Abstract: An optical element for use in an illumination optical unit of an EUV microlithography projection exposure apparatus includes a plurality of reflective facet elements. Each reflective facet element has at least one reflective surface. In this case, at least one facet element is arranged in a manner rotatable about a rotation axis. The rotation axis intersects the at least one reflective surface of the facet element. With such an optical element, it is possible to alter the direction and/or the intensity of at least part of the illumination radiation within the illumination optical unit in a simple manner.

Abstract: A method for cooling an optical element for EUV applications is disclosed. Heat is transferred from the optical element to a heat sink, and, via a first feed line, a first cooling medium is introduced into a cooling channel in the heat sink, in such a way that the first cooling medium effects laminar flow through the cooling channel and in the process absorbs heat from the heat sink. After flowing through the cooling channel, the first cooling medium is discharged into a discharge line leading away from the optical element. A second cooling medium is introduced into the discharge line via a second feed line, and the first cooling medium and the second cooling medium, downstream of the second feed line at a location that is further away from the optical element than the cooling channel, are subjected to a force field introduced into the discharge line externally.

Abstract: A lithography apparatus is disclosed, which comprises a mirror having at least two mirror segments which are joined together in such a way that an interspace is formed between the mirror segments, and a sensor for detecting the relative position of the mirror segments, wherein the sensor is arranged in the interspace between the mirror segments.

Abstract: A projection exposure apparatus (10) for microlithography has a measuring system (50) for measuring an optical element of the projection exposure apparatus. The measuring system (50) includes an irradiation device (54), which is configured to radiate measuring radiation (62) in different directions (64) onto the optical element (20), such that the measuring radiation (62) covers respective optical path lengths (68) within the optical element (20) for the different directions (64) of incidence, a detection device (56), which is configured to measure, for the respective directions (64) of incidence, the respective optical path lengths covered by the measuring radiation (62) in the optical element (20), and an evaluation device, which is configured to determine a spatially resolved distribution of refractive indices in the optical element (20) by computed-tomographic back projection of the respective measured path lengths with respect to the respective directions of incidence.

Abstract: A mirror with a mirror carrier, as well as related apparatuses, systems and methods are disclosed. The mirror carrier can be embodied as cooling device with at least one cooling channel. Tube connections can be provided to connecting the at least one cooling channel to an inlet and an outlet of coolant. Sealing elements for a gas-tight and liquid-tight seals can be arranged between the tube connections and the mirror carrier. The field of application of the mirror can be, for example, an illumination device of a projection exposure apparatus.

Abstract: The invention concerns an arrangement for thermal actuation of a mirror in a microlithographic projection exposure apparatus, wherein the mirror has an optical effective surface and at least one access passage extending from a surface of the mirror, that does not correspond to the optical effective surface, in the direction of the effective surface, wherein the arrangement is designed for thermal actuation of the mirror via electromagnetic radiation which is propagated in the access passage, wherein the arrangement further has at least one heat radiating mechanism which produces the electromagnetic radiation which is propagated in the access passage, and wherein the heat radiating mechanism is actuable along the access passage.

Abstract: A facet mirror device includes a facet element, a support device and a clamping device. The facet element includes a first support section, while the support device comprises a second support section contacting the first support section to support the facet element. The clamping device includes a tensioning element, a first end of the tensioning element being connected to the facet element a second end of the tensioning element being connected to a counter unit. The counter unit includes a third support section, the support device including a fourth support section contacting the third support section to support the counter unit.

Abstract: The invention relates to an optical element for a projection exposure apparatus for semiconductor lithography comprising an optically active surface and at least one cooling component for cooling the optical element, wherein the cooling component is connected to at least two separate cooling circuits and embodied in such a way that the optically active surface can be cooled to a greater extent in at least one partial region than in a further partial region. The invention furthermore relates to a projection exposure apparatus comprising an optical element according to the invention.

Abstract: Illumination optics for EUV microlithography guide an illumination light bundle from a radiation source to an object field with an extension ratio between a longer field dimension and a shorter field dimension, where the ratio is considerably greater than 1.

Abstract: A projection exposure tool for microlithography for exposing a substrate is disclosed. The tool includes a projection objective. The tool also includes an optical measuring apparatus for determining a surface topography of the substrate before the substrate is exposed. The measuring apparatus has a measuring beam path which extends outside of the projection objective. The measuring apparatus is a wavefront measuring apparatus configured to determine topography measurement values simultaneously at a number of points on the substrate surface.

Abstract: The disclosure concerns an arrangement for mirror temperature measurement and/or thermal actuation of a mirror in a microlithographic projection exposure apparatus. The mirror has an optical effective surface and at least one access passage extending from a surface of the mirror, that does not correspond to the optical effective surface, in the direction of the effective surface. The arrangement is designed for mirror temperature measurement and/or thermal actuation of the mirror via electromagnetic radiation which is propagated along the access passage. The electromagnetic radiation is reflected a plurality of times within the access passage.

