Patents by Inventor Jin Yong

Jin Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate manufacturing method
    Publication number: 20090084494
    Abstract: A substrate manufacturing method is disclosed. A substrate manufacturing method, comprising: providing a support body on which a first separation layer is formed; forming a second separation layer on the first separation layer; forming an adhesion layer which covers the first separation layer and the second separation layer; forming a circuit stack body on the adhesion layer; cutting the circuit stack body, the adhesion layer and the second separation layer to a pre-determined shape; and forming a circuit stack unit by separating the second layer from the first layer, provides easy separation of the circuit stack pattern, which formed on the support body, from the support body and reduced manufacturing cost by reducing number of process and required materials for manufacturing coreless thin substrate.
    Type: Application
    Filed: January 10, 2008
    Publication date: April 2, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Yong An, Joon-Sung Kim, Jong-Kuk Hong, Chang-Sup Ryu
  • Recording medium, method of configuring control information thereof, recording and/or reproducing method using the same, and apparatus thereof
    Patent number: 7512058
    Abstract: The present invention provides a method of configuring and recording control information on an optical disc, thereby enabling to facilitate to utilize the specified control information and to efficiently cope with the recording/reproducing of the optical discs. In configuring a control information within a disc management area of a read-only or recordable disc, the present invention includes configuring the control information with a common field recording an information commonly applied to both of the read-only and recordable discs and a specific field recording an information failing to be commonly applied to at least one disc type.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: March 31, 2009
    Assignee: LG Electronics Inc.
    Inventors: Jin Yong Kim, Sang Woon Suh
  • Printed circuit board having chip package mounted thereon and method of fabricating same
    Patent number: 7506437
    Abstract: Disclosed is a printed circuit board (PCB) and a method of fabricating the same. A contact portion is formed on an internal layer of the multi-layered PCB. A groove is formed so as to expose the contact portion of the internal layer. A chip package is mounted on the PCB while being flip-chip bonded to the exposed contact portion of the internal layer.
    Type: Grant
    Filed: May 13, 2005
    Date of Patent: March 24, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Suk Hyeon Cho, Chang Sup Ryu, Jin Soo Jeong, Jin Yong Ahn
  • Page buffer circuit with reduced size and methods for reading and programming data with the same
    Patent number: 7508709
    Abstract: A page buffer circuit with reduced size and methods for reading and programming data is provided. In the reading operation, the page buffer circuit reads out a data bit by alternatively using a higher bit register or a lower bit register regardless of whether the data bit read from the multi-level cell is a higher bit or a lower bit, thereby reducing the circuit area and improves the performance of operation.
    Type: Grant
    Filed: December 14, 2005
    Date of Patent: March 24, 2009
    Assignee: Hynix Semiconductor Inc.
    Inventors: Jin Yong Seong, Sam Kyu Won
  • Semiconductor device and method of manufacturing the same
    Publication number: 20090072349
    Abstract: Example embodiments provide a semiconductor device and a method of manufacturing the same. A semiconductor device according to example embodiments may include a lower electrode including a first lower electrode and a second lower electrode, and the second lower electrode may be formed on at least a part of the first lower electrode using a material different from the first lower electrode. A dielectric film may be formed on at least a part of the second lower electrode and a first upper electrode may be formed on the dielectric film.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 19, 2009
    Inventors: Yong-Suk Tak, Jung-Hee Chung, Jin-Yong Kim, Wan-Don Kim, Young-Sun Kim
  • Multilayered printed circuit board and fabricating method thereof
    Publication number: 20090073670
    Abstract: A multilayered printed circuit board and a fabricating method thereof are disclosed. A method that includes repeating processes of forming at least one circuit pattern, and at least one insulation layer that covers the circuit pattern, over a carrier and interconnecting circuit patterns on different layers with vias; stacking a metal stiffener over the insulation layer; repeating processes of forming at least one insulation layer and at least one circuit pattern over the stiffener and interconnecting circuit patterns on different layers with vias; and removing the carrier, can be used to reduce warpage in the board and improve workability.
    Type: Application
    Filed: March 17, 2008
    Publication date: March 19, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong-Kuk Hong, Jin-Yong An, Jae-Joon Lee
  • SEMICONDUCTOR DEVICES HAVING A CONTACT PLUG AND FABRICATION METHODS THEREOF
    Publication number: 20090072350
    Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device includes an insulating layer that is formed on a supporting layer and has a contact hole. A first contact plug is formed on an inner wall and bottom of the contact hole. A second contact plug buries the contact hole and is formed on the first contact plug. A conductive layer is connected to the first contact plug and the second contact plug. The bottom thickness of the first contact plug formed on the bottom of the contact hole is thicker than the inner wall thickness of the first contact plug formed on the inner wall of the contact hole.
