Patents by Inventor Joerg-Erich Sorg

Joerg-Erich Sorg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10468317
    Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical prot
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: November 5, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Thomas Schwarz, Stefan Groetsch, Joerg Erich Sorg, Christoph Koller
  • Patent number: 10468569
    Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.
    Type: Grant
    Filed: April 19, 2016
    Date of Patent: November 5, 2019
    Assignees: OSRAM Opto Semiconductor GmbH, Heraeus Deutschland Gmbh & Co. KG, ALANOD GmbH & Co. KG
    Inventors: Jörg Erich Sorg, Stefan Ziegler, Michael Austgen, Alexander Peetsch, Eckhard Ditzel, Michael Benedikt
  • Patent number: 10418530
    Abstract: An optoelectronic semiconductor chip having a semiconductor body (1) that is suitable for emitting electromagnetic radiation in a first wavelength range from a radiation exit face (3) is specified. Furthermore, the semiconductor chip comprises a ceramic or monocrystalline conversion platelet (6) that is suitable for converting electromagnetic radiation in the first wavelength range into electromagnetic radiation in a second wavelength range, which is different from the first wavelength range, and a wavelength-converting joining layer (7) that connects the conversion platelet (6) to the radiation exit face (3), wherein the wavelength-converting joining layer (7) has luminescent material particles (4) that are suitable for converting radiation in the first wavelength range into radiation in a third wavelength range, which is different from the first wavelength range and the second wavelength range. The wavelength-converting joining layer (7) furthermore has a thickness of no more than 30 micrometers.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: September 17, 2019
    Assignee: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Reiner Windisch, Joerg Erich Sorg, Ralph Wirth
  • Publication number: 20190035702
    Abstract: Electronic component with a support comprising a first inorganic insulating layer and a second inorganic insulating layer, between which a metal core is arranged, a first, a second and a third electrically conductive structure which are arranged on a top surface of the carrier, a first and a second electrical contact point and a thermal contact point, which are arranged on a bottom surface of the carrier, a component and an electrical protection element which are arranged on the side of the top surface of the carrier, in which the first electrically conductive structure is electrically conductively connected to the first electrical contact point, the second electrically conductive structure is electrically conductively connected to the second electrical contact point, the third electrically conductive structure is electrically conductively connected to the thermal contact point, the component is electrically conductively connected to the first and second electrically conductive structures, the electrical prot
    Type: Application
    Filed: July 27, 2018
    Publication date: January 31, 2019
    Inventors: Thomas SCHWARZ, Stefan GROETSCH, Joerg Erich SORG, Christoph KOLLER
  • Patent number: 10074619
    Abstract: An optoelectronic component device includes first and second electrodes; a first optoelectronic component electrically coupled to the first and second electrodes; and a first electrically conductive section electrically coupled to the first electrode, and a second electrically conductive section electrically coupled to the second electrode; wherein the first and second electrically conductive sections are arranged electrically in parallel with the first optoelectronic component; wherein the first and second electrically conductive sections are arranged and configured relative to one another such that, beyond a response voltage applied over the first and second conductive sections, a discharge path is formed between the first and second conductive sections; and wherein the response voltage has as its value a value formed greater than the threshold voltage value of the first optoelectronic component and less than or equal to the value of the breakdown voltage of the first optoelectronic component.
    Type: Grant
    Filed: May 23, 2013
    Date of Patent: September 11, 2018
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Torsten Baade, Jörg Erich Sorg
  • Publication number: 20180138379
    Abstract: A method of producing at least one connection carrier includes: A) providing a carrier plate with a planar top face; B) applying at least one electrically insulating insulation strip to the top face and cohesively connecting the carrier plate and the insulation strip; and C) applying at least one electrically conductive conductor strip to an adhesive surface of the insulation strip and cohesively connecting the insulation strip and the conductor strip, wherein the conductor strip and the carrier plate are electrically insulated from one another by the insulation strip.
    Type: Application
    Filed: April 19, 2016
    Publication date: May 17, 2018
    Inventors: Jörg Erich Sorg, Stefan Ziegler, Michael Austgen, Alexander Peetsch, Eckhard Ditzel, Michael Benedikt
  • Publication number: 20170358718
    Abstract: An optoelectronic semiconductor chip having a semiconductor body (1) that is suitable for emitting electromagnetic radiation in a first wavelength range from a radiation exit face (3) is specified. Furthermore, the semiconductor chip comprises a ceramic or monocrystalline conversion platelet (6) that is suitable for converting electromagnetic radiation in the first wavelength range into electromagnetic radiation in a second wavelength range, which is different from the first wavelength range, and a wavelength-converting joining layer (7) that connects the conversion platelet (6) to the radiation exit face (3), wherein the wavelength-converting joining layer (7) has luminescent material particles (4) that are suitable for converting radiation in the first wavelength range into radiation in a third wavelength range, which is different from the first wavelength range and the second wavelength range. The wavelength-converting joining layer (7) furthermore has a thickness of no more than 30 micrometres.
