Patents by Inventor Johannes Lodermeyer

Johannes Lodermeyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package
    Patent number: 7989930
    Abstract: A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.
    Type: Grant
    Filed: October 25, 2007
    Date of Patent: August 2, 2011
    Assignee: Infineon Technologies AG
    Inventors: Edmund Riedl, Joachim Mahler, Johannes Lodermeyer, Mathias Vaupel, Steffen Jordan
  • Method of making an integrated circuit including electrodeposition of metallic chromium
    Patent number: 7909978
    Abstract: A method of making an integrated circuit including a composition of matter for electrodepositing of chromium is disclosed. One embodiment provides a bath having a solution of a chromium salt in a substantially anhydrous organic solvent, to uses of certain chromium salts for electrodepositing and to processes for electrodepositing chromium.
    Type: Grant
    Filed: April 19, 2007
    Date of Patent: March 22, 2011
    Assignee: Infineon Technologies AG
    Inventors: Johannes Lodermeyer, Edmund Riedl, Werner Robl
  • METHOD OF FABRICATING A SEMICONDUCTOR DEVICE
    Publication number: 20100059857
    Abstract: A method of fabricating a semiconductor device. One embodiment provides a metal carrier. A semiconductor chip is provided. A porous layer is produced at a surface of at least one of the carrier and the semiconductor chip. The semiconductor chip is placed on the carrier. The resulting structure is heated until the semiconductor chip is attached to the carrier.
    Type: Application
    Filed: September 11, 2008
    Publication date: March 11, 2010
    Applicant: Infineon Technologies AG
    Inventors: Edmund Riedl, Ivan Nikitin, Johannes Lodermeyer, Robert Bergmann, Karsten Guth
  • SEMICONDUCTOR PACKAGE
    Publication number: 20090108423
    Abstract: A semiconductor package includes a leadframe defining a die pad, a chip electrically coupled to the die pad, encapsulation material covering the chip and the die pad, and a plurality of lead ends exposed relative to the encapsulation material and configured for electrical communication with the chip, and a nitrogen-containing hydrocarbon coating disposed over at least the lead ends of the leadframe, where the hydrocarbon coating is free of metal particles.
    Type: Application
    Filed: October 25, 2007
    Publication date: April 30, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Edmund Riedl, Joachim Mahler, Johannes Lodermeyer, Mathias Vaupel, Steffen Jordan
  • METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION OF METALLIC CHROMIUM
    Publication number: 20080257743
    Abstract: A method of making an integrated circuit including a composition of matter for electrodepositing of chromium is disclosed. One embodiment provides a bath having a solution of a chromium salt in a substantially anhydrous organic solvent, to uses of certain chromium salts for electrodepositing and to processes for electrodepositing chromium.
    Type: Application
    Filed: April 19, 2007
    Publication date: October 23, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Johannes Lodermeyer, Edmund Riedl, Werner Robl
  • METHOD OF MAKING AN INTEGRATED CIRCUIT INCLUDING ELECTRODEPOSITION OF ALUMINIUM
    Publication number: 20080257744
    Abstract: A method of making an integrated circuit including composition of matter for electrodepositing of aluminium is disclosed. One embodiment includes a bath having a solution of selected aluminium salts in a substantially anhydrous organic solvent, to uses of certain aluminium salts for electrodepositing and to processes for electrodepositing aluminium.
    Type: Application
    Filed: April 19, 2007
    Publication date: October 23, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Johannes Lodermeyer, Edmund Riedl, Werner Robl