Patents by Inventor John D. Weld
John D. Weld has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10304615Abstract: A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.Type: GrantFiled: March 20, 2014Date of Patent: May 28, 2019Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 9673135Abstract: A semiconductor device having substantially minor-symmetric terminals and methods of forming the same. In one embodiment, the semiconductor device includes a semiconductor switch having a control node and a switched node, the switched node being coupled to first and second output terminals of the semiconductor device, the first and second output terminals being positioned in a substantially minor-symmetric arrangement on the semiconductor device. The semiconductor device also includes a control element having first and second input nodes and an output node, the first and second input nodes being coupled to first and second input terminals, respectively, of the semiconductor device and the output node being coupled to the control node of the semiconductor switch, the first and second input terminals being substantially center-positioned on the semiconductor device.Type: GrantFiled: January 13, 2014Date of Patent: June 6, 2017Assignee: Altera CorporationInventors: John D. Weld, Douglas Dean Lopata, Wei Zhang
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Patent number: 9553081Abstract: A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor (“LDMOS”) cells. The semiconductor device also includes a redistribution layer electrically coupled to the plurality of LDMOS cells and a plurality of metallic pillars distributed over and electrically coupled to the redistribution layer.Type: GrantFiled: November 27, 2013Date of Patent: January 24, 2017Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Patent number: 9443839Abstract: A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor (“LDMOS”) cells, and a metallic layer electrically coupled to the plurality of LDMOS cells. The semiconductor device also includes a plurality of gate drivers positioned along a periphery of the semiconductor die and electrically coupled to gates of the plurality of LDMOS cells through the metallic layer.Type: GrantFiled: November 27, 2013Date of Patent: September 13, 2016Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Patent number: 9299691Abstract: A semiconductor device and method of forming the same including, in one embodiment, a substrate and a plurality of source and drain regions formed as alternating pattern on the substrate. The semiconductor device also includes a plurality of gates formed over the substrate between and parallel to ones of the plurality of source and drain regions. The semiconductor device also includes a first plurality of alternating source and drain metallic strips formed in a first metallic layer above the substrate and parallel to and forming an electrical contact with respective ones of the plurality of source and drain regions.Type: GrantFiled: November 27, 2013Date of Patent: March 29, 2016Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Publication number: 20150200155Abstract: A semiconductor device having substantially minor-symmetric terminals and methods of forming the same. In one embodiment, the semiconductor device includes a semiconductor switch having a control node and a switched node, the switched node being coupled to first and second output terminals of the semiconductor device, the first and second output terminals being positioned in a substantially minor-symmetric arrangement on the semiconductor device. The semiconductor device also includes a control element having first and second input nodes and an output node, the first and second input nodes being coupled to first and second input terminals, respectively, of the semiconductor device and the output node being coupled to the control node of the semiconductor switch, the first and second input terminals being substantially center-positioned on the semiconductor device.Type: ApplicationFiled: January 13, 2014Publication date: July 16, 2015Applicant: Altera CorporationInventors: John D. Weld, Douglas Dean Lopata, Wei Zhang
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Publication number: 20150200156Abstract: A module having substantially mirror-symmetric terminals and methods of forming the same. In one embodiment, the module has first and second module terminals and includes a first semiconductor device with first and second terminals in a substantially mirror-symmetric arrangement on the first semiconductor device and coupled to a first common node of the first semiconductor device. The module also includes a second semiconductor device including third and fourth terminals in a substantially mirror-symmetric arrangement on the second semiconductor device and coupled to a second common node of the second semiconductor device. At least one of the first and second terminals is coupled to the first module terminal, and at least one of the third and fourth terminals are coupled to the second module terminal. The first and second module terminals are in a substantially mirror-symmetric arrangement on the module.Type: ApplicationFiled: January 13, 2014Publication date: July 16, 2015Applicant: ALTERA CORPORATIONInventors: John D. Weld, Douglas Dean Lopata, Wei Zhang
