Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: The substrate includes an alignment slot in at least one of its side edges, and includes metallization coupled electrically to the micro component and extending from the front surface of the substrate to its back surface via at least one of the alignment slots. The assembly also includes a cover attached to the substrate so as to encapsulate the micro component. The cover includes at least one protrusion on its underside such that each protrusion mates with a respective alignment slot in the side edges of the substrate.

Abstract: A package includes one or more optoelectronic components and a cap with an embedded glass window attached to a substrate. The optoelectronic component(s) is supported by the substrate and is capable of detecting or emitting light through the glass window. The glass window may serve as an optical filter. Techniques are disclosed for fabricating a relatively thin package with an embedded glass window in the cap.

Abstract: A package includes a sensor die with a micro component, such as a MEMS device, coupled to an integrated circuit which may include, for example, CMOS circuitry, and one or more electrically conductive bond pads near the periphery of the sensor die. A semiconductor cap structure is attached to the sensor die. The front side of the cap structure is attached to the sensor die by a seal ring to hermetically encapsulate an area of the sensor die where the micro component is located. The bond pads on the sensor die are located outside the area encapsulated by the seal ring. Electrical leads, which extend along outer side edges of the semiconductor cap structure from its front side to its back side, are coupled to the micro component via the bond pads.

Abstract: The present invention relates to a surface mountable acoustic transducer system, comprising one or more transducers, a processing circuit electrically connected to the one or more transducers, and contact points arranged on an exterior surface part of the transducer system. The contact points are adapted to establish electrical connections between the transducer system and an external substrate, the contact points further being adapted to facilitate mounting of the transducer system on the external substrate by conventional surface mounting techniques.

Abstract: The substrate includes an alignment slot in at least one of its side edges, and includes metallization coupled electrically to the micro component and extending from the front surface of the substrate to its back surface via at least one of the alignment slots. The assembly also includes a cover attached to the substrate so as to encapsulate the micro component. The cover includes at least one protrusion on its underside such that each protrusion mates with a respective alignment slot in the side edges of the substrate.