Patents by Inventor Jin Yong Choi

Jin Yong Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240137511
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Application
    Filed: January 4, 2024
    Publication date: April 25, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY-UNIVERSITY COOPERATION FOUNDATION KOREA AEROSPACE UNIVERSITY, HANBAT NATIONAL UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jin-Ho LEE, Jung-Won KANG, Hyunsuk KO, Sung-Chang LIM, Dong-San JUN, Ha-Hyun LEE, Seung-Hyun CHO, Hui-Yong KIM, Hae-Chul CHOI, Dae-Hyeok GWON, Jae-Gon KIM, A-Ram BACK
  • Patent number: 11968312
    Abstract: Disclosed herein are an apparatus and method for processing vehicle data security based on a cloud.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: April 23, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sang-Woo Lee, Dae-Won Kim, Jin-Yong Lee, Boo-Sun Jeon, Bo-Heung Chung, Hong-Il Ju, Joong-Yong Choi
  • Publication number: 20240128022
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of grains and grain boundaries disposed between adjacent grains. The grain boundary includes a secondary phase including Sn, a rare-earth element, and a first subcomponent. The rare-earth element includes at least one of Y, Dy, Ho, Er, Gd, Ce, Nd, Sm, Tb, Tm, La, Gd and Yb. The first subcomponent includes at least one of Si, Mg, and Al.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 18, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jin Woo Kim, Chang Hak Choi, Seok Hyun Yoon, Ki Yong Lee, Jong Myeong Jeon
  • Patent number: 11962766
    Abstract: The present invention relates to an encoding method and decoding method, and a device using the same. The encoding method according to the present invention comprises the steps of: specifying an intra prediction mode for a current block; and scanning a residual signal by intra prediction of the current block, wherein the step of scanning the residual signal can determine a scanning type for a luminance signal and a chroma signal of the current block according to an intra prediction mode for a luminance sample of the current block.
    Type: Grant
    Filed: April 9, 2021
    Date of Patent: April 16, 2024
    Assignees: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Hui Yong Kim, Gwang Hoon Park, Kyung Yong Kim, Sung Chang Lim, Jin Ho Lee, Jin Soo Choi, Jin Woong Kim
  • Patent number: 11962803
    Abstract: The multi sample prediction method of the present invention comprises the steps of: determining a sample group consisting of a plurality of samples inside a decoding target block; determining a representative position corresponding to the sample group, inside the decoding target block; determining a representative prediction value for the sample group, on the basis of the determined representative position; and determining the determined representative prediction value as the final prediction value for each of the plurality of samples making up the sample group. The present invention enhances efficiency in encoding/decoding and reduces complexity thereof.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: April 16, 2024
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jin Ho Lee, Hui Yong Kim, Sung Chang Lim, Jong Ho Kim, Ha Hyun Lee, Jin Soo Choi, Jin Woong Kim
  • Publication number: 20240121385
    Abstract: The present invention relates to an intra prediction method and apparatus. The image decoding method according to the present invention may comprise decoding information on intra prediction; and generating a prediction block by performing intra prediction for a current block based on the information on intra prediction. The information on intra prediction may include information on an intra prediction mode, and the intra prediction mode may include a curved intra prediction mode.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Hyun Suk KO, Jin Ho LEE, Sung Chang LIM, Jung Won KANG, Ha Hyun LEE, Dong San JUN, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI
  • Publication number: 20240107002
    Abstract: A method for coding image information includes generating prediction information by predicting information on a current coding unit, and determining whether the information on the current coding unit is the same as the prediction information. When the information on the current coding unit is the same as the prediction information, a flag indicating that the information on the current coding unit is the same as the prediction information is coded and transmitted. When the information on the current coding unit is not the same as the prediction information, a flag indicating that the information on the current coding unit is not the same as the prediction information and the information on the current coding unit are coded and transmitted.
