Abstract: An electronic component has a chip stack with a first semiconductor chip, a second semiconductor chip, and a large number of flat conductors configured in between the first semiconductor chip and the a second semiconductor chip. The flat conductors have a central section on which the semiconductor chips are mounted. First bonding connections connect the first semiconductor chip to inner sections of the flat conductors. Second bonding connections connect the second semiconductor chip to transitional sections of the flat conductors. The outer sections of the flat conductors project out of a package.

Abstract: An actuator component for a piezoelectrically-driven microatomizer comprises a diaphragm formed in a semiconductor substrate, a piezoelectric actuator which is arranged on a surface of the diaphragm and by means of which the diaphragm can be caused to vibrate, and a passage formed in the semiconductor substrate and used for supplying a liquid to be atomized from an inlet end to the diaphragm surface located opposite the piezoelectric actuator.

Abstract: An electronic component includes stacked electronic elements with external contacts. The external contacts are connected to contact terminal pads of an interconnect layer disposed on an isolating body. This isolating body extends over underlying side edges of a further electronic element, and its interconnect layer is connected to another interconnect layer of the stack via its external contact surfaces.