments of methods for forming a semiconductor device that includes a die and a substrate include pressing together the die and the substrate such that a first gold layer and one or more additional material layers are between the die and the substrate, and performing a bonding operation to form a die attach layer between the die and the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
    Type: Application
    Filed: May 26, 2014
    Publication date: September 11, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: JIN-WOOK JANG, LALGUDI M. MAHALINGAM, AUDEL A. SANCHEZ, LAKSHMINARAYAN VISWANATHAN
  • Publication number: 20140252586
    Abstract: Embodiments of a semiconductor device include a primary portion of a substrate, a die, and a die attach layer between the die and the primary portion of the substrate. The die attach layer includes a gold interface layer that includes gold and a plurality of first precipitates in the gold. Each of the first precipitates includes a combination of nickel, cobalt, palladium, gold, and silicon.
    Type: Application
    Filed: May 26, 2014
    Publication date: September 11, 2014
    Applicant: FREESCALE SEMICONDUCTOR, INC.
    Inventors: JIN-WOOK JANG, LALGUDI M. MAHALINGAM, AUDEL A. SANCHEZ, LAKSHMINARAYAN VISWANATHAN
  • Patent number: RE48023
    Abstract: A method for treating a vascular-related disease in a subject in need thereof, includes administering to the subject a peptide having a sequence Xaa-Gly-Asp. The peptide may have a sequence of SEQ ID NOS: 1, 2, 4, 6 to 10. The vascular-related disease may be edema and/or ischemia caused by blood leakage of blood vessel walls, damages of blood vessels or abnormal angiogenesis.
    Type: Grant
    Filed: May 18, 2016
    Date of Patent: June 2, 2020
    Assignee: EYEGENE INC.
    Inventors: Doo-Sik Kim, Yang-Je Cho, Won-Il Yoo, Oh-Woong Kwon, Jin-Wook Jang, Hyeong-Joon Lim, Soo-Mee Kwon