Patents by Inventor Joanna Rosner
Joanna Rosner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 9263292Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: GrantFiled: December 5, 2013Date of Patent: February 16, 2016Assignee: GLOBALFOUNDRIES INC.Inventors: Guy M. Cohen, Steven A. Cordes, Sherif A. Goma, Joanna Rosner, Jeannine M. Trewhella
-
Patent number: 8832936Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.Type: GrantFiled: July 31, 2009Date of Patent: September 16, 2014Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20140141618Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: ApplicationFiled: December 5, 2013Publication date: May 22, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Guy M. Cohen, Steven A. Cordes, Sherif A. Goma, Joanna Rosner, Jeannine M. Trewhella
-
Patent number: 8603846Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: GrantFiled: February 10, 2011Date of Patent: December 10, 2013Assignee: International Business Machines CorporationInventors: Guy A. Cohen, Steven A. Cordes, Sherif A. Goma, Joanna Rosner, Jeannine M. Trewhella
-
Patent number: 8054095Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.Type: GrantFiled: September 30, 2005Date of Patent: November 8, 2011Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20110130005Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: ApplicationFiled: February 10, 2011Publication date: June 2, 2011Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Guy A. Cohen, Steven A. Cordes, Sherif A. Goma, Joanna Rosner, Jeannine M. Trewhella
-
Patent number: 7915064Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: GrantFiled: August 10, 2009Date of Patent: March 29, 2011Assignee: International Business Machines CorporationInventors: Guy A. Cohen, Steven A. Cordes, Sherif A. Goma, Joanna Rosner, Jeannine M. Trewhella
-
Patent number: 7823278Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: GrantFiled: September 6, 2005Date of Patent: November 2, 2010Assignee: International Business Machines CorporationInventors: Gareth G Hougham, Keith E Fogel, Joanna Rosner, Paul A Lauro, Sherif Goma, Joseph Zinter, Jr.
-
Patent number: 7771208Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: GrantFiled: May 27, 2008Date of Patent: August 10, 2010Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
-
Patent number: 7648369Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: GrantFiled: November 17, 2006Date of Patent: January 19, 2010Assignee: International Business Machines CorporationInventors: Gareth G. Hougham, Keith E. Fogel, Joanna Rosner, Paul A. Lauro, Sherif Goma, Joseph Zinter, Jr.
-
Publication number: 20090300914Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, a method of forming an electrical connecting device includes the steps of: depositing an elastomeric material on an electrically insulating carrier; and metallizing the elastomeric material so as to form an electrically conductive layer running continuously through a plane of the carrier and along a surface of the elastomeric material.Type: ApplicationFiled: July 31, 2009Publication date: December 10, 2009Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20090298292Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: ApplicationFiled: August 10, 2009Publication date: December 3, 2009Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Guy A. Cohen, Steven A. Cordes, Sherif A. Goma, Joanna Rosner, Jeannine M. Trewhella
-
Publication number: 20090053908Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: ApplicationFiled: May 27, 2008Publication date: February 26, 2009Applicant: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20090044405Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: ApplicationFiled: February 15, 2008Publication date: February 19, 2009Inventors: Gareth G. Hougham, Keith E. Fogel, Joanna Rosner, Paul A. Lauro, Sherif Goma, Joseph Zinter, JR.
-
Publication number: 20090001248Abstract: A solder mold includes a substrate and a plurality of cavities for holding solder to be transferred to an integrated circuit. The plurality of cavities comprises cavities of at least two different volumes.Type: ApplicationFiled: August 23, 2007Publication date: January 1, 2009Inventors: Matthew J. Farinelli, Steven Cordes, Donna S. Nielsen, Samuel Roy McKnight, Jay S. Chey, Peter A. Gruber, Joanna Rosner
-
Publication number: 20090004840Abstract: A method for fabricating a solder transfer mold includes masking a substrate with a masking agent. A pattern is transferred to the substrate mask. The masked substrate is etched until cavities of a first volume are formed. The cavities of the first volume are selectively coated. The masked substrate is etched until cavities of a second volume are formed.Type: ApplicationFiled: June 27, 2007Publication date: January 1, 2009Inventors: Matthew J. Farinelli, Steven Cordes, Donna S. Nielsen, Samuel Roy McKnight, Jay S. Chey, Peter A. Gruber, Joanna Rosner
-
Patent number: 7452212Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: GrantFiled: September 30, 2005Date of Patent: November 18, 2008Assignee: International Business Machines CorporationInventors: Gareth Geoffrey Hougham, Ali Afzali, Steven Allen Cordes, Paul W. Coteus, Matthew J. Farinelli, Sherif A. Goma, Alphonso P. Lanzetta, Daniel Peter Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20080094085Abstract: A probe structure for an electronic device is provided. In one aspect, the probe structure includes an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure includes an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier. The probe structure includes one or more other contact structures adapted for connection to a test apparatus.Type: ApplicationFiled: September 30, 2005Publication date: April 24, 2008Inventors: Gareth Hougham, Ali Afzali, Steven Cordes, Paul Coteus, Matthew Farinelli, Sherif Goma, Alphonso Lanzetta, Daniel Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20070298626Abstract: Techniques for forming enhanced electrical connections are provided. In one aspect, an electrical connecting device comprises an electrically insulating carrier having one or more contact structures traversing a plane thereof. Each contact structure comprises an elastomeric material having an electrically conductive layer running along at least one surface thereof continuously through the plane of the carrier.Type: ApplicationFiled: September 30, 2005Publication date: December 27, 2007Inventors: Gareth Hougham, Ali Afzali, Steven Cordes, Paul Coteus, Matthew Farinelli, Sherif Goma, Alphonso Lanzetta, Daniel Morris, Joanna Rosner, Nisha Yohannan
-
Publication number: 20070087588Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: ApplicationFiled: November 17, 2006Publication date: April 19, 2007Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Gareth Hougham, Keith Fogel, Joanna Rosner, Paul Lauro, Sherif Goma, Joseph Zinter