Abstract: A composite material having improved bond strength and a substantially smooth external surface comprises a deoxidized copper alloy core material and a copper-aluminum-silicon clad material. The composite is formed by rolling together the core and clad, preferably in an unheated condition, in a single pass with a reduction of about 50% to 75% to form a metallurgical bond between the core and clad and thereafter enhancing the bond strength by heating the bonded core and cladding to a temperature in the range of about 200.degree. C. to about 750.degree. C. for a time period of about 5 minutes to about 24 hours.

Abstract: Copper alloys are disclosed which may be bonded to aluminum containing members with reduced formation of undesirable copper-aluminum intermetallic compounds. The copper alloys consist essentially of about 15% to about 30% nickel and the balance essentially copper. The nickel addition in the alloys suppresses the nucleation rate and the subsequent growth rate of copper-aluminum intermetallic compounds. The copper alloys of the instant invention have particular utility in integrated circuit assemblies as lead frames, lead wires and beam lead tapes.

Abstract: A composite structure having improved solderability shelf life and contact resistance is formed by coating a copper alloy substrate material with a tin-containing material. The copper alloy substrate material consists essentially of about 15% to about 30% nickel and the balance essentially copper. The copper alloy may further include up to about 25% zinc. The nickel in the alloy retards the growth of copper-tin and/or copper-zinc-tin intermetallic compounds and the diffusion of the copper through the coating. The coating may be formed from tin or tin alloys including tin solders, e.g. 60% Tin-40% lead solder.

Abstract: An improved copper base alloy for use in electrical springs and a process of treating the alloy provide improved resistance to stress relaxation when the alloy is in a solution treated and aged condition having a discontinuous precipitate. The alloy consists essentially of from about 10% to about 15% nickel, from about 1% to about 3% aluminum, up to about 1% manganese, from about 0.05% to less than about 0.5% magnesium and the balance copper. The alloy is readily hot workable if held within a critical temperature range of from about 880.degree. C. to about 980.degree. C. prior to hot working.

Abstract: A composite material having improved bond strength and a substantially smooth external surface comprises a deoxidized copper alloy core material and a copper-aluminum-silicon clad material. The composite is formed by rolling together the core and clad, preferably in an unheated condition, in a single pass with a reduction of about 50% to 75% to form a metallurgical bond between the core and clad and thereafter enhancing the bond strength by heating the bonded core and cladding to a temperature in the range of about 200.degree. C. to about 750.degree. C. for a time period of about 5 minutes to about 24 hours.

Abstract: The disclosure teaches a high strength, high conductivity copper base alloy and method for obtaining same. The composition consists essentially of defined amounts of magnesium, phosphorus and a transition element selected from the group consisting of iron, cobalt, nickel and mixtures thereof with the balance essentially copper.

Abstract: A copper base alloy and process having high strength, high electrical conductivity and reduced quench sensitivity. The alloy consists essentially of from about 0.05 to 1.25% by weight chromium, from about 0.05 to 1.0% by weight zirconium, from about 0.01 to 0.15% by weight iron, and the balance essentially copper.

Abstract: A process and apparatus for forming an as-rolled composite metal panel comprised of at least two sheets of metal having a bond therebetween which can be broken by inflation to form a desired pattern of tubular passageways. The deformation of the sheets of metal during inflation is limited by a maximum aspect ratio. Inflation is provided using an inflation needle having a cross section which is a part or full oval. A fixture is provided for limiting the peeling apart of the composite metal panel upon insertion of the inflation needle.

Abstract: An alloy which exhibits superior resistance to softening at elevated temperatures while maintaining high strength properties is disclosed. This alloy includes from 0.005 to 0.2% by weight for each of niobium and zirconium in a copper base. Magnesium may also be added in amounts ranging up to 0.01% by weight.

Abstract: A particular aluminum base alloy system which utilizes gallium as an alloying element is described and is particularly useful as foil material in electrical capacitors. The addition of the small amount of gallium to the alloy system provides foil produced from the alloy with a significant increase in capacitance properties. A particular processing scheme for producing foil from this alloy system is also disclosed.

Abstract: Improved aluminum alloys are disclosed which are particularly useful as foil material in electrical capacitors. These alloys may contain either titanium in an aluminum base or a titanium and boron mixture in an aluminum base. The particular combination of titanium and boron presents a greater increase in capacitance in foil formed from this alloy than the increase in capacitance due to titanium or boron alone. Particular processing of such alloys is also disclosed.

Abstract: High strength extrudable and readily weldable aluminum base alloys are prepared comprising 0.9-1.5% magnesium, 0.4-0.8% silicon, and 0.9-1.5% copper, which may also include optional elements such as manganese, iron, and chromium, wherein the silicon content must not exceed the sum of 0.58 .times. magnesium content plus 0.25 .times. the manganese plus iron contents and the copper content must not exceed the sum of magnesium plus silicon contents. Such alloys display improved retention of strength properties after being subjected to welding conditions.

Abstract: Copper base alloys containing chromium, zirconium and niobium are disclosed as well as a process of heat treating and mechanically working said alloys. The combination of alloying elements, hot and cold working, annealing and aging steps increases both the strength and electrical conductivity properties of the alloy without excessive cold working.

Abstract: A process of heat treating and mechanically working chromium-containing precipitation hardenable copper base alloys is disclosed. The combination of hot and cold working, annealing and novel low temperature thermal treatment steps increases both the strength and electrical conductivity properties of the alloys without excessive cold working.

Abstract: Copper base alloys which exhibit a combination of high electrical conductivity and superior strength properties are presented. These alloys consist essentially of 0.08 to 1.0% by weight of titanium, 0.05 to 1.5% by weight of antimony, 0.1 to 1.0% by weight of chromium, balance copper. The desired properties are attained by the proper application of mechanical processing steps and thermal treatments.