Abstract: Provided are a bedding and a bedding cover therefor, the bedding including an upper cover having a first fastening member; a lower cover having a second fastening member; and a bedding insert fitted between the upper cover and the lower cover, and having a third fastening member for coupling to the upper cover and a fourth fastening member for coupling to the lower cover, the upper cover and the lower cover being coupled to each other by the first fastening member and the second fastening member, and being separated from each other by releasing the coupling between the first fastening member and the second fastening member; the upper cover further including a fifth fastening member disposed at a position corresponding to the third fastening member; and the lower cover further including a sixth fastening member disposed at a position corresponding to the fourth fastening member.

Abstract: Provided is a test method of a NAND flash memory. The method includes programming a page of a selected memory block in the flash memory; accumulating a program result of the page; and repeating the programming of other pages and the accumulating of the program result of the other pages until all pages in the selected memory block are programmed.

Abstract: A method for testing a multi-chip package formed of different types of semiconductor devices, using an integrated burn-in test program which can reduce throughput time, reduce the possibility of error by an operator, and reduce workload. A multi-chip package is tested in burn-in equipment capable of applying a plurality of scan control clock signals. An integrated burn-in test program requires fewer burn-in test programs to be uploaded, fewer contact tests, and fewer bin sorting operations.