Patents by Inventor Jin Woong Lee
Jin Woong Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160253589Abstract: A system for developing a composition for powder molding which, after a viscosity of the composition for powder molding and a degreasing process, extracts optimal compositional information of the composition in terms of the ratios of the residual binder materials is disclosed. Such a system includes a searching logic unit configured, after generating a plurality of candidate compositional information, to extract the optimal compositional information therefrom and a synthesis/analysis module configured to synthesize and analyze compositions corresponding to the plurality of candidate compositional information and provide to the searching logic unit measurement information on the viscosities of the compositions corresponding to each of the plurality of candidate compositional information and ratios of residual binder materials after a degreasing process.Type: ApplicationFiled: February 19, 2016Publication date: September 1, 2016Inventors: Ji Sik KIM, Kee Sun SOHN, Jin Woong LEE
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Patent number: 9401456Abstract: According to the present invention, a light-emitting diode with improved light extraction efficiency comprises: a semiconductor laminated structure including an N-layer, a light-emitting layer, and a P-layer formed on a substrate; an N-type electrode formed on the N-layer; and a P-type electrode formed on the P-layer, wherein the N-type electrode and the P-type electrode include a pad electrode and a dispersion electrode, and the N-type electrode and/or the P-type electrode includes a reflective electrode layer for reflecting light onto the dispersion electrode. Thus, the light-emitting diode has a reflective electrode layer on the electrode so as to improve light extraction efficiency. Further, a reflective layer is patterned beneath a pad unit, thus forming roughness and improving adhesion.Type: GrantFiled: June 15, 2015Date of Patent: July 26, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim
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Patent number: 9397264Abstract: Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: February 24, 2015Date of Patent: July 19, 2016Assignee: SEOUL VIOSYS CO., LTD.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20160118564Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: ApplicationFiled: December 30, 2015Publication date: April 28, 2016Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9321477Abstract: A rack bar support device supports a rack bar of a steering device of a vehicle toward a pinion shaft, and includes a rack bearing which is disposed opposite the pinion to contact the rack bar and a biasing assembly providing a force of pushing the rack bearing along a biasing axis toward the rack bar to urge the rack bearing to push the rack bar is engaged with the pinion shaft. The biasing assembly includes an adjustment plug, an adjustment assembly and a support plate assembly. The support plate assembly includes a support plate which is movably disposed between the adjustment member and the rack bearing in a state of being supported by the adjustment member, and a gap is formed between the support plate and the rack bearing.Type: GrantFiled: September 6, 2012Date of Patent: April 26, 2016Assignee: ERAE AUTOMOTIVE SYSTEMS CO., LTD.Inventors: Seong-Hun Bae, Chang-Wook Son, Chung-Shin Lee, Jin-Woong Lee, Je-Won Kim
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Patent number: 9202984Abstract: A light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.Type: GrantFiled: May 26, 2015Date of Patent: December 1, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Tae Kyoon Kim
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Publication number: 20150311390Abstract: A method of fabricating a light emitting diode (LED) includes: sequentially stacking a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer on a substrate; and separating the substrate into unit chips, and at the same time, forming a concavo-convex structure having the shape of irregular vertical lines in a side surface of the unit chip.Type: ApplicationFiled: July 9, 2015Publication date: October 29, 2015Inventors: Kyung Wan KIM, Tae Kyoon KIM, Yeo Jin YOON, Ye Seul KIM, Sang Hyun OH, Jin Woong LEE, In Soo KIM
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Publication number: 20150280074Abstract: According to the present invention, a light-emitting diode with improved light extraction efficiency comprises: a semiconductor laminated structure including an N-layer, a light-emitting layer, and a P-layer formed on a substrate; an N-type electrode formed on the N-layer; and a P-type electrode formed on the P-layer, wherein the N-type electrode and the P-type electrode include a pad electrode and a dispersion electrode, and the N-type electrode and/or the P-type electrode includes a reflective electrode layer for reflecting light onto the dispersion electrode. Thus, the light-emitting diode has a reflective electrode layer on the electrode so as to improve light extraction efficiency. Further, a reflective layer is patterned beneath a pad unit, thus forming roughness and improving adhesion.Type: ApplicationFiled: June 15, 2015Publication date: October 1, 2015Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim
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Publication number: 20150255679Abstract: A light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.Type: ApplicationFiled: May 26, 2015Publication date: September 10, 2015Inventors: Jin Woong LEE, Kyoung Wan KIM, Yeo Jin YOON, Ye Seul KIM, Tae Kyoon KIM
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Publication number: 20150236210Abstract: Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer, a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer, a second electrode pad electrically connected to the second conductive type semiconductor layer, and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: ApplicationFiled: February 24, 2015Publication date: August 20, 2015Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Patent number: 9112102Abstract: Provided are a light emitting diode (LED) and a method of fabricating the same. The LED includes a unit chip. The unit chip includes a substrate, and a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer which are sequentially stacked on the substrate. A concavo-convex structure having the shape of irregular vertical lines is disposed in a side surface of the unit chip.Type: GrantFiled: October 30, 2013Date of Patent: August 18, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Kyung Wan Kim, Tae Kyoon Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee, In Soo Kim
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Publication number: 20150144981Abstract: A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to blue, green, and red light.Type: ApplicationFiled: January 28, 2015Publication date: May 28, 2015Inventors: Duk Il Suh, Jae Moo Kim, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Jin Woong Lee
