Patents by Inventor Jin Yang

Jin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12763363
    Abstract: The present technology relates to multifunctionalized thiol conductor compounds which can be grafted onto polymers, and methods for making same. In certain embodiments, the compounds of the present technology can be grafted onto polymers having low Tg to synthesize single-ion conducting polymer electrolytes having improved conductivity. The multifunctionalized thiol conductor compounds of the present technology generally comprise more than one sulfonamide anion covalently attached to a substitutable core (A) via a sulphide bond, a thiol functional group and optionally a hydrocarbon side chain (L) attached to the substitutable core (A).
    Type: Grant
    Filed: July 24, 2023
    Date of Patent: October 13, 2026
    Assignee: BLUE SOLUTIONS CANADA INC.
    Inventors: Qiujie Zhao, Siwei Liang, Jin Yang, Sarah Degras, Patrick Leblanc
  • Publication number: 20260313464
    Abstract: A network device determines at least one of throughput variation and latency variation associated with at least one flow transiting a network slice of a mobile network. The network device compares the at least one of the throughput variation and the latency variation with performance requirements of the network slice, and determines, based on the comparing, network slice resources needed for capacity planning of the network slice. The network device adds or removes network slice resources from the network slice based on the determined network slice resources.
    Type: Application
    Filed: June 16, 2026
    Publication date: October 8, 2026
    Applicant: Verizon Patent and Licensing Inc.
    Inventors: Jin Yang, Ravi Potluri
  • Publication number: 20260314445
    Abstract: A 2.5D/3D electronic packaging structure and a method for manufacturing it are disclosed. The method includes: disposing a metal array over a wafer, fixing a first die and a second die to the metal array; removing a portion of the wafer to expose bottom surfaces of the first die and the second die; providing a glass substrate, forming a cavity on the surface of the glass substrate; forming vias through the glass substrate, filling the vias with metal materials to form metal pillars; forming first solder pads each at a first end of one of the metal pillars, and forming second solder pads each at a second end of that metal pillar; embedding the wafer in the cavity, and connecting the first solder pads to the first die and the second die, and connecting the second solder pads to an organic substrate.
    Type: Application
    Filed: June 9, 2026
    Publication date: October 8, 2026
    Applicant: SJ Semiconductor(Jiangyin) Corporation
    Inventors: Chengchung LIN, Jin YANG
  • Patent number: 12757099
    Abstract: A device may include a processor configured to receive a request to establish a communication session or data flow for a user equipment (UE) device connected to a Radio Access Network (RAN). The processor may be further configured to obtain key performance indicators (KPI) information relating to one or more KPIs for a plurality of paths in a transport network used by the RAN to connect to a core network; determine a KPI requirement for the communication session or data flow to be established; select a path in the transport network based on the obtained KPI information and the determined KPI requirement; and establish the communication session or data flow in the transport network using the selected path.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: October 6, 2026
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jin Yang, Mark T. Watts, Kristen Sydney Young, Vishwanath Ramamurthi, Edward Diaz
  • Publication number: 20260305454
    Abstract: A fan-out wafer-level packaging structure and a method for manufacturing it are disclosed. The structure includes: a rewiring layer, a chip, an electrical component, a protective layer made of UV-curable adhesive, a molding layer, and a solder ball. The protective layer is disposed on surfaces of the electrical component, sealing the electrical component, and ensuring its safe operation and reliability, mitigating risks of melting and spillage of solder in the electrical component, and preventing electrical shorts and delamination between molding layers and the electrical component. The protective layer is formed by UV-curing or UV/thermal-dual-curing, to prevent loss of upper portions of the adhesive resulted from the upper portions flowing downward after dispensing. A dual-curing process can further solidify the protective layer, enabling the protective layer to better seal and protect the electrical component.
    Type: Application
    Filed: June 9, 2026
    Publication date: October 1, 2026
    Applicant: SJ Semiconductor(Jiangyin) Corporation
    Inventors: Chengchung LIN, Jin YANG
  • Publication number: 20260304230
    Abstract: A method includes receiving, by a first network function from an application server, a request to establish a dedicated user plane session with an elevated quality of service (QoS) profile for a wireless device, the request including an embedded subscription to an idle session state. The method includes generating, by the first network function based on the request, a core network notification request configured to track an idle session timer. The method includes forwarding, by the first network function, the core network notification request to a second network function. The method includes receiving, by the first network function from the second network function, a control message indicating that the idle session timer has expired within a user plane function (UPF). The method includes pushing, by the first network function to the application server, a notification informing the application server of the idle session state.
    Type: Application
    Filed: June 2, 2026
    Publication date: October 1, 2026
    Applicant: Verizon Patent and Licensing Inc.
    Inventors: Ye HUANG, Lixia YAN, Sudhakar Reddy PATIL, Jin YANG, Michael R. WATERS, Yousef ABDELMALEK, Jerry STEBEN, Raquel MORERA SEMPERE, Emerando M. DELOS REYES
  • Patent number: 12750913
    Abstract: A user equipment (UE) device may include a processor configured to obtain a configuration specification for at least one discontinuous transmission parameter, wherein the configuration specification includes different values for at least two different Quality of Service (QoS) classes. The processor may be further configured to detect uplink data that is to be sent by the UE device to a device via a base station; determine a QoS class associated with the uplink data; select a value for the at least one discontinuous transmission parameter based on the configuration specification and the determined QoS class associated with the uplink data; and send the uplink data to the base station based on the selected value for the at least one discontinuous transmission parameter.
