Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded.

Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded.

Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded. A thermal imaging device incorporating a gradient-index lens is also provided.

Abstract: A gradient-index lens for focusing incident electromagnetic radiation comprises at least first and second substrates. Each of the substrates has a plurality of trenches or holes formed therein. The first substrate is stacked on the second substrate such that trenches or holes in the first substrate are substantially aligned with corresponding trenches or holes in the second substrate to form combined trenches or holes. Each of the combined trenches or holes has a width or diameter that is less than a wavelength of the electromagnetic radiation, and the spacing between adjacent ones of the combined trenches or holes is less than the wavelength of the electromagnetic radiation. The size and spacing of the combined trenches or holes in the stacked substrates are sufficient to produce an effective refractive index profile of the lens element that is graded. A method for producing the lens is also provided.

Abstract: An imaging device comprises a focal plane array (FPA) having a plurality of singulated unit cells arranged on a carrier substrate. Each of the unit cells comprises a sub-array of pixels in the focal plane array. At least one of the unit cells has a different number or type of pixels than does another one of the unit cells arranged on the carrier substrate to enable multi-spectral imaging. The device also includes at least one lens positioned to direct incident electromagnetic radiation to the unit cells. A modular method for producing the FPA and lenses of a camera core uses wafer-level packaging and optics. Lenses and sub-arrays of pixels are each fabricated on densely packed, batch-fabricated wafers, and subsequently singulated and assembled into arrays on respective low cost carrier substrates. The carrier substrates are bonded together at the substrate level to form a series of camera cores, and the stacked substrates are singulated to form individual camera cores.

Abstract: A gradient-index lens for directing incident electromagnetic radiation comprises at least one substrate having a plurality of micro-features (e.g., trenches or holes) that may be arranged in a pattern of varied size and/or spacing. Each of the micro-features has at least one dimension that is less than a wavelength of the electromagnetic radiation. The spacing between adjacent micro-features is less than the wavelength of the electromagnetic radiation, and the size and spacing of the micro-features are sufficient to produce an effective refractive index profile of the lens that is graded. A thermal imaging device incorporating a gradient-index lens is also provided.

Abstract: A gradient-index lens for focusing incident electromagnetic radiation comprises at least first and second substrates. Each of the substrates has a plurality of trenches or holes formed therein. The first substrate is stacked on the second substrate such that trenches or holes in the first substrate are substantially aligned with corresponding trenches or holes in the second substrate to form combined trenches or holes. Each of the combined trenches or holes has a width or diameter that is less than a wavelength of the electromagnetic radiation, and the spacing between adjacent ones of the combined trenches or holes is less than the wavelength of the electromagnetic radiation. The size and spacing of the combined trenches or holes in the stacked substrates are sufficient to produce an effective refractive index profile of the lens element that is graded. A method for producing the lens is also provided.

Abstract: An imaging device comprises a focal plane array (FPA) having a plurality of singulated unit cells arranged on a carrier substrate. Each of the unit cells comprises a sub-array of pixels in the focal plane array. At least one of the unit cells has a different number or type of pixels than does another one of the unit cells arranged on the carrier substrate to enable multi-spectral imaging. The device also includes at least one lens positioned to direct incident electromagnetic radiation to the unit cells. A modular method for producing the FPA and lenses of a camera core uses wafer-level packaging and optics. Lenses and sub-arrays of pixels are each fabricated on densely packed, batch-fabricated wafers, and subsequently singulated and assembled into arrays (e.g., 3×3, 4×4, 4×5) on respective low cost carrier substrates. The carrier substrates are bonded together at the substrate level to form a series of camera cores, and the stacked substrates are singulated to form individual camera cores.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the micro electromechanical systems device.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the micro electromechanical systems device.

Abstract: A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.

Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

Abstract: A method of manufacturing a microelectromechanical device includes forming at least two conductive layers on a substrate. An isolation layer is formed between the two conductive layers. The conductive layers are electrically coupled together and then the isolation layer is removed to form a gap between the conductive layers. The electrical coupling of the layers mitigates or eliminates the effects of electrostatic charge build up on the device during the removal process.

Abstract: A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.

Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.