Abstract: A method for fabricating custom integrated circuits includes the steps of 1) patterning a photoresist layer on an insulative layer with a standard via precision mask to define all possible vias, and 2) using a targeting energy beam to select the desired via locations, which are then etched and interconnections made, for customization or repair of the integrated circuit. Consequently, the present invention requires no custom mask so that application specific integrated circuits (ASICs) can be produced with lower lead-time and costs when compared to prior methods.

Abstract: An apparatus for measuring the gripping strength of a wafer holder, such as a vacuum wand or an automated robotic arm, is used to periodically test wafer holders during manufacture of wafers, and thereby eliminate the damage caused to wafers by worn wafer holders. The apparatus includes a hold tester to be held by the wafer holder and a gauge coupled to the hold tester that indicates the force applied by the wafer holder to the hold tester. The wafer holder is coupled to a predetermined region on the hold tester, and the wafer holder gauge is pulled away from the hold tester until the wafer holder becomes separated from the hold tester. The maximum force applied by the wafer holder on the hold tester is measured by the gauge and the above described process is repeated to obtain a second measurement of the force.

Abstract: A support arm is adapted for high-speed positioning of a transducer such as a read/write head in a magnetic disk drive. The support arm is essentially composed of a ceramic material having a high specific stiffness. The support arm is shaped to form structures integral of the support arm for mating with fasteners for connecting a transducer assembly to one end of the support arm and for connecting the support arm to a positioning actuator.

Abstract: The disclosed process forms metal parts from a mixture containing a powdered metal, a plasticizer, and at least two binders. Some of these binder materials are selectively extractable from the mixture without sintering. After the mixture is shaped into the form of the desired part and prior to sintering, the plasticizer and the extractable binders are removed. This produces a part having both sufficient green strength and a relatively low binder content. On sintering, remaining binders decompose; and the resulting part has a carbon content of less than 1.0%.