Abstract: A tongue grasping and restraining device holds the tongue securely during sleep in order to minimize the risk of the tongue slipping back and blocking the throat. Plural tongue gripping projections are coupled to upper and lower supports. One or more of the upper and lower supports are biased together into a tongue engaging position. A tongue depressor can extend rearwardly and downwardly from the upper support to depress the user's tongue to further open the user's airway. The position of the tongue depressor can be adjustable. The upper support is coupled to the user's upper jaw, for example, to a denture, dental appliance or other form of an upper jaw coupler and can be pivoted thereto. The lower support can be hinged to, fixed to, or otherwise joined to a lower jaw coupler. A tube and rod mechanism can couple the jaw couplers together.

Abstract: Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns a fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

Abstract: This disclosure relates to compositions and methods for using such compositions to provide protective coatings, particularly of electronic components. Fired-on-foil ceramic capacitors coated with a polybenzoxazole encapsulant which may be embedded in printed wiring boards are disclosed.

Abstract: This invention relates to compositions, and the use of such compositions for protective coatings, particularly of electronic devices. The invention concerns fired-on-foil ceramic capacitors coated with a composite encapsulant and embedded in a printed wiring board.

Abstract: Compositions useful in circuitry substrates are described which have a polyimide component, and a sterically hindered hydrophobic epoxy component. Generally, a flowable precursor is applied and then cured to a wholly or partially solidified mass. The invention is also directed to methods of forming a passive electrical component upon or into a circuit board.

Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

Abstract: The invention relates generally to methods for creating circuitry components from binder materials having a hydrophobic phenolic component and a hydrophobic epoxy component. The phenolic/epoxy based liquids, solutions, suspensions and/or pastes can generally be screen printed or otherwise formed on an electronic substrate, pattern or device, to provide an electronic component having low water sorption properties.

Abstract: Water absorption resistant polyimide pastes (or solutions), are particularly useful to make electronic screen printable pastes and the electronic components made from these pastes. A group of soluble polyimides and their solvents were discovered to be particularly resistant to moisture absorption. These polyimide solutions optionally contain polyimides also containing cross-linkable monomers and/or thermal cross-linking agents. In addition, these polyimide pastes may optionally contain adhesion promoting agents, blocked isocyanates, metals, metal oxides, and other inorganic fillers. The polyimide pastes (or solutions) of the present invention have a polyimide with a glass transition temperature greater than 250° C., have a water absorption factor of less than 2%, and a have a positive solubility measurement.

Abstract: Disclosed is an organic encapsulant composition that, when applied to formed-on-foil ceramic capacitors and embedded inside printed wiring boards, allows the capacitor to resist printed wiring board chemicals and survive accelerated life testing conducted under high humidity, elevated temperature and applied DC bias.

Abstract: Disclosed area compositions comprising: a polyimide resin with a water absorption of 2% or less and, optionally, one or more of an electrically insulated filler, a defoamer and a colorant and one or more organic solvents. The compositions are useful as encapsulants and have a consolidation temperature of 190° C. or less.

Abstract: A device is disclosed for applying and holding a dental matrix strip against the side of a tooth which is to be filled. An embodiment of the device comprises a split ring that slidably receives a matrix. The split ring in this embodiment can have cushions on its ends sized to resist passage through matrix apertures following insertion of such cushions through these apertures when these components are slidably coupled together. This embodiment can also comprise respective matrix slots that receive portions of the split ring to at least partially conform the shape of the matrix to the shape of the split ring.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4?-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: Tooth inserts are described for use in restoring teeth having a proximal surface requiring restoration and an, intact proximal surface not requiring restoration. A tooth insert according to one disclosed embodiment comprises an elongated band having first and second spaced apart central portions. The central portions are positioned so that when the band is wrapped around a first tooth, the first central portion is positioned between the prepared surface of the first tooth and a second adjacent tooth and the second central portion is positioned between the intact surface of the first tooth and a third tooth at the opposite side of the first tooth from the second tooth. An aperture is formed in the second central portion to permit at least partial interproximal contact between the first and third tooth through the aperture to minimize separation between the first and third teeth caused by the thickness of the band.

Abstract: The invention provides a polyimide film manufactured from a polyamic acid prepared from pyromellitic dianhydride in combination with 10 to 60 mol % of phenylenediamine and 40 to 90 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: A tooth spacer has first and second tooth spacer body portions which each define at least one window therein. Extremely thin film, for example from about 0.0003 to about 0.0006 inch in thickness, is sandwiched between the tooth spacer body portions to form the tooth spacer. Portions of the gingival edge of the tooth spacer may be thinned to facilitate insertion of the tooth spacer between teeth.

Abstract: A flexible frame supports and at least partially surrounds a thin polymer sheet. The frame and polymer sheet is positioned between a tooth being filled and an adjacent tooth so as to extend partly or completely around the buccal and lingual sides of the tooth being filled. The frame may be severable to facilitate removal of the frame and apparatus following the completion of a filling. A mechanism may be included for tightening the gingival border of the frame to more closely follow the natural tooth contour. A mechanism may also be included for tightening the occlusal border of the frame with such tightening mechanisms being independently operated. The frame may be secured to a tooth being treated such as utilizing adhesive tabs.

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.