    Type: Grant
    Filed: September 20, 2022
    Date of Patent: September 29, 2026
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jin Yang, Susan Wu Sanders, Lei Song, Xin Wang
  • Patent number: 12750880
    Abstract: A network device may receive an indication to enable sub-band full duplex uplink transmission for a first user equipment (UE), and may determine whether the first UE and a second UE are associated with a separation that is more than a threshold separation. The network device may enable the sub-band full duplex uplink transmission for the first UE based on determining that the first UE and the second UE are associated with a separation that is more than the threshold separation. The network device may deny the sub-band full duplex uplink transmission for the first UE based on determining that the first UE and the second UE are associated with a separation that is less than the threshold separation.
    Type: Grant
    Filed: February 16, 2023
    Date of Patent: September 29, 2026
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Lei Song, Lily Zhu, Zheng Zhao, Cindy Dong, Jin Yang, Xin Wang
  • Publication number: 20260286422
    Abstract: A method for adjusting the volume of nucleic acid nanoballs. By performing coagulation treatment on a nucleic acid (for example, adding a nucleic acid coagulating agent and/or adjusting the pH value to 3-4.5, so that positively charged counter ions are gathered around the nucleic acid, and negative charges on the surface of the nucleic acid are neutralized by cations by means of electrostatic bonding of anions and cations, thereby enabling the nucleic acid to coagulate), the shape of the nucleic acid nanoballs can be changed, the volume of the nucleic acid nanoballs can be adjusted, and the nucleic acid nanoballs can be compressed. The nucleic acid nanoballs obtained by the method are more compact, smaller in shape, and more uniform in size. The method can be used in any situation where the volume of the nucleic acid nanoballs needs to be adjusted.
    Type: Application
    Filed: July 11, 2023
    Publication date: September 24, 2026
    Inventors: Qiong Su, Jin Yang, ChongYang Song
  • Publication number: 20260292847
    Abstract: Embodiments of the present disclosure relate to methods, devices and computer readable media for sidelink communications. A method implemented at a first terminal device for sidelink communications comprises: determining, at a first terminal device, whether at least one physical sidelink feedback channel (PSFCH) resource within a duration of a channel occupancy time (COT) is activated for transmission of Hybrid Automatic Repeat Request (HARQ) feedback information; and in accordance with a determination that the at least one PSFCH resource is deactivated for the transmission of the HARQ feedback information, receiving sidelink data on the at least one PSFCH resource.
    Type: Application
    Filed: July 27, 2022
    Publication date: September 24, 2026
    Applicant: NEC Corporation
    Inventors: Zhaobang MIAO, Jin YANG, Gang WANG
  • Patent number: 12742120
    Abstract: The present disclosure provides a composition. In an embodiment, the composition includes a mixture of an alcohol (1) and an alcohol (2). Alcohol (1) has the Structure (1): alcohol (2) has the Structure (2): wherein a is an integer from 1 to 2, R1 and R2 each independently is selected from the group consisting of hydrogen and an alkyl group, with the proviso that the total number of carbon atoms of R1 and R2 is 7, and R3 is selected from the group consisting of a butyl group, an isobutyl group, a pentyl group, and an isopentyl group.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: September 22, 2026
    Assignee: Dow Global Technologies LLC
    Inventors: Wanglin Yu, Michael A. Brammer, Sally Demaio-Turner, Sung-Yu Ku, Jin Yang, Haifeng Shi, Bruce D. Hook, Yujun Liu, Jeff Johnson
  • Publication number: 20260282039
    Abstract: Embodiments of the present disclosure relate to method, device and computer readable media for sidelink communications. A method implemented at a first terminal device for sidelink communications comprises: in accordance with a determination that a first candidate resource immediately preceding a second resource is available in a candidate resource set, selecting the first candidate resource for the sidelink communications. The second resource is reserved by a second terminal device. The method also comprises obtaining a COT duration before performing the sidelink communications on the first candidate resource. The method further comprises transmitting first information about the COT duration to the second terminal device.
    Type: Application
    Filed: June 10, 2022
    Publication date: September 17, 2026
    Applicant: NEC Corporation
    Inventors: Zhaobang MIAO, Jin YANG, Gang WANG
  • Patent number: 12740444
    Abstract: A 2.5D/3D electronic packaging structure and a method for manufacturing it are disclosed. The method includes: disposing a metal array over a wafer, fixing a first die and a second die to the metal array; removing a portion of the wafer to expose bottom surfaces of the first die and the second die; providing a glass substrate, forming a cavity on the surface of the glass substrate; forming vias through the glass substrate, filling the vias with metal materials to form metal pillars; forming first solder pads each at a first end of one of the metal pillars, and forming second solder pads each at a second end of that metal pillar; embedding the wafer in the cavity, and connecting the first solder pads to the first die and the second die, and connecting the second solder pads to an organic substrate.