    Type: Application
    Filed: December 6, 2023
    Publication date: March 28, 2024
    Applicants: Electronics and Telecommunications Research Institute, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Se Yoon JEONG, Hui Yong KIM, Sung Chang LIM, Jin Ho LEE, Ha Hyun LEE, Jong Ho KIM, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Gwang Hoon PARK, Kyung Yong KIM, Tae Ryong KIM, Han Soo LEE
  • Publication number: 20240098302
    Abstract: Disclosed are a method for inducing a prediction motion vector and an apparatus using the same. An image decoding method can include: a step of determining the information related to a plurality of spatial candidate prediction motion vectors from peripheral predicted blocks of a predicted target block; and a step of determining the information related to temporal candidate prediction motion vectors on the basis of the information related to the plurality of spatial candidate prediction motion vectors. Accordingly, the present invention can reduce complexity and can enhance coding efficiency when inducing the optimum prediction motion vector.
    Type: Application
    Filed: November 22, 2023
    Publication date: March 21, 2024
    Applicants: Electronics and Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University
    Inventors: Sung Chang LIM, Hui Yong KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Jae Gon KIM, Sang Yong LEE, Un Ki PARK
  • Publication number: 20240098311
    Abstract: The present invention relates to an image encoding/decoding method and apparatus. An image encoding method according to the present invention may comprise generating a transform block by performing at least one of transform and quantization; grouping at least one coefficient included in the transform block into at least one coefficient group (CG); scanning at least one coefficient included in the coefficient group; and encoding the at least one coefficient.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 21, 2024
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, INDUSTRY ACADEMY COOPERATION FOUNDATION OF SEJONG UNIVERSITY
    Inventors: Sung Chang LIM, Jung Won KANG, Hyun Suk KO, Jin Ho LEE, Dong San JUN, Ha Hyun LEE, Seung Hyun CHO, Hui Yong KIM, Jin Soo CHOI, Yung Lyul LEE, Jun Woo CHOI
  • Patent number: 11936853
    Abstract: The present invention relates to an image encoding method and an image decoding method. The image decoding method includes partitioning a picture into a plurality of coding units, constructing a coding unit group including at least one coding unit of the plurality of coding units, obtaining coding information in units of one coding unit group, and decoding at least one coding unit of the plurality of coding units included in the coding unit group by using the obtained coding information.
    Type: Grant
    Filed: January 9, 2023
    Date of Patent: March 19, 2024
    Assignee: Electronics and Telecommunications Research Institute
    Inventors: Jung Won Kang, Sung Chang Lim, Hyun Suk Ko, Ha Hyun Lee, Jin Ho Lee, Dong San Jun, Seung Hyun Cho, Hui Yong Kim, Jin Soo Choi
  • Patent number: 11924988
    Abstract: A display apparatus including a display and a supporter. The supporter being mounted on the display and configured to support the display and rotate the display module between a first position and a second position. The supporter including a drive motor, a first gear, and a detection sensor. The drive motor configured to supply a driving force to rotate the display. The first gear configured to rotate together with the display by receiving the driving force from the drive motor. The detection sensor configured to detect a rotation amount of a second gear configured to rotate in with the first gear.
    Type: Grant
    Filed: December 23, 2022
    Date of Patent: March 5, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyun Yong Choi, Young Chul Kim, Ji Su Kim, Hun Sung Kim, Sung Yong Park, Jin Soo Shin, Dae Sik Yoon, Yong Yeon Hwang
  • Publication number: 20240073416
    Abstract: The present invention relates to an apparatus and method for encoding and decoding an image by skip encoding. The image-encoding method by skip encoding, which performs intra-prediction, comprises: performing a filtering operation on the signal which is reconstructed prior to an encoding object signal in an encoding object image; using the filtered reconstructed signal to generate a prediction signal for the encoding object signal; setting the generated prediction signal as a reconstruction signal for the encoding object signal; and not encoding the residual signal which can be generated on the basis of the difference between the encoding object signal and the prediction signal, thereby performing skip encoding on the encoding object signal.
