Patents by Inventor Jinin SO

Jinin SO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230028071
    Abstract: A memory module includes a device memory configured to store data and including a first memory area and a second memory area, and a controller including an accelerator circuit. The controller is configured to control the device memory, transmit a command to exclude the first memory area from the system memory map to a host processor in response to a mode change request, and modify a memory configuration register to exclude the first memory area from the memory configuration register. The accelerator circuit is configured to use the first memory area to perform an acceleration operation.
    Type: Application
    Filed: April 7, 2022
    Publication date: January 26, 2023
    Inventors: Jonggeon Lee, Jinin So, Yongsuk Kwon, Kyungsoo Kim, Ilkwon Yun, Jeonghyeon Cho
  • Patent number: 11531618
    Abstract: A memory module includes a first memory device, a second memory device, and a processing buffer circuit that is connected to the first memory device and the second memory device (independently of each other) and a host. A processing buffer circuit is provided, which includes a processing circuit and a buffer. The processing circuit processes at least one of data received from the host, data stored in the first memory device, or data stored in the second memory device based on a processing command received from the host. The buffer is configured to store data processed by the processing circuit. The processing buffer circuit is configured to communicate with the host in compliance with a DDR SDRAM standard.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: December 20, 2022
    Inventors: Kyungsoo Kim, Jinin So, Jong-Geon Lee, Yongsuk Kwon, Jin Jung, Jeonghyeon Cho
  • Patent number: 11531496
    Abstract: Memory modules and memory systems having the same are provided. A memory module may include command/address terminals, data terminals, at least one monitoring terminal, a buffer, and a plurality of semiconductor memory devices. The buffer may be configured to receive and buffer data applied through the data terminals and a command/address applied through the command/address terminals to generate buffered write data and a buffered command/address. The buffer may be configured to buffer the buffered write data and the buffered command/address to generate module data and a module command/address, and store and then transmit at least one portion of the buffered write data as monitoring data through the at least one monitoring terminal. The plurality of semiconductor memory devices may be configured to receive and store the module data in response to the module command/address.
    Type: Grant
    Filed: January 21, 2021
    Date of Patent: December 20, 2022
    Inventors: Yongsuk Kwon, Jinin So, Jonggeon Lee, Kyungsoo Kim, Jin Jung, Jeonghyeon Cho
  • Publication number: 20220027090
    Abstract: Memory modules and memory systems having the same are provided. A memory module may include command/address terminals, data terminals, at least one monitoring terminal, a buffer, and a plurality of semiconductor memory devices. The buffer may be configured to receive and buffer data applied through the data terminals and a command/address applied through the command/address terminals to generate buffered write data and a buffered command/address. The buffer may be configured to buffer the buffered write data and the buffered command/address to generate module data and a module command/address, and store and then transmit at least one portion of the buffered write data as monitoring data through the at least one monitoring terminal. The plurality of semiconductor memory devices may be configured to receive and store the module data in response to the module command/address.
    Type: Application
    Filed: January 21, 2021
    Publication date: January 27, 2022
    Inventors: Yongsuk Kwon, Jinin So, Jonggeon Lee, Kyungsoo Kim, Jin Jung, Jeonghyeon Cho
  • Publication number: 20210390049
    Abstract: A memory module includes a first memory device, a second memory device, and a processing buffer circuit that is connected to the first memory device and the second memory device (independently of each other) and a host. A processing buffer circuit is provided, which includes a processing circuit and a buffer. The processing circuit processes at least one of data received from the host, data stored in the first memory device, or data stored in the second memory device based on a processing command received from the host. The buffer is configured to store data processed by the processing circuit. The processing buffer circuit is configured to communicate with the host in compliance with a DDR SDRAM standard.
    Type: Application
    Filed: January 25, 2021
    Publication date: December 16, 2021
    Inventors: Kyungsoo Kim, Jinin So, Jong-Geon Lee, Yongsuk Kwon, Jin Jung, Jeonghyeon Cho
  • Publication number: 20210349730
    Abstract: A booting method of a computing system, which includes a memory module including a processing device connected to a plurality of memory devices, including: powering up the computing system; after powering up the computing system, performing first memory training on the plurality of memory devices by the processing device in the memory module, and generating a module ready signal indicating completion of the first memory training; after powering up the computing system, performing a first booting sequence by a host device, the host device executing basic input/output system (BIOS) code of a BIOS memory included in the computing system; waiting for the module ready signal to be received from the memory module in the host device after performing the first booting sequence; and receiving the module ready signal in the host device, and performing a second booting sequence based on the module ready signal.
    Type: Application
    Filed: December 9, 2020
    Publication date: November 11, 2021
    Inventors: Jonggeon LEE, Kyungsoo KIM, Jinin SO, Yongsuk KWON, Jin JUNG, Jeonghyeon CHO