Abstract: In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing a wafer, forming a first to-be-connected member and multiple first alignment members in a first conductive layer; form a first opening and multiple second alignment members in a first mask layer, the first opening is used to define a position of a second to-be-connected member; based on reference and measurement coordinates of the first alignment members, and reference coordinates and measurement coordinates of the second alignment members, obtaining wafer coordinates for characterizing a position deviation of the wafer; obtaining adjustment compensation values according to stacking offsets of a preceding wafer; adjusting a position of the wafer; forming the interconnection structure in a first dielectric layer and a second dielectric layer to electrically interconnect the first to-be-connected member and the second to-be-connected member.

Abstract: In some embodiments, an interconnection structure, an exposure alignment system, and a fabricating method thereof are provided. The method comprises: providing a wafer, forming a first to-be-connected member and multiple first alignment members in a first conductive layer; form a first opening and multiple second alignment members in a first mask layer, the first opening is used to define a position of a second to-be-connected member; based on reference and measurement coordinates of the first alignment members, and reference coordinates and measurement coordinates of the second alignment members, obtaining wafer coordinates for characterizing a position deviation of the wafer; obtaining adjustment compensation values according to stacking offsets of a preceding wafer; adjusting a position of the wafer; forming the interconnection structure in a first dielectric layer and a second dielectric layer to electrically interconnect the first to-be-connected member and the second to-be-connected member.

Abstract: Polymers produced by ring opening polymerization which comprises an amino group that can be used in compositions to deliver a nucleic acid such as a miRNA or a siRNA. In some embodiments, compositions which comprise the polymers described herein and a nucleic acid are also provided herein. In some embodiments, these compositions are used to silence one or more genes in vivo or treat a disease or disorder.

Abstract: An exposure apparatus is provided for performing a column scan-exposure process. The exposure apparatus includes a base for supporting the exposure apparatus; and a reticle stage configured for holding a reticle having at two mask pattern regions and carrying the reticle to move reciprocally along a scanning direction. The exposure apparatus also includes a wafer stage configured for holding a wafer and carrying the wafer to move reciprocally along the scanning direction. Further, the exposure apparatus includes a control unit configured to control the reticle stage and the wafer stage to cooperatively move to cause the at least two mask pattern regions of the reticle on the reticle stage to be continuously and sequentially projected on at least two corresponding exposure shots of the wafer on the wafer stage along the scanning direction to perform a column scan-exposure process.

Abstract: A stored procedure call may be transmitted to a database to execute a database query. As a result of the stored procedure call, results including a result record satisfying the database query and a set of records related to the result record may be received. The results may be stored in a local cache.

Abstract: Polymers produced by ring opening polymerization which comprises an amino group that can be used in compositions to deliver a nucleic acid such as a miRNA or a siRNA. In some embodiments, compositions which comprise the polymers described herein and a nucleic acid are also provided herein. In some embodiments, these compositions are used to silence one or more genes in vivo or treat a disease or disorder.

Abstract: Polymers produced by ring opening polymerization which comprises an amino group that can be used in compositions to deliver a nucleic acid such as a miRNA or a siRNA. In some embodiments, compositions which comprise the polymers described herein and a nucleic acid are also provided herein. In some embodiments, these compositions are used to silence one or more genes in vivo or treat a disease or disorder.

Abstract: A method is provided in one example embodiment and includes, for each user in a subset of users subscribed to a computer-implemented matching service, determining a score for the user, the score indicating a propensity of the user to resubscribe the computer-implemented matching service; determining whether to present a save offer to the user based on the scored determined for the user; and if a determination is made to present a save offer to the user, selecting from a plurality of save offers a save offer for which the user is eligible. The method may further include determining a decile to which the user belongs based on the score determined for the user relative to scores determined for remainder of the subset of users, in which the determining whether to present a save offer to the user is based on the decile to which the user is assigned.

Abstract: An exposure apparatus is provided for performing a unidirectional scan-exposure. The exposure apparatus includes a base and a plurality of wafer stages on the base for loading/unloading wafers and successively moving from a first position to a second position of the base cyclically. The exposure apparatus also includes alignment detection units above the first position of the base for detecting alignment marks on the wafer and aligning the wafers and a cylindrical reticle system above the second position of the base. Further, the exposure apparatus includes an optical projection unit between the cylindrical reticle system and the base for projecting light onto the wafers for an exposure. Further, the exposure apparatus also includes an illuminator box and a main control unit.

Abstract: An exposure method and an exposure device are provided. An exemplary exposure device includes a stage, a first clamp holder, a second clamp holder, an optical projection unit, a first alignment detection unit, and/or a second alignment detection unit. The stage includes a first region and a second region. The first clamp holder is located in the first region and adapted for holding a first substrate, and the second clamp holder is located in the second region and adapted for holding a second substrate. The optical projection unit is located above the stage and adapted for exposure of the first substrate or the second substrate. The first alignment detection unit is adapted for detecting alignment marks of the first substrate. The second alignment detection unit is adapted for detecting alignment marks of the second substrate. The exposure device can accurately position the stage and improve production yield.