    Type: Application
    Filed: November 6, 2023
    Publication date: February 29, 2024
    Applicants: Electronics and Telecommunications Research Institute, Kwangwoon University Industry-Academic Collaboration Foundation, Universily-lndustry Cooperation Group of Kyung Hee University
    Inventors: Sung Chang LIM, Ha Hyun LEE, Se Yoon JEONG, Hui Yong KIM, Suk Hee CHO, Jong Ho KIM, Jin Ho LEE, Jin Soo CHOI, Jin Woong KIM, Chie Teuk AHN, Dong Gyu SIM, Seoung Jun OH, Gwang Hoon PARK, Sea Nae PARK, Chan Woong JEON
  • Patent number: 11917148
    Abstract: Disclosed herein are a video decoding method and apparatus and a video encoding method and apparatus. In video encoding and decoding, multiple partition blocks are generated by splitting a target block. A prediction mode is derived for at least a part of the multiple partition blocks, among the multiple partition blocks, and prediction is performed on the multiple partition blocks based on the derived prediction mode. When prediction is performed on the partition blocks, information related to the target block may be used, and information related to an additional partition block, which is predicted prior to the partition block, may be used.
    Type: Grant
    Filed: February 8, 2022
    Date of Patent: February 27, 2024
    Assignees: Electronics And Telecommunications Research Institute, Industry-University Cooperation Foundation Korea Aerospace University, Hanbat National University Industry-Academic Cooperation Foundation
    Inventors: Jin-Ho Lee, Jung-Won Kang, Hyunsuk Ko, Sung-Chang Lim, Dong-San Jun, Ha-Hyun Lee, Seung-Hyun Cho, Hui-Yong Kim, Hae-Chul Choi, Dae-Hyeok Gwon, Jae-Gon Kim, A-Ram Back
  • Patent number: 11917193
    Abstract: According to the present invention, an image encoding apparatus comprises: a motion prediction unit which derives motion information on a current block in the form of the motion information including L0 motion information and L1 motion information; a motion compensation unit which performs a motion compensation for the current block on the basis of at least one of the L0 motion information and L1 motion information so as to generate a prediction block corresponding to the current block; and a restoration block generating unit which generates a restoration block corresponding to the current block based on the prediction block. According to the present invention, image encoding efficiency can be improved.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: February 27, 2024
    Assignees: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, University-Industry Cooperation Group of Kyung Hee University
    Inventors: Hui Yong Kim, Gwang Hoon Park, Kyung Yong Kim, Sang Min Kim, Sung Chang Lim, Jin Ho Lee, Jin Soo Choi, Jin Woong Kim
  • Patent number: 11837612
    Abstract: An image sensor includes: a substrate including a first surface and a second surface on which light is incident, the second surface being opposite to the first surface; a photoelectric converter provided in the substrate; a first metal layer provided on the first surface of the substrate; a second metal layer provided on the first metal layer; and a capacitor layer provided between the first metal layer and the second metal layer, wherein the capacitor layer includes: a first lower electrode electrically connected to the first metal layer, a first upper electrode electrically connected to the second metal layer, a second upper electrode spaced apart from the first upper electrode and electrically connected to the second metal layer, a first capacitor provided between the first lower electrode and the first upper electrode, and a second capacitor provided between the first lower electrode and the second upper electrode.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: December 5, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-Jun Choi, In Gyu Baek, Bom I Sim, Jin Yong Choi
  • Patent number: 11626438
    Abstract: Image sensors are provided. The image sensor may include a substrate including a first surface and a second surface opposite the first surface, a photoelectric conversion layer in the substrate, and a lower capacitor connection pattern on the first surface of the substrate. The second surface of the substrate may be configured to receive incident light. The lower capacitor connection pattern may include a capacitor region and a landing region protruding from the capacitor region. The image sensors may also include a capacitor structure including a first conductive pattern, a dielectric pattern, and a second conductive pattern sequentially stacked on the capacitor region, a first wire on the capacitor structure and connected to the second conductive pattern, and a second wire connected to the landing region. The first conductive pattern may be connected to the lower capacitor connection pattern.
