Abstract: The invention relates to a construction element (10) having a total length (L), a total width (B) and a total height (H) and comprising the following components: a first cover plate (11) and a second cover plate (12), each having a length corresponding to the total length (L), and each having a width corresponding to the total width (B), a layer (13) arranged between the first and the second cover plate (11,12), comprising a plurality of tube segments (14) having a tube length (LR) extending in longitudinal extension direction, wherein the tube segments (14) are arranged in the direction of the total length (L) and/or in the direction of the total width (B) in relation to the tube length (LR), and wherein the tube segments (14) comprise a wood-based material, and wherein the tube segments (14) comprise a wall (140), which is delimited by at least two cut ends (141,142) in the circumferential direction of the respective tube segment (14), wherein the tube length (LR) corresponds to the total length (L) and/

Abstract: The invention relates to a pallet (1) comprising a first plate (10) and a second plate (20), wherein said first plate (10) and said second plate (20) are parallel, and wherein said first plate (10) and said second plate (20) each extend along a length (L) and a width (W) of said pallet (1), and wherein said pallet (1) comprises a height (H) which extends transversely to said length (L) and said width (W), and wherein said pallet (1) comprises at least one supporting element (11) which is integrally formed with said first plate (10) and/or said second plate (20), wherein said at least one supporting element (11) extends between said first plate (10) and said second plate (20) along said height (H).

Abstract: The invention relates to a pallet (1), comprising a basic body (10) with a first panel (11), a second panel (12) and a layer (13) having a plurality of tube segments (14) which is arranged between the panels (11, 12), wherein the layer (13) has at least one cutout (131) which is continuous in the direction of a pallet height (HP), and wherein the first panel (11) has at least one first opening (111) which at least partially overlaps with the at least one cutout (131). The invention further relates to a foot (16) and a runner (17) for a pallet (1), to a sandwich block (2) for producing a layer (13) of a pallet (1), and to a method for producing a pallet (1).

Abstract: The invention relates to a pallet (1) comprising parallel panels (11, 12), a layer (13) arranged between the panels (11, 12) and formed by at least one spacer (18), having a respective first strip (15a) and a plurality of tube segments (14), wherein the tube segments (14) have two respective cut ends (141, 142) and two respective cut surfaces (143, 144), wherein the tube segments (14) are mechanically connected to the first strip (15a) by their cut ends (141, 142), and mechanically connected to the panels (11, 12) by their cut surfaces (143, 144), wherein the tube segments (14) of the at least one spacer (18) have two respective lateral elements (146) and a cover element (147) mechanically connected to the lateral elements (146), wherein the lateral elements (146) form a first internal angle (?) of 95° to 120° with the cover element (147).

Abstract: The invention relates to a pallet (1) comprising parallel panels (11, 12), a layer (13) arranged between the panels (11, 12) and formed by at least one spacer (18), having a respective first strip (15a) and a plurality of tube segments (14), wherein the tube segments (14) have two respective cut ends (141, 142) and two respective cut surfaces (143, 144), wherein the tube segments (14) are mechanically connected to the first strip (15a) by their cut ends (141, 142), and mechanically connected to the panels (11, 12) by their cut surfaces (143, 144), wherein the tube segments (14) of the at least one spacer (18) have two respective lateral elements (146) and a cover element (147) mechanically connected to the lateral elements (146), wherein the lateral elements (146) form a first internal angle (?) of 95° to 120° with the cover element (147).

Abstract: The invention relates to a pallet (1) comprising a first plate (10) and a second plate (20), wherein said first plate (10) and said second plate (20) are parallel, and wherein said first plate (10) and said second plate (20) each extend along a length (L) and a width (W) of said pallet (1), and wherein said pallet (1) comprises a height (H) which extends transversely to said length (L) and said width (W), and wherein said pallet (1) comprises at least one supporting element (11) which is integrally formed with said first plate (10) and/ or said second plate (20), wherein said at least one supporting element (11) extends between said first plate (10) and said second plate (20) along said height (H).

