Abstract: A socket assembly with incorporated memory structure is provided. A chip carrier socket assembly includes dual stage clamping actuation. A first clamping actuation stage provides clamping force for ball grid array (BGA) contact pads and a second clamping actuation stage provides clamping force for a thermal interface. The first clamping actuation stage provides clamping force proximate to a perimeter of a carrier where a plurality of BGA contact pads are located. The second clamping actuation stage provides clamping force generally centrally of the chip carrier socket assembly for thermal interface actuation.

Abstract: An improved method and apparatus for packaging perishable goods comprises an inner insulating container that is quickly and easily formed from a flat sheet of metalized bubble pack material to a finished state that very closely approximates the size and dimensions of the carton. The constructed inner container can be quickly collapsed and reconstructed to improve the stackability and diminish the amount of space required to store the containers prior to use.

Abstract: A method, apparatus, and computer program product are provided for creating customized mesh planes in electronic packages. Electronic package physical design data is received and signal traces in each adjacent plane to a mesh plane are compared with the mesh layout. Signal traces adjacent to mesh holes are identified. One or more fill methods are selected to modify the mesh layout to replace selected mesh holes with added mesh structure aligned with the identified signal traces.

Abstract: Methods and apparatus are provided for implementing silicon wafer chip carrier passive devices including customized silicon capacitors and resistors mounted directly on a module or carrier package. A plurality of system design inputs is received for a package arrangement. A respective physical design is generated for customized passive devices, a logic chip, and a chip carrier. Silicon devices are fabricated utilizing the generated respective physical design for customized passive devices and the logic chip and a carrier package is fabricated. The fabricated silicon devices are assembled on the carrier package.

Abstract: A method and structures are provided for implementing an impedance-controlled coupled noise suppressor for a differential interface solder column array used to join a substrate to a circuit card. The impedance-controlled coupled noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern with one or more of the through openings receiving a differential signal pair of solder columns. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at opposite ends to a substrate and a circuit card. An electrical connection is provided between the impedance-controlled coupled noise suppressor structure and an image return current path of the circuit card.

Abstract: A method and structure are provided for implementing a column attach coupled noise suppressor for a solder column structure of the type used to join a substrate to a circuit card. The electrical noise suppressor structure includes a plurality of elongated through openings that are arranged in a predefined pattern. The elongated through openings have electrically conductive sidewalls and are electrically connected together. The predefined pattern of the elongated, electrically conductive through openings corresponds to a layout of solder columns. The solder columns are attached at one end to either a substrate or a circuit card and are inserted through the elongated through openings of the electrical noise suppressor structure, spaced apart from the electrically conductive sidewalls. Then the solder columns are attached at the other end to the other one of the substrate or circuit card.

Abstract: A method and structure are provided to control common mode impedance in fan-out regions for printed circuit board applications. A differential pair transmission line includes a narrow signal trace portion in the fan-out region and a wider signal trace portion outside of the fan-out region. A dielectric material separates the differential pair transmission line from a reference power plane. A thickness of the narrow signal trace is increased and a thickness of the dielectric material is correspondingly decreased in the fan-out region.

Abstract: A method and apparatus are provided for implementing direct attenuation loss measurement in an electronic package. A sinusoidal voltage source signal of a selected frequency is coupled to an embedded transmission line test structure in the electronic package. Receive circuitry is coupled to the transmission line test structure for detecting amplitude of a received sinusoidal voltage source signal to identify attenuation loss through the transmission line test structure. An identified attenuation loss of the transmission line test structure is compared with a threshold value for verifying acceptable attenuation of the electronic package transmission line test structure.

Abstract: A method, structure and computer program product are provided for implementing high frequency return current paths within electronic packages. Electronic package physical design data is received for identifying a design layout. For each of a plurality of cells in a grid of a set cell size within the identified design layout, a respective number of signal vias, reference voltage vias, and ground vias are identified. A signal to reference via ratio is calculated for each of the plurality of cells. Each cell having a calculated signal to reference via ratio greater than a target ratio is identified. Vias are selectively added within each of the identified cells for providing high frequency return current paths.

Abstract: This invention relates to a process for the production of lower aliphatic esters by reacting a lower olefin with a saturated lower aliphatic mono-carboxylic acid in the vapor phase in the presence of a heteropolyacid catalyst in a plurality of reactors set up in series such that the reactant gases exiting from a first reactor are fed as the feed gas to a second reactor and those exiting from the second reactor are fed as the feed gas to a third reactor and so on for the subsequent reactors. An aliquot of the reactant monocarboxylic acid is introduced into the feed gas to the second and subsequent reactors so as to maintain the olefin to monocarboxylic acid ratio in the feed gas to each of the second and subsequent reactors within a pre-determined range.

