Patents by Inventor Jitendra S. Rathore

Jitendra S. Rathore has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Nanostructured organosilicates from thermally curable block copolymers
    Patent number: 8557943
    Abstract: Provided are inorganic-organic block copolymers that self assemble without the addition of a precursor. The inorganic block of the polymers includes silicon and the organic block may be any organic polymer. The inorganic-organic block copolymers self assemble to form a material in which the inorganic polymer block may be crosslinked to produce an organosilicate and/or silica matrix, and further thermal curing of the matrix results in the formation of a porous nanostructured film.
    Type: Grant
    Filed: April 29, 2011
    Date of Patent: October 15, 2013
    Assignee: International Business Machines Corporation
    Inventors: Krishna S. Bajjuri, Qiu Dai, Alshakim Nelson, Jitendra S. Rathore
  • Nanostructured Organosilicates from Thermally Curable Block Copolymers
    Publication number: 20120277339
    Abstract: Provided are inorganic-organic block copolymers that self assemble without the addition of a precursor. The inorganic block of the polymers includes silicon and the organic block may be any organic polymer. The inorganic-organic block copolymers self assemble to form a material in which the inorganic polymer block may be crosslinked to produce an organosilicate and/or silica matrix, and further thermal curing of the matrix results in the formation of a porous nanostructured film.
    Type: Application
    Filed: April 29, 2011
    Publication date: November 1, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Krishna M. Bajjuri, Qiu Dai, Alshakim Nelson, Jitendra S. Rathore
  • INTERCONNECT STRUCTURE AND METHOD FOR FABRICATING ON-CHIP INTERCONNECT STRUCTURES BY IMAGE REVERSAL
    Publication number: 20120261828
    Abstract: An interconnect structure includes a patterned and cured dielectric layer located directly on a surface of a patterned permanent antireflective coating. The patterned and cured dielectric layer and the permanent antireflective coating form shaped openings. The shaped openings include an inverse profile which narrows towards a top of the shaped openings. A conductive structure fills the shaped openings wherein the patterned and cured dielectric layer and the permanent antireflective coating each have a conductively filled region.
    Type: Application
    Filed: April 15, 2011
    Publication date: October 18, 2012
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: ROBERT L. BRUCE, Qinghuang Lin, Alshakim Nelson, Satyanarayana V. Nitta, Dirk Pfeiffer, Jitendra S. Rathore