Abstract: An optical assembly of a microlithography imaging device comprises a holding device for holding an optical element. The holding device has a holding element having first and second interface sections. The first interface section for a first interface connecting the holding element and the optical element in an installed state. The second interface section forms a second interface connecting the holding element and a support unit in the installed state. The support unit connects the optical element to a support structure to support the optical element on the support structure via a supporting force. The holding device comprises an actuator device engaging on the holding element between the first and second interfaces. The actuator device acts on the holding element via a controller so that a specifiable interface deformation and/or a specifiable interface force distribution acting on the optical element is set on the first interface.

Abstract: A facet assembly is a constituent part of a facet mirror for an illumination optical unit for projection lithography. The facet assembly has a facet with a reflection surface for reflecting illumination light. A facet main body of the facet assembly has at least one hollow chamber. A reflection surface chamber wall of the hollow chamber forms at least one portion of the reflection surface. An actuator control apparatus of the facet assembly is operatively connected to the hollow chamber for the controlled deformation of the reflection surface chamber wall. The result is a facet assembly that is usable flexibly as a constituent part of a facet mirror equipped therewith within an illumination optical unit for projection lithography.

Abstract: An optical arrangement, in particular to a lithography system, includes: a first component, in particular a carrying frame; a second component which is movable relative to the first component, in particular a mirror or a housing; and at least one stop having at least one stop face for limiting the movement of the second component in relation to the first component. The stop includes a metal foam for absorbing the kinetic energy of the second component when it strikes against the stop face. A method for repairing an optical arrangement of this kind after a shock load includes replacing at least one stop, in which the metal foam was compressed under the shock load, with a stop in which the metal foam is not compressed.

Abstract: A projection exposure apparatus for semiconductor lithography includes a mirror and a temperature-regulating device for regulating temperature on the basis of radiation. The mirror includes at least one cutout. The temperature-regulating device includes a temperature-regulating body arranged without contact in the cutout of the mirror. The temperature-regulating body has a cavity. A fluid for temperature regulation of the temperature-regulating body is present in the cavity.

Abstract: An assembly in an optical system, such as a microlithographic projection exposure apparatus, includes an optical element, at least one cooling channel through which can flow a cooling fluid for cooling the optical element during the operation of the optical system, and at least one corrosion detector for detecting an existing or imminent corrosion on the basis of the determination of at least one measurement variable indicating a corrosion-dictated change in state of the cooling fluid.

Abstract: A method and an apparatus for determining the heating state of an optical element in a microlithographic optical system involves at least one contactless sensor which is based on the reception of electromagnetic radiation from the optical element. The radiation range captured by the sensor is varied for the purposes of ascertaining a temperature distribution in the optical element.

Abstract: A microlithographic arrangement, for example using light in the extreme UV range, includes a supporting structure for supporting an optical unit, the mass of which can be 4 t to 14 t. The supporting structure includes a number of separate supporting units for supporting the optical unit. Each of the supporting units includes an air bearing unit by way of which a supporting force which counteracts the weight of the optical unit can be generated. The number of supporting units is at least four, at least two of the supporting units being coupled via a coupling device to form a supporting unit pair in such a way that the coupling device counteracts a deviation from a predeterminable ratio of the supporting forces of the two supporting units of the supporting unit pair.

Abstract: An optical arrangement (1) for EUV radiation includes: at least one reflective optical element (16) having a main body (30) with a coating (31) that reflects EUV radiation (33). At least one shield (36) is fitted to at least one surface region (35) of the main body (30) and protects the at least one surface region (35) against an etching effect of a plasma (H+, H*) that surrounds the reflective optical element (16) during operation of the optical arrangement (1). A distance (A) between the shield (36) and the surface region (35) of the main body (30) is less than double the Debye length (?D), preferably less than the Debye length (?D), of the surrounding plasma (H+, H*).

Abstract: The disclosure relates to an optical module with first and second components, a supporting structure and an anticollision device. The first component is supported by the supporting structure and is arranged adjacent to and at a distance from the second component to form a gap. The supporting structure defines a path of relative movement, on which the first and second components move in relation to one another under the influence of a disturbance, a collision between collision regions of the first and second components occurring if the anticollision device is inactive. The anticollision device includes a first anticollision unit on the first component, which produces a first field, and a second anticollision unit on the second component, which is assigned to the first anticollision unit and produces a second field.

Abstract: A method and an apparatus for determining the heating state of an optical element in a microlithographic optical system involves at least one contactless sensor which is based on the reception of electromagnetic radiation from the optical element. The radiation range captured by the sensor is varied for the purposes of ascertaining a temperature distribution in the optical element.