Abstract: There is provided an optical module for microlithography. The optical module includes an optical element and a retaining device for holding the optical element. The optical element has (a) a main extension plane, in which it defines a radial direction R and a circumferential direction U, and (b) a free optical diameter and an overrun in the region of its outer periphery. The retaining device contacts the optical element in the region of the overrun, and is formed and/or contacts the optical element in such a manner that the overrun ratio, calculated from the overrun related to a minimum overrun necessary for the production of the optical element, is at most 1.5.

Abstract: A method for setting an illumination optical unit involves determining an actual value of an intensity-weighted illumination parameter of the illumination optical unit for multiple field points and for multiple illumination angles. The influence of a deformation of at least one of the optical surfaces of the illumination optical unit on the at least one illumination parameter is then determined. A desired value of the illumination parameter is then predefined. A desired form of the at least one optical surface is determined so that the actual value of the illumination parameter corresponds to the desired value of the illumination parameter within predefined limits. Finally, the optical surface is deformed with the aid of at least one actuator so that an actual form of the optical surface corresponds to the desired form.

Abstract: A method for setting an illumination optical unit involves determining an actual value of an intensity-weighted illumination parameter of the illumination optical unit for multiple field points and for multiple illumination angles. The influence of a deformation of at least one of the optical surfaces of the illumination optical unit on the at least one illumination parameter is then determined. A desired value of the illumination parameter is then predefined. A desired form of the at least one optical surface is determined so that the actual value of the illumination parameter corresponds to the desired value of the illumination parameter within predefined limits. Finally, the optical surface is deformed with the aid of at least one actuator so that an actual form of the optical surface corresponds to the desired form.

Abstract: An optical element for use in an illumination optical unit of an EUV microlithography projection exposure apparatus includes a plurality of reflective facet elements. Each reflective facet element has at least one reflective surface. In this case, at least one facet element is arranged in a manner rotatable about a rotation axis. The rotation axis intersects the at least one reflective surface of the facet element. With such an optical element, it is possible to alter the direction and/or the intensity of at least part of the illumination radiation within the illumination optical unit in a simple manner.

Abstract: A facet mirror (6; 10) serves for use in microlithography. The facet mirror (6; 10) has a plurality of facets (7; 11) which predefine illumination channels for guiding partial beams of EUV illumination light (3). At least some of the facets (7; 11) are displaceable via an adjusting device (30; 34) having an actuator (31; 35) with a movement component (32; dz?; dz?) perpendicular to a facet reflection plane (xy; x?y?; x?y?). This results in a facet mirror with which given requirements made of complying with desired illumination predefinitions that are to be achieved during the use of the facet mirror are achieved with lower production outlay in comparison with the prior art.

Abstract: An illumination optical system for EUV microlithography is used to direct an illumination light beam from a radiation source to an object field. At least one EUV mirror has a reflective face with a nonplanar mirror topography for forming the illumination light beam. The EUV mirror has at least one EUV attenuator arranged in front of it. The attenuator face which faces the reflective face of the EUV mirror has an attenuator topography which is designed to complement the mirror topography such that at least sections of the attenuator face are arranged at a constant interval from the reflective face. The result is an illumination optical system in which it is possible to correct unwanted variations in illumination parameters, for example an illumination intensity distribution or an illumination angle distribution, over the object field with as few unwanted radiation losses as possible.

Abstract: An illumination optics for EUV microlithography guides an illumination light bundle from a radiation source to an object field with an extension ratio between a longer field dimension and a shorter field dimension, where the ratio is considerably greater than 1. A field facet mirror has a plurality of field facets that set defined illumination conditions in the object field. A following optics downstream of the field facet mirror transmits the illumination light into the object field. The following optics includes a pupil facet mirror with a plurality of pupil facets. The field facets are in each case individually allocated to the pupil facets so that portions of the illumination light bundle impinging upon in each case one of the field facets are guided on to the object field via the associated pupil facet.

Abstract: The present disclosure relates to an optical device, in particular for microlithography, having an optical module, a supporting structure and a force-generating device. The force-generating device is connected to the optical module and the supporting structure and is designed to exert a clamping force on the optical module. The force-generating device has a fluidic force-generating element having a working chamber to which a working fluid having a working pressure can be applied. The force-generating element takes the form of a muscle element which exerts a first tensile force at a first working pressure and a second tensile force which is increased with respect to the first tensile force at a second working pressure which is increased with respect to the first working pressure.

Abstract: There is provided an optical element unit comprising an optical element, a connector element, and an optical element holder. The optical element has a plane of main extension as well as an outer circumference and defines a radial direction. The connector element connects the optical element and the optical element holder, the connector element having a first connector part connected to the optical element at the outer circumference and a second connector part connected to the optical element holder. The first connector part and the second connector part are connected via at least one coupling part, the coupling part being compliant in the radial direction and substantially preventing rotation between the first connector part and the second connector part in a plane substantially parallel to the plane of main extension.