Abstract: A method of stacking semiconductor chips includes providing four semiconductor chips that each include a top surface with central bond pads. Each of the bond pads is electrically coupled to second bond pads located in a peripheral portion of the semiconductor chip through a conductive layer. The first and the second semiconductor chips are arranged alongside one another on a carrier substrate. The second bond pads from the first and second semiconductor chips are bonded to corresponding landing pads on the substrate. The third semiconductor chip is then stacked over the first semiconductor chip and the fourth semiconductor chip over the second semiconductor chip. The second bond pads of the third and fourth semiconductor chips can then be bonded to contact pads of the substrate. The substrate can then be separated into a first stack that includes the first and third semiconductor chips and a second stack that includes the second and fourth semiconductor chips.

Abstract: A stack arrangement of discrete components includes a carrier substrate and at least two discrete components, e.g., memory chips. The carrier substrate has line conductor structures and contact pads. Each of the discrete components includes centrally disposed bond pads and a metallic coating, which is electrically connected to the centrally disposed bond pads. The metallic coating is disposed on an active surface area of each discrete component. A protective structure overlies a central region of the discrete component. In the preferred embodiment, the metallic coatings of each discrete component are identical. Preferably, the discrete components are stacked on the carrier substrate so as to have the same orientation, so that the protective structure serves as a spacer between the discrete components. Further, the metallic coating is electrically coupled to the carrier substrate.

Abstract: An electronic component has a chip stack with a first semiconductor chip, a second semiconductor chip, and a large number of flat conductors configured in between the first semiconductor chip and the a second semiconductor chip. The flat conductors have a central section on which the semiconductor chips are mounted. First bonding connections connect the first semiconductor chip to inner sections of the flat conductors. Second bonding connections connect the second semiconductor chip to transitional sections of the flat conductors. The outer sections of the flat conductors project out of a package.

Abstract: An actuator component for a piezoelectrically-driven microatomizer comprises a diaphragm formed in a semiconductor substrate, a piezoelectric actuator which is arranged on a surface of the diaphragm and by means of which the diaphragm can be caused to vibrate, and a passage formed in the semiconductor substrate and used for supplying a liquid to be atomized from an inlet end to the diaphragm surface located opposite the piezoelectric actuator.

Abstract: An electronic component includes stacked electronic elements with external contacts. The external contacts are connected to contact terminal pads of an interconnect layer disposed on an isolating body. This isolating body extends over underlying side edges of a further electronic element, and its interconnect layer is connected to another interconnect layer of the stack via its external contact surfaces.