    Type: Application
    Filed: November 25, 2015
    Publication date: December 14, 2017
    Inventors: Reiner WINDISCH, Joerg Erich SORG, Ralph WIRTH
  • Patent number: 9537070
    Abstract: An optoelectronic component contains a semiconductor chip (1) and a carrier body (10), which are provided with a transparent, electrically insulating encapsulation layer (3), the encapsulation layer (3) having two cutouts (11, 12) for uncovering a contact area (6) and a connection region (8) of the carrier body, and an electrically conductive layer (14) being led from the contact area (6) over a partial region of the encapsulation layer (3) to the electrical connection region (8) of the carrier body (10) in order to electrically connect the contact area (6) and the electrical connection region (8) to one another. The radiation emitted in a main radiation direction (13) by the semiconductor chip (1) is coupled out through the encapsulation layer (3), which advantageously contains luminescence conversion substances for the wavelength conversion of the emitted radiation.
    Type: Grant
    Filed: September 13, 2005
    Date of Patent: January 3, 2017
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Ewald Karl Michael Guenther, Jörg Erich Sorg, Norbert Stath
  • Patent number: 9445503
    Abstract: A carrier device for an electrical component includes a carrier, which includes an electrically insulating layer, and an electrical contact layer on the electrically insulating layer The electrical contact layer includes at least one bridge-shaped contact region At least one recess in the electrically insulating layer is arranged at least on one side surface of the bridge-shaped contact region and/or the bridge-shaped contact region includes a bridge width reducing toward the insulating layer.
    Type: Grant
    Filed: July 9, 2012
    Date of Patent: September 13, 2016
    Assignee: OSRAM GmbH
    Inventors: Krister Bergenek, Andreas Biebersdorf, Jörg Erich Sorg
  • Patent number: 9397271
    Abstract: An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.
    Type: Grant
    Filed: April 20, 2009
    Date of Patent: July 19, 2016
    Assignees: OSRAM Opto Semiconductors GmbH, Shin-Etsu Chemical Co., Ltd.
    Inventors: Harald Jaeger, Joerg Erich Sorg, Tsutomu Kashiwagi, Toshio Shiobara
  • Patent number: 9373761
    Abstract: There is herein described a patterned thin-film wavelength converter which comprises a substrate having a first patterned surface with a first pattern, and a thin film deposited on the first patterned surface. The thin film consists of a wavelength converting material and has a second patterned surface that is distal from the substrate. The second patterned surface has a second pattern that is substantially the same as the first pattern of the substrate. An advantage of the patterned thin-film wavelength converter is that post-deposition processing is not required to produce a textured surface on the wavelength converting material. A method of making the patterned thin-film wavelength converter is also described.
    Type: Grant
    Filed: September 23, 2014
    Date of Patent: June 21, 2016
    Assignee: OSRAM SYLVANIA Inc.
    Inventors: Darshan Kundaliya, Jörg Frischeisen, Alan Lenef, Jörg-Erich Sorg, Norwin von Malm
  • Publication number: 20160087167
    Abstract: There is herein described a patterned thin-film wavelength converter which comprises a substrate having a first patterned surface with a first pattern, and a thin film deposited on the first patterned surface. The thin film consists of a wavelength converting material and has a second patterned surface that is distal from the substrate. The second patterned surface has a second pattern that is substantially the same as the first pattern of the substrate. An advantage of the patterned thin-film wavelength converter is that post-deposition processing is not required to produce a textured surface on the wavelength converting material. A method of making the patterned thin-film wavelength converter is also described.
    Type: Application
    Filed: September 23, 2014
    Publication date: March 24, 2016
    Inventors: Darshan Kundaliya, Jörg Frischeisen, Alan Lenef, Jörg-Erich Sorg, Norwin von Malm
  • Publication number: 20150255693
    Abstract: An optoelectronic component device includes first and second electrodes; a first optoelectronic component electrically coupled to the first and second electrodes; and a first electrically conductive section electrically coupled to the first electrode, and a second electrically conductive section electrically coupled to the second electrode; wherein the first and second electrically conductive sections are arranged electrically in parallel with the first optoelectronic component; wherein the first and second electrically conductive sections are arranged and configured relative to one another such that, beyond a response voltage applied over the first and second conductive sections, a discharge path is formed between the first and second conductive sections; and wherein the response voltage has as its value a value formed greater than the threshold voltage value of the first optoelectronic component and less than or equal to the value of the breakdown voltage of the first optoelectronic component.
