Abstract: The present invention relates to a connection molding for automation of a three-phase motor winding, which specifically comprises: a fixed coil part fixed inside of a main body, a coil part installed within the fixed coil part, a central shaft fixed to the main body and passing through the coil part, and a connector part coupled to the top of the coil part so that the coil of the coil part is connected thereto and the central shaft passes and is coupled therethrough.

Abstract: A method includes providing a silicon-containing die and providing a heat sink having a palladium layer over a first surface of the heat sink. A first gold layer is located over one of a first surface of the die or the palladium layer. The silicon-containing die is bonded to the heat sink, where bonding includes joining the silicon-containing die and the heat sink such that the first gold layer and the palladium layer are between the first surface of the silicon-containing die and the first surface of the heat sink, and heating the first gold layer and the palladium layer to form a die attach layer between the first surface of the silicon-containing die and the first surface of the heat sink, the die attach layer comprising a gold interface layer having a plurality of intermetallic precipitates, each of the plurality of intermetallic precipitates comprising palladium, gold, and silicon.

Abstract: A method for treating a vascular-related disease in a subject in need thereof, includes administering to the subject a peptide having a sequence Xaa-Gly-Asp. The peptide may have a sequence of SEQ ID NOS: 1, 2, 4, 6 to 10. The vascular-related disease may be edema and/or ischemia caused by blood leakage of blood vessel walls, damages of blood vessels or abnormal angiogenesis.

Abstract: The present invention relates to a pharmaceutical vaccine composition comprising: (a) a pathogen-derived antigen selected from the group consisting of Mycobacterium tuberculosis antigen, Bacillus anthracis antigen, HAV (hepatitis A virus) antigen, HBV (hepatitis B virus) antigen, HCV (hepatitis C virus) antigen, HIV (human immunodeficiency virus) antigen, influenza virus antigen, HSV (herpes simplex virus) antigen, Hib (Haemophilus influenzae type b) antigen, Neisseria meningitidis antigen, Corynebacterium diphtheriae antigen, Bordetella pertussis antigen, Clostridium tetani antigen and Varicella virus antigen; (b) a deacylated non-toxic LOS (lipooligosaccharide); and (c) a pharmaceutically acceptable carrier.

Abstract: Embodiments of the invention are directed towards a sliding liquid level sensor which is mounted in a fuel tank of a vehicle for detecting a remaining amount of a liquid fuel in the tank. The liquid level sensor has a float, a plurality of electrodes, and a sliding contact point configured to slide on the electrodes in accordance with a displacement of the float. The electrodes preferably contain 100 parts by weight of a silver-palladium alloy and preferably 3-20 parts by weight of glass. The silver-palladium alloy preferably contains 20-60% by weight of silver and preferably 80-40% by weight of palladium. The sliding contact point is made from a palladium-nickel alloy that preferably contains 70-90% by weight of palladium and preferably 30-10% by weight of nickel.

Abstract: Disclosed is a composition for treating retinopathy comprising thrombin derived peptide as an effective component.

Abstract: A method and device are disclosed in which a a lead-free or low-lead die attach material is applied to a surface. An electronic die is positioned on the die attach material. An oxide of at least a specified thickness is formed over an exposed portion of the die attach material. Wire bonds are formed between the electronic die and the surface, and an encapsulant material is applied over the surface, the oxide, and the electronic die.

Abstract: The present invention relates to a pharmaceutical vaccine composition for a human cervical cancer, comprising: (a) (i) a L1 virus-like particle (VLP) of human papillomavirus (HPV) type 16, a L1 VLP of HPV type 18, or a combination thereof; and (ii) a deacylated non-toxic lipooligosaccharide (LOS); and (b) a pharmaceutically acceptable carrier; and a method for preparing a human papillomavirus (HPV) L1 virus-like particle (VLP). The pharmaceutical vaccine composition of the present invention is in both Th1-type immune response (cellular immunity) and Th2-type immune response (humoral immunity) against HPV more excellent than Cervrix™ and Gardasil™, exhibiting a superior efficacy as a vaccine for a human cervical cancer.

Abstract: A random pitch impeller for a fuel pump has number of blades. An incremental angle of the blades is set by the expression: ?? ? ? i = ( 360 N ) + ( - 1 ) i × Am × sin ? ( p 1 × 360 N × i ) × cos ? ( P 2 × 360 N × i ) , where ??I is the incremental angle between the blades, N is the total number of blades (N=2, 3, 5, 7, 11, 13, 17, . . . ), Am is the distribution magnitude of the inter-blade interval (equally divided angle) (0<Am<360/N), i is the order of the blade (i=1, 2, 3, . . . , N), and P1 and P2 are the factors exerting an influence on the cycle (0<P1<N, and 0?P2?N). The incremental angle has maximum and minimum values a difference of which satisfies the expression: 2°?MAX?MIN?6°, where MAX is the maximum value, and MIN is the minimum value of the incremental angle.