Abstract: The invention relates to a construction element (10) having a total length (L), a total width (B) and a total height (H) and comprising the following components: a first cover plate (11) and a second cover plate (12), each having a length corresponding to the total length (L), and each having a width corresponding to the total width (B), a layer (13) arranged between the first and the second cover plate (11,12), comprising a plurality of tube segments (14) having a tube length (LR) extending in longitudinal extension direction, wherein the tube segments (14) are arranged in the direction of the total length (L) and/or in the direction of the total width (B) in relation to the tube length (LR), and wherein the tube segments (14) comprise a wood-based material, and wherein the tube segments (14) comprise a wall (140), which is delimited by at least two cut ends (141,142) in the circumferential direction of the respective tube segment (14), wherein the tube length (LR) corresponds to the total length (L) and/

Abstract: The invention relates to a pallet (1), comprising a basic body (10) with a first panel (11), a second panel (12) and a layer (13) having a plurality of tube segments (14) which is arranged between the panels (11, 12), wherein the layer (13) has at least one cutout (131) which is continuous in the direction of a pallet height (HP), and wherein the first panel (11) has at least one first opening (111) which at least partially overlaps with the at least one cutout (131). The invention further relates to a foot (16) and a runner (17) for a pallet (1), to a sandwich block (2) for producing a layer (13) of a pallet (1), and to a method for producing a pallet (1).

Abstract: The invention relates to a web (1) with a web base (3) and a tube segment (4) made of a wood-based material or bamboo, wherein the tube segment (4) comprises a wall (5) which is delimited in the circumferential direction of two cut ends (8, 9), and wherein the tube segment (4) is mechanically connected to the web base (3) by means of at least one of the cut ends (8, 9). The invention further relates to a sandwich plate (2) with a plate layer (11) and a core layer (13), wherein the core layer (13) comprises at least one web (1) according to the invention which is mechanically connected to the adjacent connecting face (14) of the plate layer (11) by means of a cut face (6, 7) of a tube segment (4), wherein the cut faces (6, 7) delimit the wall (5) of the tube segment (4) in longitudinal extension direction. The invention further relates to a sandwich block (26) and a methods for producing a sandwich plate, a web (1) and a sandwich block (26).

Abstract: A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component.

Abstract: Non-planar via designs for sub-mounts on which to mount a LED or other optoelectronic device include a continuous layer of metal to conduct the current from the front-side (e.g., LED side) to the backside (e.g., SMD side) through the via and to provide a sufficiently stable and reliable under bump metallization for SMD soldering. Each UBM can be structured so that it does not fully cover the sidewall surfaces of the via that forms the front-to-backside interconnect. In some implementations, each via structure for the feedthrough metallization extends to a respective side-edge of the sub-mount.

Abstract: A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 ?m-700 ?m. The optoelectronic device is mounted on a die attach pad on the front-side surface of the substrate. Feed-through metallization in one or more via structures electrically couples the die attach pad to a contact pad on the back-side surface of the substrate.

Abstract: A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component.

Abstract: A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component.

Abstract: A package for an optoelectronic device (e.g., a light emitting device such as a LED) includes a sub-mount including a silicon substrate having a thickness in the range of 350 ?m-700 ?m. The optoelectronic device is mounted on a die attach pad on the front-side surface of the substrate. Feed-through metallization in one or more via structures electrically couples the die attach pad to a contact pad on the back-side surface of the substrate.

Abstract: A wafer-level method of fabricating an opto-electronic component package, in which the opto-electronic component is mounted to a semiconductor wafer having first and second surfaces on opposite sides of the wafer. The method includes etching vias in the first surface of the semiconductor wafer. The first surface and surfaces in the vias are metallized, and the metal is structured to define a thermal pad and to define the anode and cathode contact pads. A carrier wafer is attached on the side of the semiconductor wafer having the first surface, and the semiconductor wafer is thinned from its second surface to expose the metallization in the vias. Metal is provided on the second surface, and the metal is structured to define a die attach pad and additional anode and cathode pads for the opto-electronic component. The opto-electronic component is mounted on the die attach pad and a protective cover is formed over the opto-electronic component.

Abstract: A wafer-level method of fabricating a chip-to-wafer or wafer-to-wafer semiconductor packages includes etching a cavity into a first semiconductor wafer and etching vias in a bottom of the cavity. The cavity and sidewalls of the vias are selectively metallized. The cavity can be used to house either an electrical circuit component or to contain a device die. A second semiconductor wafer is placed over the cavity-side of the first semiconductor and is sealed to the first semiconductor wafer. A backside of the first semiconductor wafer is thinned to expose metallization in the vias and metal is deposited on the backside to form circuit routing paths.

Abstract: A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads.

Abstract: A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads.

Abstract: A camera module includes an image sensor substrate including image sensor circuitry, and a lens barrel. A lid structure includes a transparent window and is disposed between, and attached to, the lens barrel and the image sensor substrate. The lid structure may be fabricated as part of a wafer-level process.