Abstract: A method of forming a pre-molded lead frame having increased stand-offs includes the steps of attaching a first tape to a first side of the lead frame and a second tape to a second side of the lead frame. The taped lead frame is placed in a mold and a first flow of mold compound is initiated. The first flow of the mold compound fills a space between the first tape and an upper mold chase of the mold. A second flow of the mold compound then is initiated. The second flow of the mold compound fills the spaces between a die pad and leads of the lead frame. The first and second tapes then are removed from the lead frame. Improved stand-offs are provided because the first tape was depressed by the first flow of the mold compound.

Abstract: 17It is intended to provide Bifidobacterium longum having the following bacteriological properties and microbial powders, foods and beverages containing this Bifidobacterium longum: (1) having such fermentation ability as to make a milk base medium to pH 4.6 or below; (2) showing a survival rate of 50% or more in the case of, after attaining pH 4.4 to 4.6 in a milk base medium, quenching and storing at 10° C. for two weeks; and (3) having such gastric juice tolerance as to yield a survival rate of 10% or more in the case of storing in artificial gastric juice (pH 3.0) at 37° C. for two hours.

Abstract: A semiconductor package (100, 150, 200, 250), and method of forming the package, including a substrate (102, 102?, 202, 202?) having an opening (104, 104?, 204, 204?) formed therein. Contact pads (112, 112?, 212, 212?) are formed about a periphery of the opening on a first side of the substrate (106, 106?, 206, 206?) and a second opposing side (132, 132?, 232, 232?) of the substrate. A flip chip die (120, 120?, 220, 220?) is mounted to the substrate, having an active side (114, 114?, 214, 214?) mounted on a first side of the substrate and in electrical communication with at least some of the contact pads formed on the first side of the substrate. At least one wire bond die (110, 110?, 210, 210?) is mounted through the opening, with a non-active side mounted on the active side of the flip chip die. The wire bond die is in electrical communication with at least some of the plurality of contact pads formed on the second opposing side of the substrate.

Abstract: 17It is intended to provide Bifidobacterium longum having the following bacteriological properties and microbial powders, foods and beverages containing this Bifidobacterium longum: (1) having such fermentation ability as to make a milk base medium to pH 4.6 or below; (2) showing a survival rate of 50% or more in the case of, after attaining pH 4.4 to 4.6 in a milk base medium, quenching and storing at 10° C. for two weeks; and (3) having such gastric juice tolerance as to yield a survival rate of 10% or more in the case of storing in artificial gastric juice (pH 3.0) at 37° C. for two hours.