Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

Abstract: A method of manufacturing an encapsulated package for a magnetic device on a substrate. In one embodiment, the method includes providing a magnetic core on the substrate and placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about a portion of the magnetic core within the chamber. The shielding structure limits the encapsulant entering the chamber.

Abstract: A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

Abstract: An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device also includes a shielding structure located about the magnetic core configured to create a chamber thereabout. The shielding structure is configured to limit an encapsulant entering the chamber.

Abstract: A power module located on a substrate. In one embodiment, the power module includes power conversion circuitry with a magnetic device and at least one switch. The magnetic device includes a magnetic core with a shielding structure located about the magnetic core configured to create a chamber thereabout. The power module also includes an encapsulant about the power conversion circuitry. The shielding structure is configured to limit the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

Abstract: An encapsulatable package for a magnetic device that includes a magnetic core. In one embodiment, the encapsulatable package for the magnetic device includes a shielding structure located about the magnetic core configured to create a chamber thereabout and configured to limit an encapsulant entering the chamber. The encapsulatable package for the magnetic device also includes a baffle within the chamber configured to direct the encapsulant away from the magnetic core.

Abstract: An optical switch has an array of fibers, an optional lens, and a mirror with two-dimensional tilt adjustment. Light from the array passes through the lens, is reflected by the mirror, and passes again through the lens back towards the array. The input/output fibers are arranged in a two-dimensional pattern designed to avoid undesirable crosstalk between fibers. The pattern may include a plurality of fibers positioned around a central fiber in a circular arrangement. For a 1×8 or 8×1 switch, nine fibers are preferably positioned in a circle around the central fiber, thereby providing geometry that substantially avoids undesirable crosstalk between fibers in the array. In another implementation, the fiber array is implemented using a tapered ferrule housing a central fiber, surrounded by an intermediate layer of six fibers, surrounded by an outer layer of twelve fibers.

Abstract: An apparatus for wavelength multiplexing optical signals, wherein the apparatus includes at least one optically conductive sleeve, at least one collimating lens positioned to receive a optical signal from the at least one sleeve, and at least one dichroic splitter positioned to receive the optical signal from the at least one collimating lens. A filter may further be positioned to receive the optical signal from the at least one dichroic splitter in order to further filter the optical signal. The apparatus for wavelength multiplexing is configured to provide optical isolation of at least 75 dB via the combination of the at least one dichroic splitter and filter elements.

Abstract: An optical switch has an array of fibers, an optional lens, and a mirror with two-dimensional tilt adjustment. Light from the array passes through the lens, is reflected by the mirror, and passes again through the lens back towards the array. The input/output fibers are arranged in a two-dimensional pattern designed to avoid undesirable crosstalk between fibers. The pattern may include a plurality of fibers positioned around a central fiber in a circular arrangement. For a 1×8 or 8×1 switch, nine fibers are preferably positioned in a circle around the central fiber, thereby providing geometry that substantially avoids undesirable crosstalk between fibers in the array. In another implementation, the fiber array is implemented using a tapered ferrule housing a central fiber, surrounded by an intermediate layer of six fibers, surrounded by an outer layer of twelve fibers.

Abstract: An apparatus for wavelength multiplexing optical signals, wherein the apparatus includes at least one optically conductive sleeve, at least one collimating lens positioned to receive a optical signal from the at least one sleeve, and at least one dichroic splitter positioned to receive the optical signal from the at least one collimating lens. A filter may further be positioned to receive the optical signal from the at least one dichroic splitter in order to further filter the optical signal. The apparatus for wavelength multiplexing is configured to provide optical isolation of at least 75 dB via the combination of the at least one dichroic splitter and filter elements.

Abstract: The present invention provides a lead frame for use in packaging a circuit having a discrete component, and a method of manufacture thereof. In one embodiment, the lead frame includes a lead support structure and a plurality of severable leads that are coupled to the lead support structure. The plurality of severable leads extend inward from the lead support structure to predetermined locations corresponding to terminals of the discrete component.

Abstract: A temperature compensating device for optical fiber gratings includes first and second expansion members having different coefficients of thermal expansion. The expansion members are elongated in a direction parallel to the fiber grating and levers are secured to both ends of the expansion members. Each lever has a first end flexibly secured to a respective end of the first expansion member and a middle portion flexibly secured to a respective end of the second expansion member. The other end of each lever is secured to a respective end of the fiber grating. The expansion members, the levers and the fiber grating all lie substantially in a single plane. There is also disclosed a package for holding four of the temperature compensating devices in two rows of two devices each, with their fiber gratings adjacent each other so that when viewed in a plane orthogonally to the longitudinal axes of the fiber gratings, the fiber gratings are each at a respective corner of a rectangle.

Abstract: An article comprising a molded circuit for providing a path for electrical current is disclosed. The molded circuit is formed of a first material layer and a second material layer. The first material layer is an electrically insulating material. The second material layer is an electrically conductive material. In an alternate embodiment, the second material layer is surrounded between two layers of the first material layer. The molded circuit can be formed using multi-material injection molding such as co-injection molding or two-shot injection molding. A printed circuit board can comprise the molded circuit.

Abstract: A system for, and method of, empirically determining stress in a molded package and a power module embodying the system or the method. In one embodiment, the system includes: (1) a sensor, having a magnetic core exhibiting a known complex permeability in a control environment, that is embedded within the molded package and therefore subject to the stress and (2) a measurement circuit, coupled to the sensor, that applies a drive signal to the sensor, measures a response signal received from the sensor and uses the drive signal and the response signal to determine a complex permeability under stress of the core. The magnitude of the stress can then be determined from the core's complex permeability under stress.

Abstract: A system for, and method of, empirically determining stress in a molded package and a power module embodying the system or the method. In one embodiment, the system includes: (1) a sensor, having a magnetic core exhibiting a known complex permeability in a control environment, that is embedded within the molded package and therefore subject to the stress and (2) a measurement circuit, coupled to the sensor, that applies a drive signal to the sensor, measures a response signal received from the sensor and uses the drive signal and the response signal to determine a complex permeability under stress of the core. The magnitude of the stress can then be determined from the core's complex permeability under stress.

Abstract: In accordance with the invention, electronic packages comprising a layer of molded plastic on one side of an insulating substrate are provided with a surrogate layer on the side of the substrate opposite the molded plastic to reduce bending stress. The surrogate layer is preferably thin, has a high coefficient of thermal expansion and is resistant to high tensile stress. Advantageously, the surrogate layer is processed concurrently with the molding of the plastic. Preferred surrogate layers are low temperature thermoplastic sheets, such as acetal plastic sheets, that soften at the molding temperature sufficiently to bond to the substrate. Alternatively, they can be higher temperature rigid materials, such as glass fiber composites, bonded to the substrate with an adhesive layer that cures during molding.

Abstract: Electronic devices include at least two electronic components in electrical contact by connector means, the components being at least partially encased by a molded resin. Preferably, the connector means is a compression connector and the molded resin maintains a compressive force on the connector to ensure that reliable contact is maintained.

Abstract: Reservoir cavities have been used successfully to achieve proper mold filling of large area substrate packages with severe leading and lagging of flow fronts in the cavity halves, The additional plastic required to fill the reservoir cavities and the additional work in removing the reservoir culls is minimal, Reservoir cavities have been shown to eliminate void problems in molded packages with large printed wiring board substrates,