Patents by Inventor John A. Higginson

John A. Higginson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11011390
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: August 20, 2019
    Date of Patent: May 18, 2021
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Publication number: 20210050337
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: October 16, 2020
    Publication date: February 18, 2021
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10923023
    Abstract: Hybrid chiplets, display backplanes, and displays with integrated hybrid chiplets are described. In an embodiment, a hybrid chiplet includes a micro LED chiplet stacked on a micro driver chiplet that includes at least one drive transistor and a bottom side including a plurality of bottom chiplet contacts for electrical connection with a display backplane.
    Type: Grant
    Filed: December 15, 2016
    Date of Patent: February 16, 2021
    Inventors: Andreas Bibl, Xia Li, John A. Higginson, Vaibhav D. Patel, Kapil V. Sakariya, Imran Hashim, Tore Nauta, Thomas Charisoulis
  • Patent number: 10833058
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: November 10, 2020
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10814496
    Abstract: Structures and methods to actively control the shape of a micro pickup array (MPA) during micro device transfer are described. In an embodiment, a strain is applied to the MPA counteractive to strain arising during micro device transfer operations. For example, strain may be applied by a piezoelectric actuator element bonded to a back side of the base substrate to control a curvature of base substrate, and by extension the MPA.
    Type: Grant
    Filed: December 12, 2017
    Date of Patent: October 27, 2020
    Inventors: Andreas Bibl, Paul A. Parks, Stephen P. Bathurst, Jon A. Williams, John A. Higginson, Shenshen Zhao
  • Patent number: 10804127
    Abstract: An electrostatic cleaning device, mass transfer tool, and method of operation are disclosed. In an embodiment an electrostatic cleaning device includes a cleaning electrode area including a first electrode pattern, a first trace line connected to the first electrode pattern, and a dielectric layer covering the cleaning electrode and the first trace line. In an embodiment, a mass transfer tool includes a translatable transfer head assembly that is translatable over a carrier substrate stage, a receiving substrate stage, and an electrostatic cleaning stage.
    Type: Grant
    Filed: March 14, 2016
    Date of Patent: October 13, 2020
    Inventors: Stephen P. Bathurst, John A. Higginson, Dariusz Golda, Hyeun-Su Kim
  • Publication number: 20200219840
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: March 4, 2020
    Publication date: July 9, 2020
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10607961
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: March 31, 2020
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Publication number: 20200091127
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: November 19, 2019
    Publication date: March 19, 2020
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10510736
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: December 17, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20190371623
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Application
    Filed: August 20, 2019
    Publication date: December 5, 2019
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Patent number: 10424493
    Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: September 24, 2019
    Assignee: Apple Inc.
    Inventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
  • Publication number: 20190259907
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Application
    Filed: April 30, 2019
    Publication date: August 22, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10297712
    Abstract: A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
    Type: Grant
    Filed: June 23, 2014
    Date of Patent: May 21, 2019
    Assignee: Apple Inc.
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10276419
    Abstract: A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: April 30, 2019
    Assignee: Apple Inc.
    Inventors: Hyeun-Su Kim, Dariusz Golda, John A. Higginson
  • Publication number: 20190123032
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Application
    Filed: December 13, 2018
    Publication date: April 25, 2019
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Publication number: 20190096846
    Abstract: A method of transferring a micro device and an array of micro devices are disclosed. A carrier substrate carrying a micro device connected to a bonding layer is heated to a temperature below a liquidus temperature of the bonding layer, and a transfer head is heated to a temperature above the liquidus temperature of the bonding layer. Upon contacting the micro device with the transfer head, the heat from the transfer head transfers into the bonding layer to at least partially melt the bonding layer. A voltage applied to the transfer head creates a grip force which picks up the micro device from the carrier substrate.
    Type: Application
    Filed: August 30, 2018
    Publication date: March 28, 2019
    Inventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
  • Patent number: 10192858
    Abstract: A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
    Type: Grant
    Filed: March 5, 2018
    Date of Patent: January 29, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, Hsin-Hua Hu
  • Patent number: 10183396
    Abstract: Systems and methods for transferring a micro device or an array of micro devices to or from a substrate are disclosed. In an embodiment, a remote center robot allows on-the-fly alignment between a micro pick up array and a target substrate. The remote center robot may include a plurality of symmetric linkages that move independently and share a remote rotational center. In an embodiment, the remote rotational center may be positioned at a surface of the micro pick up array to prevent damage to the array of micro devices during transfer.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: January 22, 2019
    Assignee: Apple Inc.
    Inventors: Paul Argus Parks, Nile Alexander Light, Stephen P. Bathurst, John A. Higginson, Andreas Bibl
  • Patent number: 10183401
    Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool includes an articulating transfer head assembly, a carrier substrate holder, and an actuator assembly to adjust a spatial relationship between the articulating transfer head assembly and the carrier substrate holder. The articulating transfer head assembly may include an electrostatic voltage source connection and a substrate supporting an array of electrostatic transfer heads.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 22, 2019
    Assignee: Apple Inc.
    Inventors: John A. Higginson, Andreas Bibl, David Albertalli