Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

Abstract: An apparatus includes a first printed circuit board (PCB), the first PCB including a first interface, and a corrosion sensor assembly. The corrosion sensor assembly including a second interface arranged to be coupled to the first interface. The corrosion sensor assembly further including a signal trace field and a plurality of components, where the signal trace field and the plurality of components are arranged to provide an indication of whether the apparatus is in an environment that is corrosive.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

Abstract: A system includes a millimeter (MM) wave radar detector, where the MM wave radar detector generates signal data associated with a person of interest (POI) within a field of view of the MM wave radar detector. The system further includes an Access Point (AP) coupled with the MM wave radar detector. The AP includes a computing device to receive and analyze the signal data provided by the MM wave radar detector to determine a movement of the POI within an environment, and facilitate generation of a feedback response in response to the determined movement or action of the POI within the environment.

Abstract: A system includes a millimeter (MM) wave radar detector, where the MM wave radar detector generates signal data associated with a person of interest (POI) within a field of view of the MM wave radar detector. The system further includes an Access Point (AP) coupled with the MM wave radar detector. The AP includes a computing device to receive and analyze the signal data provided by the MM wave radar detector to determine a movement or action of the POI within the field of view, and facilitate generation of a feedback response in response to the determined movement or action of the POI.

Abstract: In one embodiment, a battery backup unit (BBU) cut-off and recharge circuit includes: a first transistor, a power entry connection connected to a main power supply, where power from the power entry connection flows to application circuits for an electronic device, and the first transistor is positioned between a BBU and the power entry connection, and a microcontroller, where the microcontroller is operative to: detect a loss of power from the main power supply, turn on the first transistor to enable the BBU to discharge through the power entry connection to application circuits, detect a status of charge (SOC) for the BBU, and upon detecting that the SOC is under a predefined threshold, set the BBU cut-off and recharge circuit to a lockdown state by turning off the first transistor.

Abstract: A control method improves the efficiency profile of a power supply across a wide range of output loading. The method includes obtaining a measure of output power for a power supply, which includes one or more output modules and an auxiliary power supply. The method determines whether a maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power. Responsive to a determination that the maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power, the controller of the power supply directs the auxiliary power supply to provide the output power.

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

Abstract: A control method improves the efficiency profile of a power supply across a wide range of output loading. The method includes obtaining a measure of output power for a power supply, which includes one or more output modules and an auxiliary power supply. The method determines whether a maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power. Responsive to a determination that the maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power, the controller of the power supply directs the auxiliary power supply to provide the output power.

Abstract: A control method improves the efficiency profile of a power supply across a wide range of output loading. The method includes obtaining a measure of output power for a power supply, which includes one or more output modules and an auxiliary power supply. The method determines whether a maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power. Responsive to a determination that the maximum power rating of the auxiliary power supply is sufficient to provide the measure of output power, the controller of the power supply directs the auxiliary power supply to provide the output power.

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: A structure includes a first copper layer and a first carbon layer applied directly to a surface of the first copper layer, a second copper layer and a second carbon layer applied directly to a surface of the second copper layer, and an insulating core disposed between the first and second copper layers. Each of the first carbon layer and the second carbon layer faces toward and directly contacts the insulating core. The structure provides electrical power to a component of an electronic device.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

Abstract: Regulation of a voltage gradient may be provided. A plurality of test voltage values associated with a corresponding plurality of locations associated with an electronic device may be received. Then, based on the plurality of test voltage values, a target setpoint may be determined for a power supply that supplies power to the electronic device. The target setpoint may be configured to cause a maximum of voltage values at the plurality of locations to be below a maximum voltage level defined by a specification for the electronic device. The target setpoint may also be configured to cause a minimum of the voltage values at the plurality of locations to be above a minimum voltage level defined by the specification for the electronic device. The power supply may then be driven at the target setpoint.

Abstract: An apparatus includes a printed circuit board (PCB), and an integrated circuit (IC) package connected with the PCB. The IC package includes a package substrate, a die secured to the package substrate and including an integrated circuit, and a stiffener ring secured to the package substrate and surrounding so as to define a perimeter around the die. The stiffener ring increases a rigidity of the package substrate and delivers electrical power to the integrated circuit, where the stiffener ring includes a first conductive layer forming a power (PWR) plane for the integrated circuit, a second conductive layer forming a ground (GND) plane for the integrated circuit, and an insulating layer disposed between the first conductive layer and the second conductive layer.

Abstract: Channel predictive behavior and fault analysis may be provided. A forward time value may be determined comprising a time a forward signal takes to travel from a transmitter over a channel to the receiver. Next, a reflected time value may be determined comprising a time a reflected signal takes to travel to the receiver. The reflected signal may be associated with the forward signal. A discontinuity may then be determined to exist on the channel based on the forward time value and the reflected time value. The reflected signal may be caused by the discontinuity and a high impedance or low impedance at the transmitter present after the forward signal is sent.

Abstract: Regulation of a voltage gradient may be provided. A plurality of test voltage values associated with a corresponding plurality of locations associated with an electronic device may be received. Then, based on the plurality of test voltage values, a target setpoint may be determined for a power supply that supplies power to the electronic device. The target setpoint may be configured to cause a maximum of voltage values at the plurality of locations to be below a maximum voltage level defined by a specification for the electronic device. The target setpoint may also be configured to cause a minimum of the voltage values at the plurality of locations to be above a minimum voltage level defined by the specification for the electronic device. The power supply may then be driven at the target setpoint.