Abstract: The present disclosure provides a lithography machine and a scanning and exposing method thereof. According to the scanning and exposing method, the scanning and exposing process for a whole wafer includes two alternately circulated motions: a scanning and exposing motion and a stepping motion; and the scanning and exposing motion is a sinusoidal motion rather than a rapid-acceleration uniform-speed rapid-deceleration scanning and exposing motion in the conventional techniques. During the scanning of a single exposure shot, it may begin to scan the exposure shot once a wafer stage and a reticle stage begin to accelerate from zero speed. And the scanning and exposing may not end until the speeds of the wafer stage and the reticle decrease to zero. Therefore, the effective time of the scanning and exposing in the scanning and exposing motion is greatly increased and the production efficiency of the wafer is improved.

Abstract: An exposure apparatus is provided for performing a column scan-exposure process. The exposure apparatus includes a base for supporting the exposure apparatus; and a reticle stage configured for holding a reticle having at two mask pattern regions and carrying the reticle to move reciprocally along a scanning direction. The exposure apparatus also includes a wafer stage configured for holding a wafer and carrying the wafer to move reciprocally along the scanning direction. Further, the exposure apparatus includes a control unit configured to control the reticle stage and the wafer stage to cooperatively move to cause the at least two mask pattern regions of the reticle on the reticle stage to be continuously and sequentially projected on at least two corresponding exposure shots of the wafer on the wafer stage along the scanning direction to perform a column scan-exposure process.

Abstract: A buck-type DC-to-DC converter and a method of operating the same are provided. The converter includes: an active switch electrically connected to an input power source having an input voltage; a diode having two terminals electrically connected to the active switch and the input power source, respectively; a resonant circuit connected in parallel with the diode and including a capacitor and a resonant inductor connected in series with the capacitor; and an output inductor electrically connected to the resonant circuit and connected in series with a load electrically connected to the resonant circuit. The active switch and the diode are switched in an on-state or an off-state according to different working modes. The active switch is switched from the off-state to the on-state by a switching voltage less than the input voltage. The diode is switched from the on-state to the off-state by a switching current equal to zero.

Abstract: An exposure apparatus is provided for performing a unidirectional scan-exposure. The exposure apparatus includes a base and a plurality of wafer stages on the base for loading/unloading wafers and successively moving from a first position to a second position of the base cyclically. The exposure apparatus also includes alignment detection units above the first position of the base for detecting alignment marks on the wafer and aligning the wafers and a cylindrical reticle system above the second position of the base. Further, the exposure apparatus includes an optical projection unit between the cylindrical reticle system and the base for projecting light onto the wafers for an exposure. Further, the exposure apparatus also includes an illuminator box and a main control unit.

Abstract: A semiconductor device structure includes a substrate having a transistor thereon; a multi-layer contact etching stop layer (CESL) structure covering the transistor, the multi-layer CESL structure comprising a first CESL and a second CESL; and a dielectric layer on the second CESL. The first CESL is made of a material different from that of the second CESL, and the second CESL is made of a material different from that of the dielectric layer.

Abstract: A semiconductor device structure includes a substrate having a transistor thereon; a multi-layer contact etching stop layer (CESL) structure covering the transistor, the multi-layer CESL structure comprising a first CESL and a second CESL; and a dielectric layer on the second CESL. The first CESL is made of a material different from that of the second CESL, and the second CESL is made of a material different from that of the dielectric layer.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.

Abstract: A sealing structure formed at an end of a heat pipe, includes a two-layer structure, which can be divided into two walls and a rib interconnecting the walls together, wherein the rib points to a center of the heat pipe. A method for manufacturing the sealing structure includes following steps: (1) providing a metallic pipe with an end sealed and an opposite open portion; (2) pressing the open portion of the pipe to form the two-layer sealing structure by using a pair of pressing molds, wherein the pair of pressing molds comprises a first pressing mold and a second pressing mold, the first mold having an M-shaped convex portion, the second mold having an M-shaped concave portion corresponding to the convex portion.

Abstract: A semiconductor substrate is first provided. The semiconductor substrate includes a material layer and a patterned photoresist layer disposed on the material layer. Subsequently, a contact etching process is performed on the material layer by utilizing the patterned photoresist layer as an etching mask so to form an etched hole in the material layer. Thereafter, a solvent cleaning process is carried out on the semiconductor substrate by utilizing a cleaning solvent. Next, a water cleaning process is performed on the semiconductor substrate by utilizing deionized water. The temperature of the deionized water is in a range from 30° C. to 99° C.

Abstract: A performance testing apparatus for a heat pipe includes an immovable portion having a cooling structure defined therein for cooling a heat pipe requiring test. A movable portion is capable of moving relative to the immovable portion. A receiving structure is defined between the immovable portion and the movable portion for receiving the heat pipe therein. A concavo-convex cooperating structure is defined in the immovable portion and the movable portion for avoiding the movable portion from deviating from the immovable portion to ensure the receiving structure being capable of precisely receiving the heat pipe. At least a temperature sensor is attached to at least one of the immovable portion and the movable portion for thermally contacting the heat pipe in the receiving structure to detect a temperature of the heat pipe.