Patents by Inventor John F. Breedis
John F. Breedis has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 5370840Abstract: There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity.Type: GrantFiled: October 18, 1993Date of Patent: December 6, 1994Assignee: Olin CorporationInventors: Ronald N. Caron, John F. Breedis
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Patent number: 5306465Abstract: There is disclosed a copper base alloy which contains specified additions of chromium, zirconium, cobalt and/or iron, and titanium as well as methods for the processing of the copper alloy. One method of processing results in a copper alloy having high strength and high electrical conductivity. A second method of processing results in a copper alloy with even higher strength and a minimal reduction in electrical conductivity.Type: GrantFiled: November 4, 1992Date of Patent: April 26, 1994Assignee: Olin CorporationInventors: Ronald N. Caron, John F. Breedis
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Patent number: 5288458Abstract: Machinable alpha beta brass having a reduced lead concentration is claimed. The alloy contains bismuth to improve machinability. Either a portion of the zinc is replaced with aluminum, silicon or tin, or a portion of the copper is replaced with iron, nickel or manganese.Type: GrantFiled: July 1, 1992Date of Patent: February 22, 1994Assignee: Olin CorporationInventors: David D. McDevitt, Jacob Crane, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh
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Patent number: 5209787Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.Type: GrantFiled: December 23, 1991Date of Patent: May 11, 1993Assignee: Olin CorporationInventors: John F. Breedis, George J. Muench
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Patent number: 5137685Abstract: Machinable copper alloys having a reduced lead concentration are disclosed. An additive to the alloy accumulates both at the grain boundaries and intragranularly. The additive facilitates chip fracture or lubricates the tool. One additive is a mixture of bismuth and lead with the lead concentration below about 2% by weight.Type: GrantFiled: March 1, 1991Date of Patent: August 11, 1992Assignee: Olin CorporationInventors: David D. McDevitt, Jacob Crane, John F. Breedis, Ronald N. Caron, Frank N. Mandigo, Joseph Saleh
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Patent number: 5096508Abstract: A composite copper alloy having a modified surface is provided. An element or combination of elements both soluble in copper and reactive with nitrogen are cast with copper or a copper alloy forming a solid state solution. The alloy is reacted with a nitride former to modify the surface. A continuous surface film is formed by heating in a nitrogen containing gas. A dispersion of nitride precipitate in a copper matrix is formed by implanting nitrogen ions.Type: GrantFiled: July 27, 1990Date of Patent: March 17, 1992Assignee: Olin CorporationInventors: John F. Breedis, George J. Muench, Deepak Mahulikar
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Patent number: 5074933Abstract: The invention provides a process for the manufacture of copper alloys having improved processability. The alloys are melted and atomized into droplets which are spray cast into a coherent deposit. The spray cast alloys are characterized by a finer dispersion of intermetallic than is possible by conventional casting. The alloys are capable of being cold rolled to a reduction of up to 70%. The spray cast alloys exhibit good electrical conductivity and a high yield strength. They are particularly suited for electrical spring contacts.Type: GrantFiled: July 25, 1989Date of Patent: December 24, 1991Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4905074Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermediate compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.Type: GrantFiled: November 24, 1986Date of Patent: February 27, 1990Assignee: Olin CorporationInventors: Chung-Yao Chao, John F. Breedis
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Patent number: 4816216Abstract: The present invention relates to an iron-nickel alloy containing from about 30% to about 60% nickel, from about 0.001% to about 0.15% nitrogen, at least one element selected from the group consisting of from about 1% to about 10% molybdenum and from about 0.001% to about 2% aluminum and the balance essentially iron. The alloys demonstrate improved resistance to intermetallic compound formation, improved glass to metal sealing properties, and improved wirebonding performance. The alloys of the present invention have particular utility as a lead frame material for semiconductor packages.Type: GrantFiled: November 29, 1985Date of Patent: March 28, 1989Assignee: Olin CorporationInventors: Chung-Yao Chao, John F. Breedis
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Patent number: 4728372Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bend formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.Type: GrantFiled: December 30, 1985Date of Patent: March 1, 1988Assignee: Olin CorporationInventors: Ronald N. Caron, John F. Breedis
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Patent number: 4674671Abstract: The present invention relates to a thermosonic wire bonding technique for forming high quality wire interconnections in semiconductor devices. The technique includes using palladium or palladium alloy lead wires to form the wire interconnections between the components of a semiconductor device. The technique also includes forming a protective atmosphere about the palladium lead wire during a portion of the bonding process and controlling the stage temperatures used during the bonding process.Type: GrantFiled: November 4, 1985Date of Patent: June 23, 1987Assignee: Olin CorporationInventors: Julius C. Fister, John F. Breedis
