Patents by Inventor Joerg-Erich Sorg

Joerg-Erich Sorg has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8237192
    Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
    Type: Grant
    Filed: December 9, 2008
    Date of Patent: August 7, 2012
    Assignee: OSRAM Opto Semiconductors GmbH
    Inventors: Joerg Erich Sorg, Stefan Gruber, Georg Bogner
  • Publication number: 20110266576
    Abstract: An optoelectronic semiconductor device at least one radiation-emitting semiconductor chip (3); at least one converter element (4) disposed downstream of the semiconductor chip (3) and serving for converting electromagnetic radiation emitted by the semiconductor chip (3) during operation, wherein the converter element (4) emits colored light upon irradiation with ambient light; a means for diffusely scattering light (5), which is designed to scatter ambient light impinging on the device in a switched-off operating state of the device in such a way that a light exit area (62) of the device appears white.
    Type: Application
    Filed: October 27, 2009
    Publication date: November 3, 2011
    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH
    Inventors: Moritz Engl, Joerg Erich Sorg, Thomas Zeiler, Michael Reich, Ulrich Streppel
  • Publication number: 20110188846
    Abstract: A luminous unit (1) for an optical recording device (13) comprising a light source (2) for generating radiation and a partly reflective element, which is disposed downstream of the light source (2) in a main emission direction (H) and subdivides a space into a first half-space facing the light source (2) and a second half-space remote from the light source (2), wherein the partly reflective element at least partly transmits the radiation coming from the light source (2) from the first half-space and at least partly reflects the external radiation coming from an opposite direction from the second half-space.
    Type: Application
    Filed: April 16, 2009
    Publication date: August 4, 2011
    Applicant: Osram Opto Semiconductors GmbH
    Inventors: Joerg Erich Sorg, Stefan Gruber
  • Publication number: 20110108870
    Abstract: An optoelectronic semiconductor component includes a connection carrier with at least two connection points and configured with a silicone matrix with a fiber reinforcement, and at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith.
    Type: Application
    Filed: April 20, 2009
    Publication date: May 12, 2011
    Applicant: OSRAM Opto Semiconductors GmbH
    Inventors: Harald Jaeger, Joerg Erich Sorg
  • Publication number: 20100270578
    Abstract: A light emitting diode chip includes a device for protection against overvoltages, e.g., an ESD protection device. The ESD protection device is integrated into a carrier, on which the semiconductor layer sequence of the light emitting diode chip is situated, and is based on a specific doping of specific regions of said carrier. By way of example, the ESD protection device is embodied as a Zener diode that is connected to the semiconductor layer sequence by means of an electrical conductor structure.
    Type: Application
    Filed: December 9, 2008
    Publication date: October 28, 2010
    Inventors: Joerg Erich Sorg, Stefan Gruber, Georg Bogner
  • Patent number: 7695990
    Abstract: The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3).
    Type: Grant
    Filed: December 23, 2005
    Date of Patent: April 13, 2010
    Assignee: Osram Opto Semiconductors GmbH
    Inventors: Joerg-Erich Sorg, Gertrud Kraeuter
  • Publication number: 20060099741
    Abstract: The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3).
    Type: Application
    Filed: December 23, 2005
    Publication date: May 11, 2006
    Inventors: Joerg-Erich Sorg, Gertrud Kraeuter
  • Patent number: 6995029
    Abstract: The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3). The method includes a) production of a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102), b) patterning of the carrier layer (101) in such a way that at least one contact-making window (7) toward the connection conductor layer (102) is produced in said carrier layer, and c) patterning of the connection conductor layer (102), in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, at least one of which can be electrically connected through the contact-making window (7).
    Type: Grant
    Filed: August 5, 2003
    Date of Patent: February 7, 2006
    Assignee: Osram Opta Semiconductors GmbH
    Inventors: Joerg-Erich Sorg, Gertrud Kraeuter
  • Publication number: 20040106234
    Abstract: The invention relates to a method for producing an electrical leadframe (10), in particular for a light-emitting diode component, having at least one first electrical connection conductor (2) and at least one second electrical connection conductor (3). The method includes a) production of a layer composite comprising an electrically insulating carrier layer (101) and an electrically conductive connection conductor layer (102), b) patterning of the carrier layer (101) in such a way that at least one contact-making window (7) toward the connection conductor layer (102) is produced in said carrier layer, and c) patterning of the connection conductor layer (102), in such a way that the first electrical connection conductor (2) and the second electrical connection conductor (3) are produced, at least one of which can be electrically connected through the contact-making window (7).
    Type: Application
    Filed: August 5, 2003
    Publication date: June 3, 2004
    Inventors: Joerg-Erich Sorg, Gertrud Kraeuter