Abstract: Roughly described, a method of restricting access of a debug controller to debug architecture on an integrated circuit chip, the debug architecture comprising an access controller, a plurality of peripheral circuits, and a shared hub, the shared hub being accessible by the access controller and the plurality of peripheral circuits, the method comprising: at the access controller, authenticating the debug controller; at the access controller, following authentication, assigning to the debug controller a set of access rights, the set of access rights granting the debug controller partial access to the debug architecture; and after assigning the set of access rights, allowing the debug controller access to the debug architecture as allowed by the set of access rights.

Abstract: A method includes forming a housing having a ceiling portion and a smoke permeable wall portion. The ceiling portion of the housing has a first aperture and a second aperture. The method includes mounting a circuit board to the housing so that the housing and the circuit board collectively define a smoke chamber that is bounded by the ceiling portion, the smoke permeable wall portion and the circuit board. The method includes placing an emitter in the first aperture and placing a detector in the second aperture. The emitter defines an emitting region in the smoke chamber and the detector defines a detecting region in the smoke chamber. In a typical implementation, the detecting region at least partially intersects the emitting region in the smoke chamber, and the emitter and the detector are disposed substantially outside the smoke chamber.

Abstract: Roughly described, a method of restricting access of a debug controller to debug architecture on an integrated circuit chip, the debug architecture comprising an access controller, a plurality of peripheral circuits, and a shared hub, the shared hub being accessible by the access controller and the plurality of peripheral circuits, the method comprising: at the access controller, authenticating the debug controller; at the access controller, following authentication, assigning to the debug controller a set of access rights, the set of access rights granting the debug controller partial access to the debug architecture; and after assigning the set of access rights, allowing the debug controller access to the debug architecture as allowed by the set of access rights.

Abstract: An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.

Abstract: An apparatus configured to sense presence and motion in a monitored space is presented. The apparatus includes a dual-element assembly with a first thermal sensing element and a second thermal sensing element configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing elements. A lens array (or equivalent optics) is coupled to the elements, having a plurality of lenses directing incident thermal energy from a plurality of optically-defined spatial zones onto the sensing elements. An electronic circuitry is configured to read a resulting signal of the dual-element assembly and an individual output signal of each the first thermal sensing element and the second thermal sensing element.

Abstract: A radiation sensing apparatus includes, in a vertically stacked configuration: a radiation sensor chip, an integrated circuit chip beneath the radiation sensor chip, and an optical element above the radiation sensor chip. The radiation sensor chip has a radiation sensing element and an electrically-conductive contact coupled to the radiation sensing element and exposed at a lower surface. The integrated circuit chip has an integrated circuit and an electrical conductor coupled to the integrated circuit and exposed at an upper surface. The electrically conductive contact at the lower surface of the radiation sensor chip is physically and electrically coupled to the electrical conductor at the upper surface of the integrated circuit chip. The optical element is configured to pass incident radiation at a wavelength that the radiation sensing element is configured to sense.

Abstract: A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.

Abstract: A method includes forming a housing having a ceiling portion and a smoke permeable wall portion. The ceiling portion of the housing has a first aperture and a second aperture. The method includes mounting a circuit board to the housing so that the housing and the circuit board collectively define a smoke chamber that is bounded by the ceiling portion, the smoke permeable wall portion and the circuit board. The method includes placing an emitter in the first aperture and placing a detector in the second aperture. The emitter defines an emitting region in the smoke chamber and the detector defines a detecting region in the smoke chamber. In a typical implementation, the detecting region at least partially intersects the emitting region in the smoke chamber, and the emitter and the detector are disposed substantially outside the smoke chamber.

Abstract: Semiconductor devices and methods for forming semiconductor devices are presented. A device formed of a semiconductor material is configured to mount upon a substrate layer surface having a substrate layer wire attach pad. The device includes a top planar surface with an electrically active region, and a bottom planar surface disposed substantially parallel to the top planar surface. A shelf region is disposed between the top planar surface and the bottom planar surface, and a device wire attach pad in electrical communication with the active region is located on the shelf region.

Abstract: A device and method for manufacturing an integrated smoke cell are presented. The smoke cell includes an integral housing with a ceiling portion and a smoke permeable wall forming a chamber when mounted on a printed circuit board. An emitter and detector are mounted above apertures in the chamber ceiling so the emitter and detector are mounted substantially outside the chamber while detecting smoke present within the chamber without blocking ingress of smoke through the chamber wall.