Abstract: A microlithographic arrangement, for example using light in the extreme UV range, includes a supporting structure for supporting an optical unit, the mass of which can be 4 t to 14 t. The supporting structure includes a number of separate supporting units for supporting the optical unit. Each of the supporting units includes an air bearing unit by way of which a supporting force which counteracts the weight of the optical unit can be generated. The number of supporting units is at least four, at least two of the supporting units being coupled via a coupling device to form a supporting unit pair in such a way that the coupling device counteracts a deviation from a predeterminable ratio of the supporting forces of the two supporting units of the supporting unit pair.

Abstract: An optical arrangement, in particular to a lithography system, includes: a first component, in particular a carrying frame; a second component which is movable relative to the first component, in particular a mirror or a housing; and at least one stop having at least one stop face for limiting the movement of the second component in relation to the first component. The stop includes a metal foam for absorbing the kinetic energy of the second component when it strikes against the stop face. A method for repairing an optical arrangement of this kind after a shock load includes replacing at least one stop, in which the metal foam was compressed under the shock load, with a stop in which the metal foam is not compressed.

Abstract: An optical arrangement (1) for EUV radiation includes: at least one reflective optical element (16) having a main body (30) with a coating (31) that reflects EUV radiation (33). At least one shield (36) is fitted to at least one surface region (35) of the main body (30) and protects the at least one surface region (35) against an etching effect of a plasma (H+, H*) that surrounds the reflective optical element (16) during operation of the optical arrangement (1). A distance (A) between the shield (36) and the surface region (35) of the main body (30) is less than double the Debye length (?D), preferably less than the Debye length (?D), of the surrounding plasma (H+, H*).

Abstract: An optical system for a lithography apparatus, having a first component, a second component, and an optical element, which is held between the first component and the second component with force-fit engagement and for this purpose is subjected to a clamping force. At least one of the components includes a bearing portion which contacts the optical element and which has a shape-memory alloy.

Abstract: An optical system for a lithography apparatus, having a first component, a second component, and an optical element, which is held between the first component and the second component with force-fit engagement and for this purpose is subjected to a clamping force. At least one of the components includes a bearing portion which contacts the optical element and which has a shape-memory alloy.

Abstract: The disclosure relates to an optical module with first and second components, a supporting structure and an anticollision device. The first component is supported by the supporting structure and is arranged adjacent to and at a distance from the second component to form a gap. The supporting structure defines a path of relative movement, on which the first and second components move in relation to one another under the influence of a disturbance, a collision between collision regions of the first and second components occurring if the anticollision device is inactive. The anticollision device includes a first anticollision unit on the first component, which produces a first field, and a second anticollision unit on the second component, which is assigned to the first anticollision unit and produces a second field.

Abstract: An optical component for coupling out an individual output beam from a collective output beam includes a plurality of radiation-reflecting regions which are grouped in such a way that regions of the same group serve for guiding different partial beams of the individual output beam to the same scanner.

Abstract: A projection exposure apparatus (10) for microlithography has a measuring system (50) for measuring an optical element of the projection exposure apparatus. The measuring system (50) includes an irradiation device (54), which is configured to radiate measuring radiation (62) in different directions (64) onto the optical element (20), such that the measuring radiation (62) covers respective optical path lengths (68) within the optical element (20) for the different directions (64) of incidence, a detection device (56), which is configured to measure, for the respective directions (64) of incidence, the respective optical path lengths covered by the measuring radiation (62) in the optical element (20), and an evaluation device, which is configured to determine a spatially resolved distribution of refractive indices in the optical element (20) by computed-tomographic back projection of the respective measured path lengths with respect to the respective directions of incidence.

Abstract: The invention relates to a projection exposure apparatus for semiconductor lithography, comprising an illumination system for illuminating a mask arranged on a movable mask stage, and comprising a projection lens for imaging the mask onto a semiconductor substrate, wherein at least one means is present for at least partly decoupling at least parts of the illumination system and/or of the projection lens from the influence of pressure fluctuations in the medium surrounding the projection lens or the illuminated system, the pressure fluctuations being attributed to movements of the mask stage during the operation of the apparatus.

Abstract: A method for producing an optical element includes: providing a substrate (102), applying a layer system (103), wherein an optically effective surface (101) is formed and wherein the layer system has a layer (104) that is thermally deformable for manipulating the geometric shape of the optically effective surface, and applying a temperature field to the optical element while at least regionally heating the thermally deformable layer to above a specified operating temperature of the optical system. The thermally deformable layer is configured such that a deformation that is induced when the temperature field is applied is at least partially maintained after the optical element has cooled. Also disclosed is an optical element (400) that has an optically effective surface (401), a substrate (402), and a layer system (403) that has a reflection layer system (406), which includes a shape-memory alloy.