    Type: Application
    Filed: November 13, 2008
    Publication date: March 19, 2009
    Inventors: Wan-don Kim, Jin-yong Kim, Yong-suk Tak, Jung-hee Chung, Ki-chul Kim, Oh-seong Kwon
  • Recording medium with restricted playback feature and apparatus and methods for forming, recording, and reproducing the recording medium
    Patent number: 7502307
    Abstract: A recording medium, such as a high-density and/or read-only recording medium, such as BD-ROM, capable of preventing unauthorized duplication of data streams, written thereon, onto another medium, such as a BD-RE or BD-R, which includes physical mark information, and to methods and apparatuses for forming, recording, reproducing, and restricting playback of the recording medium to prevent unauthorized duplication.
    Type: Grant
    Filed: July 19, 2006
    Date of Patent: March 10, 2009
    Assignee: LG Electronics Inc.
    Inventors: Sang Woon Suh, Jin Yong Kim
  • Method of fabricating multilayer printed circuit board
    Publication number: 20090056119
    Abstract: Disclosed is a method of fabricating a multilayer printed circuit board, which enables the formation of a micro circuit able to be realized through a semi-additive process using the CTE and rigidity of a metal carrier on a thin substrate which is difficult to convey.
    Type: Application
    Filed: December 28, 2007
    Publication date: March 5, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Shuhichi Okabe, Je Gwang Yoo, Chang Sup Ryu, Myung Sam Kang, Jung Hyun Park, Ji Hong Jo, Jin Yong An, Soon Oh Jung
  • Wirelessly Chargeable And Portable Ultrasonic Diagnostic Device
    Publication number: 20090062652
    Abstract: Embodiments of the present invention may provide a portable ultrasonic diagnostic device to which electric energy can be transferred wirelessly. The device according to the present invention comprises: a wireless energy radiating part for converting an electrical energy into wireless energy to radiate the wireless energy therearound; a main body of the portable ultrasonic diagnostic device, the main body being separated from the radiating part; a wireless energy converting part disposed in the main body and being configured to convert the wireless energy radiated from the radiating part into the electrical energy; and a rechargeable battery connected to the converting part so as to be recharged by the electrical energy converted at the converting part.
    Type: Application
    Filed: September 2, 2008
    Publication date: March 5, 2009
    Inventors: Soo Hwan Shin, Young Seuk Song, Jin Yong Lee
  • Embedded multilayer chip capacitor and printed circuit board having the same
    Patent number: 7499258
    Abstract: The invention provides an embedded multilayer chip capacitor, and a printed circuit board having the same. The embedded multilayer chip capacitor has a capacitor body having a plurality of dielectric layers stacked one on another; a plurality of first and second internal electrodes formed inside the capacitor body, separated by the dielectric layers; and first and second vias extended vertically inside the capacitor body. The first via is connected to the first internal electrodes and the second via is connected to the second internal electrodes. The first via is led to a bottom of the capacitor body and the second via is led to a top of the capacitor body.
    Type: Grant
    Filed: December 29, 2005
    Date of Patent: March 3, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Hoon Shim, Jin Yong An, Suk Hyeon Cho, Sung Hyung Kang
  • DRIVING APPARATUS FOR DISPLAY
    Publication number: 20090051575
    Abstract: A driving apparatus for a display is provided. The driving apparatus for a display comprises a reference voltage generator, a digital-to-analog converter, and an output unit. The reference voltage generator generates a plurality of reference voltages, and receives a difference value between two adjacent reference voltages and generates a plurality of sub reference voltages. The digital-to-analog converter selects one of the reference voltages and outputs the selected reference voltage as a first analog signal. The digital-to-analog converter selects one of the sub reference voltages and outputs the selected reference voltage as a second analog signal. The output unit processes, by addition or subtraction, the first and second analog signals for output.
    Type: Application
    Filed: October 31, 2007
    Publication date: February 26, 2009
    Inventors: Hyung-Min Lee, Gyu Hyeong Cho, Young-Suk Son, Yong-Joon Jeon, Jin Yong Jeon, Seung-Chul Jung
  • DRIVING APPARATUS FOR DISPLAY
    Publication number: 20090051676
    Abstract: A driving apparatus for a display is provided. The driving apparatus for a display comprises: a digital/analog converter for receiving an input voltage lower than a source voltage used in a buffer amplifier for output driving, generating a plurality of reference voltages, and selecting a reference voltage corresponding to an M (M is a positive integer) bit data signal; and an amplifier for amplifying the reference voltage selected by the digital/analog converter. Therefore, a circuit area and power consumption of the driving apparatus for a display can be minimized.
    Type: Application
    Filed: October 31, 2007
    Publication date: February 26, 2009
    Inventors: Gyu Hyeong Cho, Hyung-Min Lee, Young-Suk Son, Yong-Joon Jeon, Jin Yong Jeon, Seung-Chui Jung
  • Recording medium with optional information and apparatus and methods for forming, recording, reproducing and controlling reproduction of the recording medium
    Publication number: 20090052314
    Abstract: A recording medium, such as a high-density and/or read-only recording medium, such as BD-ROM, which includes an identification information, which can identify whether optional information, such as copy protection information, is needed or not for the playback of contents stored on the recording medium, and to methods and apparatuses for forming, recording, and reproducing data on the recording medium.
