Abstract: A method of controlling a user interface using an input image is provided. The method includes storing operation executing information of each of one or more gesture forms according to each of a plurality of functions, detecting a gesture form from the input image, and identifying the operation executing information mapped on the detected gesture form to execute an operation according to a function which is currently operated.

Abstract: Provided are an ICB assembly suitable for a battery module of a horizontal stack structure wherein unidirectional battery cells are stacked such that cell leads face each other, a battery module including the same and a method for manufacturing the same. The ICB assembly of the present disclosure includes an ICB frame configured to accommodate cell leads of unidirectional battery cells having the cell leads formed on one side such that the cell leads face each other are placed on the top surface and the bottom surface of the ICB frame; and a bus bar adapted to electrically connect to the cell leads by being assembled to the ICB frame.

Abstract: A surgical device is provided and includes a handle housing, an endoscopic assembly, and a follower assembly. The endoscopic assembly extends distally from the handle housing and includes an inner tube defining a longitudinal axis. The inner tube includes a distal portion defining a pair of opposed tines. The endoscopic assembly is configured to support a plurality of anchors at least partially therein. The follower assembly is disposed at least partially within the inner tube at a location proximal of the plurality of anchors, and includes a head and a shaft. A portion of the head is disposed between the pair of opposed tines. Actuation of the endoscopic surgical device causes rotation of the inner tube about the longitudinal axis relative to the handle housing, and causes distal advancement of the follower assembly relative to the inner tube.

Abstract: A battery module according to an embodiment of the present disclosure includes a cell assembly including a plurality of battery cells stacked side by side in a horizontal direction, each battery cell defining a respective plane extending in a vertical direction perpendicular to the horizontal direction, and an end plate having a support part configured to support a bottom of the cell assembly, an outer side part extending in the vertical direction from an end of the support part, and an inner side part extending downward and inward from a top of the outer side part.

Abstract: A 3D-NAND memory includes a transistor formed in a first side of a periphery circuit substrate, a memory cell stack formed over a first side of a cell array substrate, and a first connection structure formed over an opposing second side of the cell array substrate. The memory cell stack includes a doped region formed in the first side of the cell array substrate and coupled to the first connection structure through a first VIA, a common source structure that extends from the doped region toward the first side of the periphery circuit substrate, and a second connection structure that is positioned over and coupled to the common source structure. The first side of the cell array substrate and the first side of the periphery circuit substrate are aligned facing each other so that the transistor is coupled to the second connection structure.

Abstract: A memory device includes a memory array, a circuit structure, a bonding structure between the memory array and the circuit structure, and a shielding structure between the memory array and the circuit structure and surrounding the bonding structure. The bonding structure includes a first bonding pattern and a second bonding pattern. The circuit structure is electrically connected with the memory array through the bonding structure. The shielding structure includes a third bonding pattern and a fourth bonding pattern. The first bonding pattern is in contact with the second bonding pattern at a first interface between the first bonding pattern and the second bonding pattern. The third bonding pattern is in contact with the fourth bonding pattern at a second interface between the third bonding pattern and the fourth bonding pattern.

Abstract: Provided are an interconnect board (ICB) assembly suitable for a battery module of horizontal stack structure including unidirectional battery cells stacked with cell leads facing each other, a battery module comprising the same and a method for fabricating the battery module. The ICB assembly according to the present disclosure includes an ICB frame configured to receive leads of unidirectional battery cells such that the unidirectional battery cells having the cell leads at one end are placed facing each other with the cell leads facing each other, and busbars assembled in the ICB frame, size and configured to be electrically connected to the cell leads.

Abstract: Image sensors are provided. The image sensor may include a substrate including a first surface and a second surface opposite the first surface, a photoelectric conversion layer in the substrate, and a lower capacitor connection pattern on the first surface of the substrate. The second surface of the substrate may be configured to receive incident light. The lower capacitor connection pattern may include a capacitor region and a landing region protruding from the capacitor region. The image sensors may also include a capacitor structure including a first conductive pattern, a dielectric pattern, and a second conductive pattern sequentially stacked on the capacitor region, a first wire on the capacitor structure and connected to the second conductive pattern, and a second wire connected to the landing region. The first conductive pattern may be connected to the lower capacitor connection pattern.

Abstract: An electronic device includes a display panel, a cushion member disposed below the display panel, an electronic module inserted into a hole defined by the display panel and the cushion member, and a light blocking pattern disposed on the electronic module with the display panel therebetween. The electronic module is spaced apart from a sidewall configured to define the hole in a first state in which the display panel and the cushion member are folded and a second state in which the display panel and the cushion member are unfolded.

Abstract: Provided is a display device including a display panel including a first area, a second area, and a bendable area which is disposed between the first and second areas and is bent so that the second area is disposed below the first area, a driving IC disposed below the second area, a window disposed on the first area, a window protection layer disposed on the window, and a first panel protection layer disposed below the first area. When viewed on a plane, one side of the window protection layer and one side of the window are spaced apart from a first boundary between the first area and the bendable area, and the one side of the window protection layer is disposed between the first boundary ad the one side of the window.