Abstract: Methods and apparatus are provided for implementing silicon wafer chip carrier passive devices including customized silicon capacitors and resistors mounted directly on a module or carrier package. A plurality of system design inputs is received for a package arrangement. A respective physical design is generated for customized passive devices, a logic chip, and a chip carrier. Silicon devices are fabricated utilizing the generated respective physical design for customized passive devices and the logic chip and a carrier package is fabricated. The fabricated silicon devices are assembled on the carrier package.

Abstract: A laundry appliance having a cabinet enclosing a laundry treating mechanism, the cabinet having an openable door in a vertical front face thereof, is provided with a shelf recessed in the cabinet and arranged to be extendable to a horizontal position in an embodiment a predetermined distance below the door sufficient to allow a laundry basket to be placed on the shelf when extended and to allow the door to be opened and closed with the basket on the extended shelf and in an embodiment to provide a step for a user.

Abstract: A process and apparatus for contacting (a) at least one gaseous reactant and (b) at least one liquid selected from the group consisting of reactants, coolants and mixtures thereof in the presence of a fluidized bed of catalyst, in which the liquid is introduced into the reactor through at least one inlet located within the fluidization zone and the gaseous reactant is introduced into the reactor through at least one inlet located within the fluidization zone adjacent the support means.

Abstract: A portable radiation detector using a high-purity germanium crystal as the sensing device. The crystal is fabricated such that it exhibits a length to width ratio greater than 1:1 and is oriented within the detector to receive radiation along the width of said crystal. The crystal is located within a container pressurized with ultra-pure nitrogen, and the container is located within a cryostat under vacuum.

Abstract: A portable radiation detector using a high-purity germanium crystal as the sensing device. The crystal is fabricated such that it exhibits a length to width ratio greater than 1:1 and is oriented within the detector to receive radiation along the width of said crystal.

Abstract: This invention relates to a process for the production of lower aliphatic esters by reacting a lower olefin with a saturated lower aliphatic mono-carboxylic acid in the vapour phase in the presence of a heteropolyacid catalyst in a plurality of reactors set up in series such that the reactant gases exiting from a first reactor are fed as the feed gas to a second reactor and those exiting from the second reactor are fed as the feed gas to a third reactor and so on for the subsequent reactors. An aliquot of the reactant monocarboxylic acid is introduced into the feed gas to the second and subsequent reactors so as to maintain the olefin to monocarboxylic acid ratio in the feed gas to each of the second and subsequent reactors within a pre-determined range.

Abstract: Apparatus and process for heat exchange with fluid beds comprises heat-exchange tubes located longitudinally with respect to the axis of a fluidization zone with a rectangular pitch, one side of which having a length at least one and a half times the length of the other side and/or with a triangular pitch, having two sides each at least one and a half times the length of the shortest side reduces the impact of the heat-exchange tubes on the fluidization characteristics of the fluid bed. The invention is particularly suitable for oxidation reactions using molecular oxygen-containing gas in the presence of a fluid bed of fluidizable catalyst, such as (a) the acetoxylation of olefins, (b) the oxidation of ethylene to acetic acid and/or the oxidation of ethane to ethylene and/or acetic acid, (c) the ammoxidation of propylene and/or propane to acrylonitrile and (d) the oxidation of C4's to maleic anhydride.

Abstract: Apparatus and process for heat exchange with fluid beds comprises heat-exchange tubes located longitudinally with respect to the axis of a fluidization zone with a rectangular pitch, one side of which having a length at least one and a half times the length of the other side and/or with a triangular pitch, having two sides each at least one and a half times the length of the shortest side reduces the impact of the heat-exchange tubes on the fluidization characteristics of the fluid bed. The invention is particularly suitable for oxidation reactions using molecular oxygen-containing gas in the presence of a fluid bed of fluidizable catalyst, such as (a) the acetoxylation of olefins, (b) the oxidation of ethylene to acetic acid and/or the oxidation of ethane to ethylene and/or acetic acid, (c) the ammoxidation of propylene and/or propane to acrylonitrile and (d) the oxidation of C4's to maleic anhydride.

Abstract: A thermal radiation shield for cooled portable gamma-ray spectrometers. The thermal radiation shield is located intermediate the vacuum enclosure and detector enclosure, is actively driven, and is useful in reducing the heat load to mechanical cooler and additionally extends the lifetime of the mechanical cooler. The thermal shield is electrically-powered and is particularly useful for portable solid-state gamma-ray detectors or spectrometers that dramatically reduces the cooling power requirements. For example, the operating shield at 260K (40K below room temperature) will decrease the thermal radiation load to the detector by 50%, which makes possible portable battery operation for a mechanically cooled Ge spectrometer.

Abstract: A process and apparatus for contacting (a) at least one gaseous reactant and (b) at least one liquid selected from the group consisting of reactants, coolants and mixtures thereof in the presence of a fluidized bed of catalyst, in which the liquid is introduced into the reactor through at least one inlet located within the fluidization zone and the gaseous reactant is introduced into the reactor through at least one inlet located within the fluidization zone adjacent the support means.