Abstract: The present disclosure relates, in general, to methods of treating or preventing hypoglycemia using a negative modulator antibody fragment that binds to the insulin receptor and modulates the action of insulin at the insulin receptor.

Abstract: The present invention provides polypeptide binding agents, e.g. antibodies, that exhibit the ability to kinetically modulate the binding and signaling of biological signaling complexes, e.g., receptor-ligand complexes; methods of identifying such polypeptide binding agents, methods of making such polypeptide binding agents, compositions comprising such polypeptide binding agents, and methods of using such polypeptide binding agents.

Abstract: Antibodies that modulate insulin receptor signaling are provided.

Abstract: The present invention provides polypeptide binding agents, e.g. antibodies, that exhibit the ability to kinetically modulate the binding and signaling of biological signaling complexes, e.g., receptor-ligand complexes; methods of identifying such polypeptide binding agents, methods of making such polypeptide binding agents, compositions comprising such polypeptide binding agents, and methods of using such polypeptide binding agents.

Abstract: Antibodies that modulate insulin receptor signaling are provided.

Abstract: The present invention provides novel anti-HIV antibodies with improved therapeutic properties, related pharmaceutical compositions, and methods of use thereof.

Abstract: The present disclosure relates, in general, to methods of treating or preventing hypoglycemia using a negative modulator antibody fragment that binds to the insulin receptor and modulates the action of insulin at the insulin receptor.

Abstract: Antibodies that modulate insulin receptor signaling are provided.

Abstract: Antibodies that modulate insulin receptor signaling are provided.

Abstract: Antibodies that modulate insulin receptor signaling are provided.

Abstract: A banding device includes a frame. A feeding assembly is mounted on the frame for feeding elastic tubing into the frame. A transfer assembly disposed within the frame includes transfer arm and fingers. The fingers receive the rubber tubing as fed. A cutting assembly is disposed between the transfer assembly and the feeding assembly for cutting the tubing into bands. The fingers of the transfer assembly move between a first closed position for receiving the band and a second open position for opening the band. The transfer arm is moveable between a first position for receiving the band and a second position for transferring the band. A banding assembly disposed at the second position receives the band from the transfer assembly. The banding assembly stretches the band and receives an item to be bundled within the band. The banding assembly releases the band about the bundle.

Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.

Abstract: A banding device includes a frame. A feeding assembly is mounted on the frame for feeding elastic tubing into the frame. A transfer assembly disposed within the frame includes transfer arm and fingers. The fingers receive the rubber tubing as fed. A cutting assembly is disposed between the transfer assembly and the feeding assembly for cutting the tubing into bands. The fingers of the transfer assembly move between a first closed position for receiving the band and a second open position for opening the band. The transfer arm is moveable between a first position for receiving the band and a second position for transferring the band. A banding assembly disposed at the second position receives the band from the transfer assembly. The banding assembly stretches the band and receives an item to be bundled within the band. The banding assembly releases the band about the bundle.

Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.

Abstract: The present invention provides polypeptide binding agents, e.g. antibodies, that exhibit the ability to kinetically modulate the binding and signaling of biological signaling complexes, e.g., receptor-ligand complexes; methods of identifying such polypeptide binding agents, methods of making such polypeptide binding agents, compositions comprising such polypeptide binding agents, and methods of using such polypeptide binding agents.

Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.

Abstract: Antibodies that modulate insulin receptor signaling are provided.

Abstract: Methods for generating supports (30) for parts (50) produced by solid freeform fabrication (“SFF”) are disclosed. The method includes defining a plurality of layers (L) that make up the part, and for each layer, determining those regions (R) that require support. The method also includes merging the regions for the different layers (L) into one or more common regions that require support, and providing at least one support for each of the one or more common regions. The result is that fewer supports are used as compared to conventional SFF fabrication methods.

Abstract: A load frame has an open region exposing a surface of an electronic component. A heat sink is disposed on the load frame and has a surface in thermal contact with the surface of the electronic component. A non-influencing fastener is disposed within a bore in the heat sink and threaded into the load frame for securing the heat sink to the load frame. The non-influencing fastener includes a screw with a head; a tapered ring disposed below the head of the screw and having a tapered lower peripheral surface; a sealing ring engaging the tapered lower peripheral surface of the tapered ring; and a load washer disposed between the sealing ring and the load frame. Compression of the rings by turning of the screw into the load frame causes the sealing ring to expand against the bore of the heatsink. Preferably, the sealing ring has a curved outer surface.

Abstract: Improved methods, systems, and apparatuses are disclosed for testing LGA devices. One example embodiment include vertical routing of test nest assembly cooling lines in order to minimize the test nest footprint and increase available test sites on a single test card. Another example embodiment includes isolating and adjusting external loads and moments into the heatsink/cold plate, wherein these loads and moments involve controlling the centroid to restore more ideal thermal performance of the heatsink/chip interface. Still another example embodiment includes a nest architecture facilitating easy and low-cost replacement of LGA sockets. Finally, another example embodiment includes efficient condensation control of test nest assembly parts by using dry-air exhaust.