Abstract: A micro leadframe package and a method for forming a micro leadframe package are disclosed in which two leadframes that include paddles are coupled together such that only dielectric material extends between the two paddles. Semiconductor die are attached to paddles on the top leadframe, and a wire bonding process is then performed, followed by a molding process, plating, and a singulation process. This forms a micro leadframe package that, when ground is coupled to one paddle and power is coupled to the other paddle, provides a low inductance path for both power and ground supply to the semiconductor die. Moreover, as only dielectric material extends between the two paddles, the two paddles and the dielectric material that extends between the paddles form a capacitor, providing decoupling capacitance within the micro leadframe package.