Abstract: An ultrasound diagnostic apparatus of the disclosure includes a display; a probe configured to obtain image data of a cervix using ultrasound; and a controller configured to determine at least one of a cervical angle or a degree of expansion of the cervix based on the image data, to generate an ultrasound image of the cervix, and to control the display so that at least one of the determined cervical angle or the degree of expansion of the cervix is schematically displayed on the ultrasound image.

Abstract: Provided are a cleaning device and a method for driving the cleaning device which cleans a wafer after chemical mechanical polishing. The cleaning device includes a cleaning modules and a running beam, the running beam including a first blade and a second blade to insert or remove the wafer with respect to one of the cleaning modules in a second direction, the first blade and the second blade being fixed to the running beam and movable in the second direction, and the cleaning modules including an input module, a megasonic module, a first brush module, a second brush module and a drying module. The driving method includes performing an operation of inserting or removing the wafer in the second direction using the first blade in a first area; and performing an operation of inserting or removing the wafer in the second direction using the second blade in a second area.

Abstract: A shift lever apparatus for a vehicle moves a center point of rotation of a shift knob upward such that a height of the shift knob exposed to a console and an operating stroke of the shift knob are reduced, and a console size is decreased. The shift lever apparatus allows a manipulation direction of the shift knob is the same as an operational direction of a transmission cable, and thus a connection structure of an existing transmission may be maintained.

Abstract: In a storage device having an improved data receiving rate, the storage device includes: a plurality of memory devices each including a plurality of select signal pads; and a memory controller for providing a plurality of select signals representing a selected memory device among the plurality of memory devices through the plurality of select signal pads, wherein some select signals among the plurality of select signals include stack information indicating a number of the plurality of memory devices controlled by the memory controller.

Abstract: A semiconductor device is provided. The semiconductor device includes a first substrate that has a first side for forming memory cells and a second side that is opposite to the first side. The semiconductor device also includes a doped region and a first connection structure. The doped region is formed in the first side of the first substrate and is electrically coupled to at least a source terminal of a transistor (e.g., a source terminal of an end transistor of multiple transistors that are connected in series). The first connection structure is formed over the second side of the first substrate and coupled to the doped region through a first VIA. The first VIA extends from the second side of the first substrate to the doped region.

Abstract: The ultrasound imaging apparatus according to an embodiment includes: a display configured to display an ultrasound image; an ultrasound probe configured to transmit an ultrasound signal to an object and receive an ultrasound echo signal; and a controller configured to obtain a 4D image of a heart at a first position of the object by processing the ultrasound echo signal, obtain a biplane image of the heart in a second position different from the first position, when an artifact is detected in the biplane image, extract a second cross-sectional image corresponding to a first cross-sectional image in which the artifact is detected among the biplane images from the 4D image and control the display to display the second cross-sectional image.

Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate having a first side and a second side opposite to the first side. The 3D memory device also includes a memory stack including interleaved conductive layers and dielectric layers at the first side of the substrate. The 3D memory device also includes a plurality of channel structures each extending vertically through the memory stack. The 3D memory device also includes a first insulating structure extending vertically through the memory stack and extending laterally to separate the plurality of channel structures into a plurality of blocks. The 3D memory device further includes a first doped region in the substrate and in contact with the first insulating structure. The 3D memory device further includes a first contact extending vertically from the second side of the substrate to be in contact with the first doped region.

Abstract: A foldable display device includes: a display panel; a first support member on a back surface of the display panel and in a first non-folding area; a second support member on a back surface of the display panel and in a second non-folding area and spaced apart from the first support member; a barrier sheet on back surfaces of the first support member and the second support member to overlap the first non-folding area, a folding axis, and the second non-folding area. The barrier sheet is on the folding axis and includes an extension portion extending along a direction of the folding axis. The first support member includes a first groove portion formed at a corner of the first support member adjacent to the folding axis, and the second support member includes a second groove portion formed at a corner of the second support member adjacent to the folding axis.

Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a substrate having a first side and a second side opposite to the first side. The 3D memory device also includes a memory stack including interleaved conductive layers and dielectric layers at the first side of the substrate. The 3D memory device also includes a plurality of channel structures each extending vertically through the memory stack. The 3D memory device also includes a slit structure extending vertically through the memory stack and extending laterally to separate the plurality of channel structures into a plurality of blocks. The 3D memory device further includes a first doped region in the substrate and in contact with the slit structure. The 3D memory device further includes an insulating structure extending vertically from the second side of the substrate to the first doped region.

Abstract: Discussed is a battery module that includes a plurality of battery cells having electrode leads protruding in at least one direction; and at least one bus bar disposed at one side of the plurality of battery cells and connected to the electrode leads of the plurality of battery, the bus bar having a beam penetration prevention guider configured to prevent a laser beam from penetrating toward the plurality of battery cells during a laser welding.