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Patent number: 4661178Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.Type: GrantFiled: June 28, 1985Date of Patent: April 28, 1987Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4649083Abstract: The process of forming a composite with an alloy having an alloy component of about 0.5 to 12% aluminum and a matrix selected from a material of the group consisting of copper, iron or nickel. The alloy is heated in an oxygen-rich atmosphere to form a material oxide-rich layer on a surface of the alloy. The alloy is then heated in a reducing atmosphere to reduce the material oxide-rich layer to form an aluminum oxide on the surface of the alloy and a material-rich layer on the aluminum oxide layer.Type: GrantFiled: September 19, 1984Date of Patent: March 10, 1987Assignee: Olin CorporationInventors: Julius C. Fister, John F. Breedis
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Patent number: 4642146Abstract: A copper base alloy capable of forming a microstructure comprising a plurality of discrete particles in a surrounding metal matrix having a lower melting point than the particles. The alloy consists essentially of from about 3% to about 6% nickel, from about 2% to about 4.25% aluminum, from about 0.25% to about 1.2% silicon, from about 5% to about 15% zinc, up to about 5% iron and the balance essentially copper. When iron is included in an amount from about 3% to about 5% and zinc is restricted to a range of from about 8% to about 10%, the alloy is capable of forming the desired structure in the as-cast condition using a process which does not include stirring during casting.Type: GrantFiled: October 11, 1985Date of Patent: February 10, 1987Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4605532Abstract: A copper base alloy having an improved combination of conductivity and strength for applications such as lead frames or electrical connectors. The alloys consists essentially of from about 0.3 to 1.6% by weight iron, with up to one-half the iron content being replaced by nickel, manganese, cobalt, and mixtures thereof; from about 0.01 to about 0.20% by weight magnesium; from about 0.10 to about 0.40% by weight phosphorus; up to about 0.5% by weight tin or antimony and mixtures thereof; and the balance copper. The phosphorus to magnesium ratio and phosphorus to the total content of phosphide formers ratio are maintained within critical limits.Type: GrantFiled: June 3, 1985Date of Patent: August 12, 1986Assignee: Olin CorporationInventors: David B. Knorr, John F. Breedis
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Patent number: 4594221Abstract: A multipurpose copper base alloy having an improved combination of ultimate tensile strength and electrical conductivity. The alloy can be tailored for applications such as in connectors or leadframes by processing. The alloy may be processed to provide improved bead formability at some sacrifice in strength. The alloy in the stabilized condition shows surprising improvement in stress relaxation resistance. The alloy comprises a Cu-Ni-Si alloy to which about 0.05 to about 0.45% by weight magnesium is added.Type: GrantFiled: April 26, 1985Date of Patent: June 10, 1986Assignee: Olin CorporationInventors: Ronald N. Caron, John F. Breedis
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Patent number: 4585494Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.Type: GrantFiled: June 28, 1985Date of Patent: April 29, 1986Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4569702Abstract: A precipitation hardenable copper base alloy adapted for forming in the semi-solid slurry condition consists essentially of from about 5 to about 8% by weight nickel, from about 5 to about 7.5% by weight aluminum, from about 0.5 to about 1.25% by weight silicon and the balance essentially copper. The alloy has a microstructure comprising discrete particles contained in a lower melting point matrix. The alloy is particularly suited for forging into components such as cartridge cases.Type: GrantFiled: April 11, 1984Date of Patent: February 11, 1986Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4555272Abstract: A predominately beta phase copper base alloy which is adapted for forming in a semi-solid slurry condition. The alloy has a microstructure comprising discrete particles within a lower melting point matrix and consists essentially of from about 9% to about 10.5% by weight aluminum, at least about 10% by weight nickel and the balance essentially copper. In accordance with an alternative embodiment the nickel can be replaced on a one for one basis by iron within certain limits. The alloys are processed by chill casting with a cooling rate throughout the section of the casting comprising at least about 10.degree. C./sec. The alloys as-cast or when reheated to a semi-solid exhibit a microstructure suitable for press forging.Type: GrantFiled: April 11, 1984Date of Patent: November 26, 1985Assignee: Olin CorporationInventors: Sankaranarayanan Ashok, John F. Breedis
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Patent number: 4500605Abstract: The process of forming a composite with an alloy having an alloy component of about 0.5 to 12% aluminum and a matrix selected from a material of the group consisting of copper, iron or nickel. The alloy is heated in an oxygen-rich atmosphere to form a material oxide-rich layer on a surface of the alloy. The alloy is then heated in a reducing atmosphere to reduce the material oxide-rich layer to form an aluminum oxide on the surface of the alloy and a material-rich layer on the aluminum oxide layer.Type: GrantFiled: February 17, 1983Date of Patent: February 19, 1985Assignee: Olin CorporationInventors: Julius C. Fister, John F. Breedis