Abstract: An encapsulant composition for an optical device; comprises an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance. An encapsulant film for an optical device using the same is also provided.

Abstract: The present disclosure discloses a flat substrate heating apparatus including a module support plate having a plurality of unit module regions placed on an upper surface thereof; a plurality of laser light source modules having a plurality of laser light source devices and seated on unit module regions of the module support plate, respectively; a power supply board placed below the module support plate and configured to supply power to the laser light source module; and an electrode terminal electrically connecting the laser light source module and the power supply board while detachably securing them to upper and lower surfaces of the module support plate.

Abstract: The present disclosure provides substrate heat-treating apparatus including a process chamber in which a flat substrate to be heat treated is placed, the process chamber comprising a beam irradiating plate placed below the flat substrate and an infrared transmitting plate placed above the flat substrate; a beam irradiating module for irradiating a laser beam to a lower surface of the flat substrate through the beam irradiating plate; and a gas circulation cooling module for spraying a cooling gas to an upper surface of the infrared transmitting plate, thereby cooling the infrared transmitting plate.

Abstract: The present invention relates to a composition for an encapsulant film including an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance, and an encapsulant film using the same.

Abstract: The present invention relates to an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and a method for preparing the same.

Abstract: The present invention relates to a flexible film, more specifically, to a flexible film that not only exhibits high hardness, but also has excellent flexibility. According to the flexible film of the present invention, flexibility, bendability, high hardness, scratch resistance, and high transparency are exhibited, and there is no concern for damage of the film even when bended repeatedly or folded for a long time, and thus, it may be usefully applied for the front panels, display parts of bendable, flexible, rollable, or foldable mobile devices, display devices, various instrument panels, and the like.

Abstract: An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.8 to 2.3, (c) a melt index (MI2.16) of 1 to 100 dg/min, and (d) a full width at half maximum (FWHM) of a crystallization peak of 15 or more. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.

Abstract: The present invention relates to a composition for an encapsulant film including an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance, and an encapsulant film using the same.

Abstract: The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having excellent volume resistance and light transmittance, and an encapsulant film using the same.

Abstract: The present invention relates to a composition for an encapsulant film, including an ethylene/alpha-olefin copolymer having high volume resistance and light transmittance, and an encapsulant film using the same.

Abstract: An ethylene/alpha-olefin copolymer and method for preparing the same is disclosed herein. In some embodiments, an ethylene/alpha-olefin copolymer satisfying the following conditions, (a) a density of 0.85 to 0.89 g/cc, (b) a molecular weight distribution of 1.5 to 2.3, (c) a melting temperature of 85° C. or less, and (d) a free volume proportional constant (C2) of 600 or less. The ethylene/alpha-olefin copolymer has high volume resistance and light transmittance.

Abstract: The present invention relates to an ethylene/alpha-olefin copolymer having a high weight average molecular weight and narrow molecular weight distribution, and at the same time, a reduced characteristic relaxation time, thereby showing excellent physical properties, and a method for preparing the same. A resin composition having improved volume resistance and excellent light transmittance may be prepared by using such ethylene/alpha-olefin copolymer. Accordingly, the ethylene/alpha-olefin copolymer may be utilized in various uses in electrical and electronic industrial fields.

Abstract: Provided is a method of manufacturing a bump structure, the method including a first step for preparing a wafer including a plurality of chips each including a die pad, an under bump metal (UBM) layer on the die pad, and a bump pattern on the UBM layer, a second step for attaching a backgrinding film to an upper surface of the wafer, a third step for grinding a rear surface of the wafer by a certain thickness, a fourth step for forming a flexible material layer on a second rear surface of the wafer after being ground, and then attaching dicing tape including a ring frame, to the flexible material layer, a fifth step for removing the backgrinding film and then performing a curing process to harden the flexible material layer, and a sixth step for performing a dicing process to cut the plurality of chips into individual chips.

Abstract: Provided is a method of manufacturing a bump structure, the method including a first step for preparing a wafer including a plurality of chips each including a die pad, an under bump metal (UBM) layer on the die pad, and a bump pattern on the UBM layer, a second step for attaching a backgrinding film to an upper surface of the wafer, a third step for grinding a rear surface of the wafer by a certain thickness, a fourth step for forming a flexible material layer on a second rear surface of the wafer after being ground, and then attaching dicing tape including a ring frame, to the flexible material layer, a fifth step for removing the backgrinding film and then performing a curing process to harden the flexible material layer, and a sixth step for performing a dicing process to cut the plurality of chips into individual chips.

Abstract: Disclosed is a method of fabricating a semiconductor package, the method including forming a first resin material, in which alignment grooves are formed, on a carrier substrate; respectively aligning semiconductor chips, to which posts are respectively attached, in the alignment grooves; forming a second resin material on the carrier substrate, the semiconductor chips, and the posts; grinding a portion of the second resin material such that portions of the posts are exposed; respectively forming redistribution layers on the exposed posts; respectively forming insulating film patterns or UBM patterns on the redistribution layers; respectively bonding solder balls onto the redistribution layers or the UBM patterns; removing the carrier substrate from the first resin material and the semiconductor chips; and sawing the first resin material and the second resin material to separate into individual chips.

Abstract: Disclosed is a method of fabricating a semiconductor package, the method including sawing a portion of the thickness of a substrate downward from an upper surface of the substrate along a boundary region between individual chips to form a sawing groove; forming a resin material on the sawing groove and the substrate; removing portions of the resin material to form post spaces on the substrate; filling a conductive material into the post spaces to form posts; respectively forming redistribution layers on the posts; respectively forming insulating film patterns or under bump metal (UBM) patterns on the redistribution layers; respectively bonding solder balls onto the redistribution layers or the UBM patterns; and sawing the resin material to separate into individual chips.

Abstract: The present invention relates to a flexible film, more specifically, to a flexible film that not only exhibits high hardness, but also has excellent flexibility. According to the flexible film of the present invention, flexibility, bendability, high hardness, scratch resistance, and high transparency are exhibited, and there is no concern for damage of the film even when bended repeatedly or folded for a long time, and thus, it may be usefully applied for the front panels, display parts of bendable, flexible, rollable, or foldable mobile devices, display devices, various instrument panels, and the like.

Abstract: A doorbell apparatus and a method of controlling power supply to a doorbell apparatus are provided. The doorbell apparatus may include a power supplier, a battery device charged with power from the power supplier device, a doorbell controller driven using the power from the power supplier device or the power charged in the battery device, and a power supply controller configured to control supply of power to the doorbell controller according to whether the power is input from the power supplier device.

Abstract: Provided is a method of manufacturing a semiconductor package, the method including providing an insulating substrate having a conductive via pattern, forming a first anti-scratch protection layer on a bottom surface of the insulating substrate, forming a first plated pattern and a first passivation pattern on a top surface of the insulating substrate, removing the first anti-scratch protection layer, forming a second anti-scratch protection layer on the top surface of the insulating substrate to cover the first plated pattern and the first passivation pattern, forming a second plated pattern and a second passivation pattern on the bottom surface of the insulating substrate, and removing the second anti-scratch protection layer.

Abstract: A doorbell apparatus and a method of controlling power supply to a doorbell apparatus are provided. The doorbell apparatus may include a power supplier, a battery device charged with power from the power supplier device, a doorbell controller driven using the power from the power supplier device or the power charged in the battery device, and a power supply controller configured to control supply of power to the doorbell controller according to whether the power is input from the power supplier device.