Abstract: Embodiments of a laminate leadless carrier package are presented. The package includes an optoelectronic chip, a substrate supporting the optoelectronic chip, a plurality of conductive slotted vias, a wire bond pad disposed on the top surface of the substrate, a wire bond coupled to the optoelectronic chip and the wire bond pad and an encapsulation covering the optoelectronic chip, the wire bond, and at least a portion of the top surface of the substrate. The slotted vias provide electrical connections between the top conductive layer and the bottom conductive layer. The substrate includes a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between the top and bottom conductive layers. The encapsulation is a molding compound, and the molding compound is pulled back from at least one of the slotted vias.

Abstract: A vertically stacked thermopile and an IR sensor using said stacked thermopiles are provided. The vertically stacked thermopile may include multiple thermocouples stacked vertically on one another. The thermocouples may be connected in series, parallel, or a combination of series and parallel. One or more vertically stacked thermopiles may be included in an IR sensor and the thermopiles may be connected in series, parallel, or a combination of series and parallel.

Abstract: Apparatus and methods for proximity detection include a passive proximity detecting device for detecting humans within a detection area and controlling a controlled device. A sensor includes a plurality of pixels arranged in a substantially contiguous array. Each pixel is configured to detect infrared radiation emitted by an object in a predetermined temperature range within the detection area. In response to detecting the object a detection signal is generated having a signal level proportional to the infrared radiation emitted by said object received by the sensor. A processor in communication with the sensor is configured to receive said detection signal, to derive an object distance and a second object parameter using, a signal level of the detection signal.

Abstract: A system for proximity detection includes a first sensor and a second sensor each including a sensor housing and a pixel array each configured to detect infrared radiation emitted in a predetermined temperature range, and generate a detection signal. A processor in communication with the first and second sensor is configured to receive detection signals to derive parameters of the detected object including object distance from the sensors, size, position relative to the sensors, object speed, and direction of motion.

Abstract: An illumination device with an integrated thermal imaging sensor and method for using the same are disclosed. The device includes a solid state illumination source, and a thermal imager comprising a multi-pixel heat sensing device. A controller is configured to control the thermal imager, and a power source is configured to supply power to the illumination source, the thermal imager, and the controller.

Abstract: Apparatus and methods for a passive range finding proximity detector include a sensor element configured to detect infrared radiation emitted by objects within a detection area. The sensor is configured to detect the temperature, relative size, relative distance, speed or direction of movement of an object from the sensor. The sensor is configured to set parameters for a controlled object based upon the detected size, temperature and/or proximity, speed or direction of an object in relation to one or more size thresholds, temperature thresholds, and/or proximity, speed or direction thresholds.

Abstract: A system for proximity detection includes a first sensor and a second sensor each including a sensor housing and a pixel array each configured to detect infrared radiation emitted in a predetermined temperature range, and generate a detection signal. A processor in communication with the first and second sensor is configured to receive detection signals to derive parameters of the detected object including object distance from the sensors, size, position relative to the sensors, object speed, and direction of motion.

Abstract: Apparatus and methods for proximity detection include a passive proximity detecting device for detecting humans within a detection area and controlling a controlled device. A sensor includes a plurality of pixels arranged in a substantially contiguous array. Each pixel is configured to detect infrared radiation emitted by an object in a predetermined temperature range within the detection area. In response to detecting the object a detection signal is generated having a signal level proportional to the infrared radiation emitted by said object received by the sensor. A processor in communication with the sensor is configured to receive said detection signal, to derive an object distance and a second object parameter using, a signal level of the detection signal.

Abstract: An apparatus configured to sense presence and motion in a monitored space includes one or more thermal sensing devices and a lens array. Each thermal sensing device is configured to produce a direct current output that is sustained at a level substantially proportional to an amount of thermal energy being received at the thermal sensing device. The lens array is coupled to the one or more thermal sensing devices and includes multiple lenses, each of which is configured to direct incident thermal energy from at least a respective one of multiple different physical zones located within the monitored space onto the one or more thermal sensing devices.

Abstract: A data processing apparatus having processing circuitry and debug circuitry is debugged by operating the processing circuitry to generate data. The debug circuitry is employed to generate trace elements indicative of the operation of the processing circuitry. Trace elements are caused to be output from the data processing apparatus over a communication bus capable of connecting a plurality of devices. The communication bus is controlled by a protocol for data interchange requiring data interchange from any device on the communication bus to be controlled by a single processing system. The passing of the trace elements onto the communication bus is controlled using an interface unit of the debug circuitry. The interface unit comprises a controller arranged to allow each of the interface unit and processing circuitry to be separate processing systems which can each independently control data interchange from the data processing apparatus.