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Publication number: 20140203903Abstract: A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.Type: ApplicationFiled: March 20, 2014Publication date: July 24, 2014Applicant: ENPIRION, INC.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Publication number: 20140159130Abstract: An apparatus and method of forming the same including, in one embodiment, a printed circuit board and a semiconductor device coupled to the printed circuit board. The apparatus also includes a decoupling device coupled to the printed circuit board and positioned under the semiconductor device.Type: ApplicationFiled: November 27, 2013Publication date: June 12, 2014Applicant: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Publication number: 20140151794Abstract: A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor (“LDMOS”) cells. The semiconductor device also includes a redistribution layer electrically coupled to the plurality of LDMOS cells and a plurality of metallic pillars distributed over and electrically coupled to the redistribution layer.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Publication number: 20140151797Abstract: A semiconductor device and method of forming the same including, in one embodiment, a substrate and a plurality of source and drain regions formed as alternating pattern on the substrate. The semiconductor device also includes a plurality of gates formed over the substrate between and parallel to ones of the plurality of source and drain regions. The semiconductor device also includes a first plurality of alternating source and drain metallic strips formed in a first metallic layer above the substrate and parallel to and forming an electrical contact with respective ones of the plurality of source and drain regions.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Publication number: 20140151795Abstract: A semiconductor device and method of forming the same including, in one embodiment, a semiconductor die formed with a plurality of laterally diffused metal oxide semiconductor (“LDMOS”) cells, and a metallic layer electrically coupled to the plurality of LDMOS cells. The semiconductor device also includes a plurality of gate drivers positioned along a periphery of the semiconductor die and electrically coupled to gates of the plurality of LDMOS cells through the metallic layer.Type: ApplicationFiled: November 27, 2013Publication date: June 5, 2014Applicant: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Jeffrey Demski, Anatoly Feygenson, Douglas Dean Lopata, Jay Norton, John D. Weld
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Patent number: 8701272Abstract: A method of forming a power module located on a conductive substrate by providing power conversion circuitry. The method of providing the power conversion circuitry includes forming a magnetic device by placing a magnetic core proximate a conductive substrate with a surface thereof facing a conductive substrate, and placing a conductive clip proximate a surface of the magnetic core. The method of forming the magnetic device also includes electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The method of providing the power conversion circuitry also includes providing at least one switch on the conductive substrate. The method of forming the power module also includes depositing an encapsulant about the power conversion circuitry.Type: GrantFiled: October 5, 2005Date of Patent: April 22, 2014Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 8631560Abstract: A method of forming a magnetic device by providing a conductive substrate and placing a magnetic core proximate the conductive substrate with a surface thereof facing the conductive substrate. The method also includes placing a conductive clip proximate a surface of the magnetic core and electrically coupling ends of the conductive clip to the conductive substrate to cooperatively form a winding therewith about the magnetic core.Type: GrantFiled: October 5, 2005Date of Patent: January 21, 2014Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 8528190Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure with a baffle over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber and the baffle directs the encapsulant away from the magnetic core thereby limiting an amount of the encapsulant that contacts the magnetic core within the chamber.Type: GrantFiled: August 21, 2008Date of Patent: September 10, 2013Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew Wilkowski, John D. Weld
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Patent number: 8384506Abstract: A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.Type: GrantFiled: March 25, 2010Date of Patent: February 26, 2013Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 8139362Abstract: A power module located on a conductive substrate including power conversion circuitry. The power conversion circuitry includes a magnetic device and at least one switch. The magnetic device includes a magnetic core having a surface facing the conductive substrate and a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core. The power module also includes an encapsulant about the power conversion circuitry.Type: GrantFiled: October 5, 2005Date of Patent: March 20, 2012Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 8043544Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.Type: GrantFiled: November 12, 2008Date of Patent: October 25, 2011Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew Wilkowski, John D. Weld
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Publication number: 20100176905Abstract: A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.Type: ApplicationFiled: March 25, 2010Publication date: July 15, 2010Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld
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Patent number: 7688172Abstract: A magnetic device that includes a magnetic core having a surface facing a conductive substrate. The magnetic device also includes a conductive clip facing a surface of the magnetic core with ends of the conductive clip electrically coupled to the conductive substrate to cooperatively form a winding therewith about the magnetic core.Type: GrantFiled: October 5, 2005Date of Patent: March 30, 2010Assignee: Enpirion, Inc.Inventors: Ashraf W. Lotfi, Mathew A. Wilkowski, Trifon M. Liakopoulos, John D. Weld