    Type: Grant
    Filed: April 7, 2023
    Date of Patent: September 15, 2026
    Assignee: SJ Semiconductor(Jiangyin) Corporation
    Inventors: Chengchung Lin, Jin Yang
  • Patent number: 12727019
    Abstract: In some implementations, a distributed unit (DU) associated with a network node may determine a rate variation associated with one or more of a quality of service (QoS) flow or a network slice. The DU may perform a scheduling for a user equipment (UE) based on the rate variation, wherein the scheduling is associated with an adjusted data rate based on the rate variation.
    Type: Grant
    Filed: July 13, 2023
    Date of Patent: September 1, 2026
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jin Yang, John J. Cooke, Susan Wu Sanders, Arvind Kumar
  • Publication number: 20260254564
    Abstract: Embodiments of the present disclosure relate to method, device and computer readable media for sidelink communication. A method implemented for sidelink communication comprises: selecting, at a first terminal device for a plurality of different transport blocks (TBs) with each TB associated with a sidelink hybrid automatic repeat request (HARQ) process, a first plurality of resources in a first plurality of consecutive slots. The method also comprises transmitting to at least one other terminal device the plurality of different TBs on the first plurality of resources.
    Type: Application
    Filed: July 1, 2022
    Publication date: August 27, 2026
    Applicant: NEC Corporation
    Inventors: Zhaobang MIAO, Jin YANG, Ying ZHAO, Gang WANG
  • Publication number: 20260249104
    Abstract: A laser positioning method for biplane radiotherapy is provided, which includes the following steps: a biplane laser positioning device of CT scanning equipment respectively forms double cross-shaped laser lines on the left side and the right side of a patient, and forms a pound sign-shaped laser line on the chest and abdomen of the patient; according to the results of CT scanning and positioning, mark lines are made on the patient's body surface; setup: the linear accelerator is provided with a biplane laser positioning device which is the same as the CT scanning equipment, and the setup is completed by overlapping the laser lines formed on the patient's body surface by the biplane laser positioning device of the linear accelerator with the marking lines made on the patient's body surface; and treatment is performed.
    Type: Application
    Filed: April 28, 2025
    Publication date: August 27, 2026
    Inventors: Zhuofei Bi, Jin Yang, Jiannan Fang, Yonglin Mao
  • Patent number: 12720547
    Abstract: In some implementations, a control device may transmit, to a set of radio units (RUs), an indication of orthogonal codes for respective RUs from the set of RUs, wherein the set of RUs are non-collocated. The control device may transmit, to one or more user equipment (UEs), an indication of the orthogonal codes for the respective RUs from the set of RUs. The control device may transmit, to the set of RUs, control information to cause the set of RUs to transmit orthogonal transmissions, using the orthogonal codes, to at least one UE from the one or more UEs.
    Type: Grant
    Filed: February 8, 2023
    Date of Patent: August 25, 2026
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jin Yang, Lei Song, Zheng Zhao, Edward Diaz
  • Patent number: 12713968
    Abstract: A fan-out wafer-level packaging structure and a method for manufacturing it are disclosed. The structure includes: a rewiring layer, a chip, an electrical component, a protective layer made of UV-curable adhesive, a molding layer, and a solder ball. The protective layer is disposed on surfaces of the electrical component, sealing the electrical component, and ensuring its safe operation and reliability, mitigating risks of melting and spillage of solder in the electrical component, and preventing electrical shorts and delamination between molding layers and the electrical component. The protective layer is formed by UV-curing or UV/thermal-dual-curing, to prevent loss of upper portions of the adhesive resulted from the upper portions flowing downward after dispensing. A dual-curing process can further solidify the protective layer, enabling the protective layer to better seal and protect the electrical component.
    Type: Grant
    Filed: May 2, 2023
    Date of Patent: August 18, 2026
    Assignee: SJ Semiconductor(Jiangyin) Corporation
    Inventors: Chengchung Lin, Jin Yang
  • Publication number: 20260239015
    Abstract: A system described herein may identify Key Performance Indicators (“KPIs”) associated with User Equipment (“UEs”) that are connected to a radio access network (“RAN”). Each KPI may be associated with wireless communications between a respective UE and the RAN. The system may identify a plurality of service categories associated with the plurality of UEs, where each particular UE is associated with a respective service category. The system may determine, based on the KPIs and the service category associated with each UE of the plurality of UEs, a radio resource partitioning configuration for the RAN. The particular radio resource partitioning configuration may specify that different portions of a set of radio resources, implemented by the RAN, are associated with different network slices. The RAN may implement the radio resource partitioning configuration by sending and receiving traffic, associated with respective network slices, via a corresponding portion of the set of radio resources.
    Type: Application
    Filed: April 28, 2026
    Publication date: August 13, 2026
    Applicant: Verizon Patent and Licensing Inc.
    Inventor: Jin Yang
  • Patent number: D1150667
    Type: Grant
    Filed: November 5, 2025
    Date of Patent: September 29, 2026
    Inventors: Jin Yang, Long Hu, ZhengMing Liao