    Type: Application
    Filed: May 23, 2013
    Publication date: September 10, 2015
    Inventors: Torsten Baade, Jörg Erich Sorg
  • Patent number: 9048393
    Abstract: An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body.
    Type: Grant
    Filed: May 28, 2010
    Date of Patent: June 2, 2015
    Assignees: OSRAM Opto Semiconductor GmbH, Heraeus Materials Technology GmbH & Co. KG
    Inventors: Michael Zitzlsperger, Eckhard Ditzel, Jörg Erich Sorg
  • Patent number: 8937330
    Abstract: The invention relates to a radiation-emitting component comprising a semiconductor body which emits electromagnetic radiation from a radiation exit surface during operation. The semiconductor body is arranged in a component housing having a cutout. The component further comprises an optical element which is connected to the component housing in a mechanically stable manner by means of a joining layer. The modulus of elasticity of the joining layer is lower than or equal to 30 MPa.
    Type: Grant
    Filed: August 17, 2011
    Date of Patent: January 20, 2015
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Joerg Erich Sorg, Ruediger Mueller, Raimund Schwarz
  • Patent number: 8916886
    Abstract: An optoelectronic semiconductor device is specified, comprising a multiplicity of radiation-emitting semiconductor chips (2), arranged in a matrix-like manner, wherein the semiconductor chips (2) are applied on a common carrier (1), at least one converter element (3) disposed downstream of at least one semiconductor chip (2) for converting electromagnetic radiation emitted by the semiconductor chip (2), at least one scattering element (4) situated downstream of each semiconductor chip (2) and serving for diffusely scattering electromagnetic radiation emitted by the semiconductor chip (2), wherein the scattering element (4) is in direct contact with the converter element (3).
    Type: Grant
    Filed: December 23, 2009
    Date of Patent: December 23, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Moritz Engl, Jörg Erich Sorg, Thomas Zeiler, Joachim Reill
  • Patent number: 8900894
    Abstract: In a method for producing a radiation-emitting optoelectronic component, a semiconductor chip is mounted by a first main area onto a carrier body and is electrically conductively connected at a first contact area to a first connection region, and a transparent electrically insulating encapsulation layer is applied to the chip and the carrier body. A first cutout in the encapsulation layer for at least partly uncovering a second contact area of the chip is produced, and a second cutout in the encapsulation layer for at least partly uncovering a second connection region of the carrier body is produced. Finally, an electrically conductive layer, which electrically conductively connects the second contact area of the semiconductor chip and the second connection region of the carrier body, is applied.
    Type: Grant
    Filed: August 28, 2012
    Date of Patent: December 2, 2014
    Assignee: OSRAM Opto Semiconductor GmbH
    Inventors: Ewald Karl Michael Guenther, Jörg Erich Sorg, Norbert Stath
  • Patent number: 8878195
    Abstract: A semiconductor based component with radiation-emitting properties. A glass substrate (1) is provided, which has a first surface (2) and a second surface (1), where a semiconductor element (5) with radiation-emitting properties is accommodated on the first surface (2). Also disclosed is a method for fabricating a semiconductor based component, with the following steps: providing a glass substrate (1), application of a semiconductor element (5) to the first surface (2) of the glass substrate. Also disclosed is a receptacle for a semiconductor based component in which two electrical contact areas (13) are provided, which can be electrically connected to contact areas (7) of the semiconductor based component.
    Type: Grant
    Filed: September 12, 2008
    Date of Patent: November 4, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Erich Sorg, Stefan Gruber
  • Patent number: 8814406
    Abstract: An optoelectronic headlight which emits electromagnetic radiation is specified, which has a luminescence diode chip with at least two spatial emission regions or which has at least two luminescence diode chips each having at least one spatial emission region. The headlight is suitable in particular for a front headlight for motor vehicles. The emission regions, in a plan view of a main extension plane associated with them, are shaped differently, are of different sizes and/or are not shaped rectangularly and are differently oriented. Particularly preferably, the emission regions can be driven independently of one another. Methods for production of an optoelectronic headlight and a luminescence diode chip are furthermore specified.
    Type: Grant
    Filed: August 13, 2012
    Date of Patent: August 26, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Johannes Baur, Joachim Reill, Jörg Erich Sorg
  • Patent number: 8796115
    Abstract: A light-emitting diode arrangement comprising a plurality of semiconductor chips which are provided for emitting electromagnetic radiation from their front side and which are fixed by their rear side—opposite the front side—on a first main face of a common carrier body, wherein the semiconductor chips consist of a respective substrateless semiconductor layer stack and are fixed to the common carrier body without an auxiliary carrier, and to a method for producing such a light-emitting diode arrangement.
    Type: Grant
    Filed: April 5, 2012
    Date of Patent: August 5, 2014
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Jörg Erich Sorg, Stefan Gruber, Siegfried Herrmann, Berthold Hahn