Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.

Abstract: A curable resin comprising a compound having the structure (I): wherein each carbon 2, together with either its carbon 1 or carbon 3, arc members of a fused cycloaliphatic ring, and when carbon 1 is a member of the ring so is N, and wherein each of the aliphatic or aromatic ring-member carbons may either be members of further fused cycloaliphatic rings or be bonded to a group selected from H or linear or branched C1 to C5 alkyl.

Abstract: The invention relates to a resin curing agent having the formula (I), wherein R1 to R4 are each individually selected from linear or branched C1 to C5 alkyl, a process for its manufacture, blends of the reaction products, and two-component curable resin systems.

Abstract: A curable prepreg comprising a structural layer of conductive fibres and a first outer layer of thermosetting resin, the resin layer comprising thermoplastic particles and glassy carbon particles provides improved electrical conductivity and excellent mechanical properties.

Abstract: A curable laminate vehicle body shell component (10) comprising thermosetting resin, at least three fibre structural layers (12, 16) and at least one damping layer (14), wherein the ratio of the number of structural layers (12, 16) to damping layers (14) is at least 3:1 and such that, when cured by exposure to an elevated temperature, the component (10) becomes a rigid body shell is provided.

Abstract: A resin material is provided which comprises at least one thermoset resin, carbon conductive additive material, and at least one thermoplastic polymer resin. The thermoplastic polymer resin dissolves in the thermoset polymer resin and phase separates upon cure. There is also provided a method of making the resin material, and additionally a composite material that comprising said resin material in combination with a fibrous reinforcement. The resin material and composite material may each be used in an uncured or cured form, and may find particular use as a prepreg material.

Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.

Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Abstract: A composite material, the composite material comprising a prepreg, said prepreg comprising at least one polymeric resin and at least one conductive fibrous reinforcement, electrically conducting particles dispersed in the polymeric resin and a top layer of a metal-coated carbon fibre comprising a further resin component, wherein the metal comprises one or more metals selected from nickel, copper, gold, platinum, palladium, indium and silver.

Abstract: The invention provides a prepreg comprising matrix and fibres, having deposited thereon a plurality of regions raised at least 5 micrometres relative to the surface of the matrix, a method of preparing such a prepreg, a method of curing a laminate of a plurality of such preprags and the cured laminate produced by such a method.

Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Abstract: A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.

Abstract: An uncured assembly which comprises a fibrous reinforcement. Associated with said reinforcement is a resin material comprising at least one solid amine-terminated epoxy resin, at least one solid epoxy-terminated epoxy resin and optionally at least one cure catalyst.

Abstract: A resin composition comprising: (i) one or more polymerisable liquid thermoset resin components; (ii) optionally one or more curing agents for said one or more polymerisable liquid resin components; and (iii) at least one gelator, wherein said gelator interacts within said composition to form a gel at ambient temperatures, said gel being thermally reversible such that the gelled composition can undergo a transition from the gelled state to a state of lower viscosity when the composition is treated to facilitate the cure of said polymerisable resin component.

Abstract: A resin composition comprising: (i) one or more polymerisable liquid thermoset resin components; (ii) optionally one or more curing agents for said one or more polymerisable liquid resin components; and (iii) at least one gelator, wherein said gelator interacts within said composition to form a gel at ambient temperatures, said gel being thermally reversible such that the gelled composition can undergo a transition from the gelled state to a state of lower viscosity when the composition is treated to facilitate the cure of said polymerisable resin component.

Abstract: An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.

Abstract: Uncured composite materials (prepreg) are provided that are stable at room temperature over relatively long periods of time. The prepreg includes a solid epoxy resin matrix composed of a crystalline epoxy resin and a solid curing agent. The curing agent is preferably crystalline. The prepreg may include one or more property enhancement layers that increase the tackiness of the prepreg, increase the flexibility of the prepreg and/or reduce the amount of solid resin matrix that flakes from the prepreg during handling.

Abstract: Uncured composite materials (prepreg) are provided that are stable at room temperature over relatively long periods of time. The prepreg includes a solid epoxy resin matrix composed of a crystalline epoxy resin and a solid curing agent. The curing agent is preferably crystalline. The prepreg may include one or more property enhancement layers that increase the tackiness of the prepreg, increase the flexibility of the prepreg and/or reduce the amount of solid resin matrix that flakes from the prepreg during handling.