    Type: Grant
    Filed: July 26, 2021
    Date of Patent: April 11, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Joo Sung Moon, In Gyu Baek, Seung Han Yoo, Hae Min Lim, Min Jung Chung, Jin Yong Choi
  • Patent number: 11508775
    Abstract: The inventive concepts provide a three-dimensional (3D) image sensor, based on structured light (SL), having a structure in which difficulty in a manufacturing process of a wiring layer is decreased and/or an area of a bottom pad of a capacitor is increased. The 3D image sensor includes: a pixel area including a photodiode in a semiconductor substrate and a gate group including a plurality of gates; a multiple wiring layer on an upper portion of the pixel area, the multiple wiring layer including at least two wiring layers; and a capacitor structure between a first wiring layer on a lowermost wiring layer of the multiple wiring layer and a second wiring layer on the first wiring layer, the capacitor structure including a bottom pad, a top pad, and a plurality of capacitors, wherein the bottom pad is connected to the first wiring layer.
    Type: Grant
    Filed: August 10, 2021
    Date of Patent: November 22, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Gang Zhang, Shi Li Quan, Hyung-yong Kim, Seug-gab Park, In-gyu Baek, Kyung-rae Byun, Jin-yong Choi
  • Patent number: 11416168
    Abstract: A memory controller and a storage device including the same are provided. The memory controller for performing a buffering operation of temporarily storing data to be written to a non-volatile memory and data to be read from the non-volatile memory in a buffer memory includes a buffer request queue configured to store a plurality of buffer write requests requesting data to be temporarily stored in the buffer memory and a plurality of buffer read requests requesting data stored in the buffer memory to be read, a buffer traffic monitor configured to calculate the total amount of requested data in real time by summing the lengths of data specified in the respective buffer write requests and the respective buffer read requests stored in the buffer request queue, and a buffer manager configured to control execution of the buffering operation by setting an execution ratio based on the total amount of requested data calculated in real time.
    Type: Grant
    Filed: November 6, 2020
    Date of Patent: August 16, 2022
    Assignee: FADU Inc.
    Inventors: Hongseok Kim, EHyun Nam, Yeong-Jae Woo, Jin-yong Choi
  • Publication number: 20220052086
    Abstract: An image sensor includes: a substrate including a first surface and a second surface on which light is incident, the second surface being opposite to the first surface; a photoelectric converter provided in the substrate; a first metal layer provided on the first surface of the substrate; a second metal layer provided on the first metal layer; and a capacitor layer provided between the first metal layer and the second metal layer, wherein the capacitor layer includes: a first lower electrode electrically connected to the first metal layer, a first upper electrode electrically connected to the second metal layer, a second upper electrode spaced apart from the first upper electrode and electrically connected to the second metal layer, a first capacitor provided between the first lower electrode and the first upper electrode, and a second capacitor provided between the first lower electrode and the second upper electrode.
    Type: Application
    Filed: April 23, 2021
    Publication date: February 17, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Min-Jun Choi, In Gyu Baek, Bom I Sim, Jin Yong Choi
  • Publication number: 20210366974
    Abstract: The inventive concepts provide a three-dimensional (3D) image sensor, based on structured light (SL), having a structure in which difficulty in a manufacturing process of a wiring layer is decreased and/or an area of a bottom pad of a capacitor is increased. The 3D image sensor includes: a pixel area including a photodiode in a semiconductor substrate and a gate group including a plurality of gates; a multiple wiring layer on an upper portion of the pixel area, the multiple wiring layer including at least two wiring layers; and a capacitor structure between a first wiring layer on a lowermost wiring layer of the multiple wiring layer and a second wiring layer on the first wiring layer, the capacitor structure including a bottom pad, a top pad, and a plurality of capacitors, wherein the bottom pad is connected to the first wiring layer.
    Type: Application
    Filed: August 10, 2021
    Publication date: November 25, 2021
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Gang ZHANG, Shi Li QUAN, Hyung-yong KIM, Seug-gab PARK, In-gyu BAEK, Kyung-rae BYUN, Jin-yong CHOI