Abstract: The present invention relates to a connection molding for automation of a three- phase motor winding, which specifically comprises: a fixed coil part fixed inside of a main body, a coil part installed within the fixed coil part, a central shaft fixed to the main body and passing through the coil part, and a connector part coupled to the top of the coil part so that the coil of the coil part is connected thereto and the central shaft passes and is coupled therethrough.

Abstract: A method includes providing a silicon-containing die and providing a heat sink having a palladium layer over a first surface of the heat sink. A first gold layer is located over one of a first surface of the die or the palladium layer. The silicon-containing die is bonded to the heat sink, where bonding includes joining the silicon-containing die and the heat sink such that the first gold layer and the palladium layer are between the first surface of the silicon-containing die and the first surface of the heat sink, and heating the first gold layer and the palladium layer to form a die attach layer between the first surface of the silicon-containing die and the first surface of the heat sink, the die attach layer comprising a gold interface layer having a plurality of intermetallic precipitates, each of the plurality of intermetallic precipitates comprising palladium, gold, and silicon.

Abstract: Disclosed is a composition for treating retinopathy comprising thrombin derived peptide as an effective component.

Abstract: A random pitch impeller for a fuel pump has number of blades. An incremental angle of the blades is set by the expression: ?? ? ? i = ( 360 N ) + ( - 1 ) i × Am × sin ? ( p 1 × 360 N × i ) ? cos ? ( P 2 × 360 N × i ) , where ??I is the incremental angle between the blades, N is the total number of blades (N=2, 3, 5, 7, 11, 13, 17, . . . ), Am is the distribution magnitude of the inter-blade interval (equally divided angle) (0<Am<360/N), i is the order of the blade (i=1, 2, 3, . . . , N), and P1 and P2 are the factors exerting an influence on the cycle (0<P1<N, and 0?P2?N). The incremental angle has maximum and minimum values a difference of which satisfies the expression: 2°<MAX?MIN?6°, where MAX is the maximum value, and MIN is the minimum value of the incremental angle.

Abstract: Disclosed is a composition for treating vascular diseases by acting on abnormal angiogenesis by means of secretion of angiopoietins.

Abstract: Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) and methods for fabricating the same are provided. An exemplary method comprises providing a semiconductor wafer stack (110) including metal pads (112) and a substrate (116). An adhesion/plating layer (115) is formed on the substrate (116). A layer of gold (118) is plated on the adhesion/plating layer (115). The layer of gold is etched in a street area (124) to expose edge portions (128) of the layer of gold (118) and the adhesion/plating layer (115). A layer of barrier metal (130) is deposited to form an edge seal (129) about the exposed edge portions (128). The edge seal (129) prevents the leaching of gold from back metal layers (118) into the solder (162) when the wafer stack (110) is soldered to a leadframe (162).

Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.

Abstract: Provided is a turbine type electric fuel pump for an automobile having a casing in which a pump portion and a motor portion are installed. The pump portion includes a fuel intake case having a fuel intake hole, a fuel discharge case having a fuel discharge hole, and an impeller installed on a pumping chamber. An inlet side ring type duct is connected to the fuel intake hole. An outlet side ring type duct is connected to the fuel discharge hole. The impeller includes a disc portion in which a shaft assembly portion is formed at the center thereof, a plurality of blades extending from an outer circumferential surface of the disc portion outwardly in a radial direction, and a ring portion connecting the blades along the outer circumferential surface of the disc portion. The outer circumferential surface of the disc portion gradually protrudes outwardly in a radial direction of the impeller from both upper and lower sides thereof to a center thereof.

Abstract: Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) during the die attachment process and methods for fabricating the same are provided. A method in accordance with the invention comprises providing a semiconductor wafer stack (110) including a plurality of metal pads (112). An adhesion/plating layer (115) is formed on a surface (119) of a substrate (116). A layer of gold (118) is plated on a surface of the adhesion/plating layer (115). The layer of gold is etched in a street area (124) using standard photolithography techniques to expose edge portions (128) of the layer of gold (118) and the adhesion/plating layer (115). A layer of barrier metal (130) is deposited to form an edge seal (129) about the exposed edges (128) of the layer of gold (118) the adhesion/plating layer (115).

Abstract: The application discloses Factor VIII polypeptides comprising internal deletions of amino acids within the area of residues 741 to 1689, wherein the thrombin cleavage sites at about 741 and about 1689 are present, and a site at about 1648 is not present, as compared to human Factor VIII.

Abstract: A semiconductor device (51) is provided. The device (51) comprises a die (53) having a contact pad (61) thereon, a redistribution conductor (59) having a base portion (64) which is in electrical communication with the contact pad (61) and a laterally extending portion (63), a bumped contact (65) which is in electrical communication with the redistribution conductor (59), and a passivation layer (57) disposed between the laterally extending portion (63) of the redistribution conductor (59) and the die (53). Preferably, the redistribution conductor (59) is convoluted and is adapted to peel or delaminate from the passivation layer (57) under sufficient stress so that it can shift relative to the passivation layer (57) and base portion (64) to relieve mechanical stress between substrate (69) and the die (53). Bump and coiled redistribution conductor (59) accommodating small CTE mis-match strain without failure allows DCA flip-chip to be reliable without underfill or additional assembly process.