Patents by Inventor Joanna Rosner
Joanna Rosner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7137827Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: GrantFiled: November 17, 2003Date of Patent: November 21, 2006Assignee: International Business Machines CorporationInventors: Gareth G Hougham, Keith E Fogel, Joanna Rosner, Paul A Lauro, Sherif Goma, Joseph Zinter, Jr.
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Publication number: 20060009038Abstract: A process for overcoming extreme topographies by first planarizing a cavity in a semiconductor substrate in order to create a planar surface for subsequent lithography processing. As a result of the planarizing process for extreme topographies, subsequent lithography processing is enabled including the deposition of features in close proximity to extreme topographic surfaces (e.g., deep cavities or channels) and, including the deposition of features within a cavity. In a first embodiment, the process for planarizing a cavity in a semiconductor substrate includes the application of dry film resists having high chemical resistance. In a second embodiment, the process for planarizing a cavity includes the filling of cavity using materials such as polymers, spin on glasses, and metallurgy.Type: ApplicationFiled: July 12, 2004Publication date: January 12, 2006Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Guy Cohen, Steven Cordes, Sherif Goma, Joanna Rosner, Jeannine Trewhella
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Publication number: 20060009050Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: ApplicationFiled: September 6, 2005Publication date: January 12, 2006Inventors: Gareth Hougham, Keith Fogel, Joanna Rosner, Paul Lauro, Sherif Goma, Joseph Zinter
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Publication number: 20050106902Abstract: An interposer having one or more hollow electrical contact buttons disposed in a carrier. The interposer is formed by disposing sacrificial posts in vias of the carrier. The electrical contact buttons are formed on the sacrificial posts by a metallizing process in desired pattern using a mask. The sacrificial posts are made of a material that thermally decomposes upon application of heat without altering the carrier or the electrical contact buttons.Type: ApplicationFiled: November 17, 2003Publication date: May 19, 2005Inventors: Gareth Hougham, Keith Fogel, Joanna Rosner, Paul Lauro, Sherif Goma, Joseph Zinter
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Patent number: 6762088Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: GrantFiled: January 3, 2003Date of Patent: July 13, 2004Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso
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Patent number: 6720230Abstract: A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP.Type: GrantFiled: September 10, 2002Date of Patent: April 13, 2004Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Melanie L. Carasso, Steven A. Cordes, Robert A. Groves, Jennifer L. Lund, Joanna Rosner
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Patent number: 6713827Abstract: A method is provided for the manufacture of micro-structures, such as micro-electromechanical structures (MEMS) or silicon optical benches (SiOB). The method includes using a single mask to pattern two or more cavity areas to be etched into a substrate in different etching steps, and then selectively choosing the cavity areas for etching. In a preferred embodiment, the method includes patterning a substrate to identify a plurality of cavity areas to be etched into the substrate and filling at least one of the cavity areas with a distinctive filler material. Filler material is chemically distinctive in the sense that it can be etched selectively with respect to the other filling materials. At least one of the cavity areas containing a distinctive filler material is then chosen based at least in part on the distinctive filler material. The chosen cavity area is then etched.Type: GrantFiled: January 27, 2003Date of Patent: March 30, 2004Assignee: International Business Machines CorporationInventors: Guy Moshe Cohen, Steven Alan Cordes, Joanna Rosner, Jeannine Madelyn Trewhella
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Publication number: 20030148548Abstract: A method is provided for the manufacture of micro-structures, such as micro-electromechanical structures (MEMS) or silicon optical benches (SiOB). The method includes using a single mask to pattern two or more cavity areas to be etched into a substrate in different etching steps, and then selectively choosing the cavity areas for etching. In a preferred embodiment, the method includes patterning a substrate to identify a plurality of cavity areas to be etched into the substrate and filling at least one of the cavity areas with a distinctive filler material. Filler material is chemically distinctive in the sense that it can be etched selectively with respect to the other filling materials. At least one of the cavity areas containing a distinctive filler material is then chosen based at least in part on the distinctive filler material. The chosen cavity area is then etched.Type: ApplicationFiled: January 27, 2003Publication date: August 7, 2003Applicant: International Business Machines CorporationInventors: Guy Moshe Cohen, Steven Alan Cordes, Joanna Rosner, Jeannine Madelyn Trewhella
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Publication number: 20030096435Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: ApplicationFiled: January 3, 2003Publication date: May 22, 2003Inventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso
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Patent number: 6562642Abstract: A method is provided for the manufacture of micro-structures, such as micro-electromechanical structures (MEMS) or silicon optical benches (SiOB). The method includes using a single mask to pattern two or more cavity areas to be etched into a substrate in different etching steps, and then selectively choosing the cavity areas for etching. In a preferred embodiment, the method includes patterning a substrate to identify a plurality of cavity areas to be etched into the substrate and filling at least one of the cavity areas with a distinctive filler material. Filler material is chemically distinctive in the sense that it can be etched selectively with respect to the other filling materials. At least one of the cavity areas containing a distinctive filler material is then chosen based at least in part on the distinctive filler material. The chosen cavity area is then etched.Type: GrantFiled: February 7, 2002Date of Patent: May 13, 2003Assignee: International Business Machines CorporationInventors: Guy Moshe Cohen, Steven Alan Cordes, Joanna Rosner, Jeannine Madelyn Trewhella
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Patent number: 6534843Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: GrantFiled: February 10, 2001Date of Patent: March 18, 2003Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso
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Publication number: 20030011041Abstract: A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP.Type: ApplicationFiled: September 10, 2002Publication date: January 16, 2003Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Raul E. Acosta, Melanie L. Carasso, Steven A. Cordes, Robert A. Groves, Jennifer L. Lund, Joanna Rosner
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Patent number: 6492708Abstract: A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP.Type: GrantFiled: March 14, 2001Date of Patent: December 10, 2002Assignee: International Business Machines CorporationInventors: Raul E. Acosta, Melanie L. Carasso, Steven A. Cordes, Robert A. Groves, Jennifer L. Lund, Joanna Rosner
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Publication number: 20020130386Abstract: A means for fabrication of solenoidal inductors integrated in a semiconductor chip is provided. The solenoidal coil is partially embedded in a deep well etched into the chip substrate. The non-embedded part of the coil is fabricated as part of the BEOL metallization layers. This allows for a large cross-sectional area of the solenoid turns, thus reducing the turn-to-turn capacitive coupling. Because the solenoidal coils of this invention have a large diameter cross-section, the coil can be made with a large inductance value and yet occupy a small area of the chip. The fabrication process includes etching of a deep cavity in the substrate after all the FEOL steps are completed; lining said cavity with a dielectric followed by fabrication of the part of the coil that will be embedded by deposition of a conductive material metal through a mask; deposition of dielectric and planarization of same by CMP.Type: ApplicationFiled: March 14, 2001Publication date: September 19, 2002Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Raul E. Acosta, Melanie L. Carasso, Steven A. Cordes, Robert A. Groves, Jennifer L. Lund, Joanna Rosner
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Publication number: 20020109204Abstract: Inductor losses to a semiconducting substrate are eliminated in an IC structure by etching a well into the substrate down to the insulating layer coating the substrate and fabricating a grounded Faraday shield in the shape of elongated segments in the bottom of the well. The well lies directly below the inductor and is optionally filled with cured low-k organic dielectric or air.Type: ApplicationFiled: February 10, 2001Publication date: August 15, 2002Applicant: International Business Machines CorporationInventors: Raul E. Acosta, Jennifer L. Lund, Robert A. Groves, Joanna Rosner, Steven A. Cordes, Melanie L. Carasso