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Patent number: 9041038Abstract: Exemplary embodiments of the present invention disclose a light-emitting diode (LED) including a semiconductor stack structure including a first semiconductor layer, an active layer, and a second semiconductor layer, the semiconductor stack disposed on a substrate, a conductive substrate disposed on the semiconductor stack structure, and an electrode disposed on the conductive substrate and in ohmic contact with the conductive substrate, wherein the electrode comprises grooves penetrating the electrode and a portion of the conductive substrate.Type: GrantFiled: December 6, 2013Date of Patent: May 26, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Tae Kyoon Kim
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Patent number: 8987772Abstract: Disclosed herein is an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer; a first electrode pad located on the second conductive type semiconductor layer opposite to the first conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.Type: GrantFiled: February 28, 2011Date of Patent: March 24, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Ye Seul Kim, Kyoung Wan Kim, Yeo Jin Yoon, Sang-Hyun Oh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong, Sang Won Woo
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Publication number: 20150066754Abstract: Provided is a method and system for a payment service. A payment service method embodied in a computer to provide a payment service may include registering and maintaining a product in a product database for each service, with respect to a plurality of services, creating billing information of a requested product in response to a call of an application program interface (API) of a service for which a product purchase is requested from a user, using the product database, and providing the billing information to a market associated with the user. Here, a payment according to the product purchase may be processed at the market based on the billing information.Type: ApplicationFiled: August 21, 2014Publication date: March 5, 2015Inventors: Seong Bong HONG, Hyun Gu KIM, Jin Woong LEE
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Patent number: 8963183Abstract: A light-emitting diode (LED) according to an exemplary embodiment includes a light-emitting structure arranged on a first surface of a substrate, the light-emitting structure including a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, and an active layer interposed between the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer. A first distributed Bragg reflector is arranged on a second surface of the substrate opposite to the first surface, the first distributed Bragg reflector to reflect light emitted from the light-emitting structure. The first distributed Bragg reflector has a reflectivity of at least 90% with respect to blue, green, and red light.Type: GrantFiled: February 6, 2013Date of Patent: February 24, 2015Assignee: Seoul Viosys Co., Ltd.Inventors: Duk Il Suh, Jae Moo Kim, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang-Hyun Oh, Jin Woong Lee
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Publication number: 20150020619Abstract: A rack bar supporting device is a device for supporting a rack bar of a steering apparatus of a vehicle toward a pinion shaft and includes a rack bearing and a biasing assembly. The biasing assembly includes an adjustment plug, an adjustment assembly and a support plate assembly. The adjustment assembly includes an adjustment member and a first biasing member. The support plate assembly includes a first support plate, a second support plate, a second biasing member which provides a force for pushing the first support plate along the biasing axis against the second support plate, and a connection structure which connects the first and the second support plates together so as to restrict movement of the second plate in a direction away from the rack bearing.Type: ApplicationFiled: March 4, 2013Publication date: January 22, 2015Applicant: KOREA DELPHI AUTOMOTIVE SYSTEMS CORPORATIONInventors: Chang-Wook Son, Seong-Hun Bae, Min-Young Choi, Jin-Woong Lee, Je-Won Kim
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Publication number: 20150014702Abstract: Disclosed are a light-emitting diode having improved light extraction efficiency and a method for manufacturing same. This light-emitting diode includes: a gallium nitride substrate having an upper surface and a lower surface; and a gallium nitride semiconductor multilayer structure disposed on the lower surface of the substrate, and having a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer. Herein, the gallium nitride substrate has a main pattern having a protruding portion and a concave portion on the upper surface, and a rough surface formed on the protruding portion of the main pattern. The light-emitting diode is capable of improving light extraction efficiency through the upper surface thereof since the rough surface is formed along with the main pattern on the upper surface of the gallium nitride substrate.Type: ApplicationFiled: February 26, 2013Publication date: January 15, 2015Inventors: Jin Woong Lee, Kyoung Wan Kim, Yeo Jin Yoon, Sang Hyun Oh, Tae Gyun Kim
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Patent number: 8878220Abstract: Exemplary embodiments of the present invention relate to light emitting diodes. A light emitting diode according to an exemplary embodiment of the present invention includes a substrate having a first side edge and a second side edge, and a light emitting structure arranged on the substrate. The light emitting structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A transparent electrode layer including a concave portion and a convex portion is arranged on the second conductivity-type semiconductor layer. A first electrode pad contacts an upper surface of the first conductivity-type semiconductor layer and is located near a center of the first side edge. Two second electrode pads are located near opposite distal ends of the second side edge to supply electric current to the second conductivity-type semiconductor layer.Type: GrantFiled: August 15, 2011Date of Patent: November 4, 2014Assignee: Seoul Viosys Co., Ltd.Inventors: Jeong Hee Yang, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Duk Il Suh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong
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Publication number: 20140299905Abstract: A light-emitting diode includes a substrate, and a light-emitting structure disposed on the substrate. The light-emitting structure includes a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer. A transparent electrode layer including concave portions and convex portions is disposed on the second conductivity-type semiconductor layer. Micro-lenses are disposed on the transparent electrode layer and completely cover the concave portions, and only partially cover the convex portions that are disposed between the micro-lenses.Type: ApplicationFiled: June 19, 2014Publication date: October 9, 2014Inventors: Jeong Hee YANG, Kyoung Wan Kim, Yeo Jin Yoon, Ye Seul Kim, Sang Hyun Oh, Duk Il Suh, Keum Ju Lee, Jin Woong Lee, Da Yeon Jeong