    Type: Application
    Filed: August 8, 2008
    Publication date: February 26, 2009
    Inventors: Sang Woon Suh, Jin Yong Kim
  • Multilayered printed circuit board and manufacturing method thereof
    Publication number: 20090038837
    Abstract: A multilayered printed circuit board is disclosed. A method of manufacturing the multilayered printed circuit board, which includes: forming a metal layer and a lower-circuit-forming pattern in order on a carrier, and forming a lower circuit by filling a conductive material in the lower-circuit-forming pattern; removing the lower-circuit-forming pattern, stacking an insulation resin, and forming at least one via hole connecting with the lower circuit; forming at least one inner circuit and at least one interlayer connector connecting the inner circuit with the lower circuit on the insulation resin, to form a pair of circuit parts; and aligning the pair of circuit parts, attaching the pair of circuit parts to each other, and removing the carrier and the metal layer, allows the forming of fine-lined circuits and provides a thin board, while preventing bending and warpage in the board.
    Type: Application
    Filed: March 27, 2008
    Publication date: February 12, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Shuhichi Okabe, Jin-Yong An, Seok-Kyu Lee, Soon-Oh Jung, Jong-Kuk Hong, Hae-Nam Seo
  • Printed circuit board including embedded chips and method of fabricating the same
    Patent number: 7485569
    Abstract: A printed circuit board having embedded chips, composed of a central layer having an embedded chip, an insulating layer formed on one surface or both surfaces of the central layer and having a via hole filled with conductive ink, and a circuit layer formed on the insulating layer and having a via hole and a circuit pattern electrically connected to the chip of the central layer through the via hole of the insulating layer. In addition, a method of fabricating a printed circuit board including embedded chips is provided.
    Type: Grant
    Filed: May 24, 2005
    Date of Patent: February 3, 2009
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Sup Ryu, Doo Hwan Lee, Jin Yong Ahn, Myung Sam Kang, Suk Hyeon Cho
  • Recording medium, method of configuring control information thereof, recording and/or reproducing method using the same, and apparatus thereof
    Patent number: 7486600
    Abstract: The present invention provides a record media, and more particularly, to a method of recording disc identification information within a management area of a recordable optical disc and an optical disc recording/reproducing method using the same. In recording optical disc identification information within a disc management area, the present invention includes recording a media type identification information identifying a type of a record media of an optical disc and a disc manufacturer identification information identifying a manufacturer of the optical disc, respectively. Accordingly, the present invention provides various specified methods of recording disc identification information within a management area in a high-density optical disc, thereby enabling to efficiently cope with the recording/reproducing of the optical disc using the recorded identification information.
    Type: Grant
    Filed: July 6, 2004
    Date of Patent: February 3, 2009
    Assignee: LG Electronics Inc.
    Inventors: Jin Yong Kim, Young Kuk Kim
  • High-density disk recording medium having an asymmetrically-shaped center hole and manufacturing method thereof
    Patent number: 7484231
    Abstract: The present invention relates to a high-density disk that is structured to prevent a collision of an optical pickup's objective lens with the high-density disk if the disk is placed upside down in a disk device that is able to record and reproduce signals to/from the high-density disk. A high-density disk recording medium according to the present invention is structured such that, wherein a recording layer having high-density pit patterns is offset from a center plane of disk thickness, a center hole of the disk recording medium is asymmetric in shape with respect to the center plane where, for example, both entrances of the center hole have mutually different diameters.
    Type: Grant
    Filed: May 13, 2002
    Date of Patent: January 27, 2009
    Assignee: LG Electronics Inc.
    Inventors: Jin Yong Kim, Kyung Chan Park
  • High-Temperature Air Braze Filler Materials And Processes For Preparing And Using Same
    Publication number: 20090016953
    Abstract: High-temperature air braze filler materials composed of various ternary metal alloys are described. Noble metals (M) are added as a ternary constituent to a silver-copper oxide (Ag—CuOx) system. The silver (Ag) component is directly substituted with the noble metal to form a series of alloys. Addition of the noble metal increases the solidus and liquidus temperatures of the resulting air braze filler metals and increases temperatures under which seals and other sealing components formed from these filler metals can be employed.
    Type: Application
    Filed: July 10, 2008
    Publication date: January 15, 2009
    Inventors: Kenneth Scott Weil, John S. Hardy, Jin Yong Kim
  • Board having buried patterns and manufacturing method thereof
    Publication number: 20090008143
    Abstract: A board having buried patterns is disclosed. The board may include an insulation panel, a first pattern buried in one side of the insulation panel, a second pattern buried in the other side of the insulation panel with a predetermined insulating thickness between the first pattern and the second pattern, and a via which electrically connects the first pattern and the second pattern. The board having buried patterns according to certain embodiments of the invention can have greater rigidity compared to a board having exposed patterns, for the same insulating thickness. Also, a carrier-insulation set having a particular amount of thickness can be utilized to satisfy the thickness requirement in employing an existing roller apparatus intended for thicker boards.
    Type: Application
    Filed: June 10, 2008
    Publication date: January 8, 2009
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin-Yong Ahn, Chang-Sup Ryu, Byung-Youl Min, Myung-Sam Kang